초록 ▼

A coin bank includes a housing having a coin receiving area for receiving unsorted coins, a coin sorting area for sorting the unsorted coins and a coin storage area for storing sorted coins. The coin storage area includes a drawer slidably mounted in the housing and a coin tube support movably mount

A coin bank includes a housing having a coin receiving area for receiving unsorted coins, a coin sorting area for sorting the unsorted coins and a coin storage area for storing sorted coins. The coin storage area includes a drawer slidably mounted in the housing and a coin tube support movably mounted in the drawer between a first position, when the drawer is fully retracted into the housing and a second position, when the drawer is fully extended from the housing. A plurality of coin tubes is mounted in the coin tube support for holding sorted coins. The plurality of coin tubes is inclined in relation to a vertical axis for receiving sorted coins when the drawer is in a retracted position. A reservoir is located directly above each of the coin tubes for holding at least one additional coin above a stack of coins completely filling the coin tube.

대표청구항 ▼

A coin bank includes a housing having a coin receiving area for receiving unsorted coins, a coin sorting area for sorting the unsorted coins and a coin storage area for storing sorted coins. The coin storage area includes a drawer slidably mounted in the housing and a coin tube support movably mount

A coin bank includes a housing having a coin receiving area for receiving unsorted coins, a coin sorting area for sorting the unsorted coins and a coin storage area for storing sorted coins. The coin storage area includes a drawer slidably mounted in the housing and a coin tube support movably mounted in the drawer between a first position, when the drawer is fully retracted into the housing and a second position, when the drawer is fully extended from the housing. A plurality of coin tubes is mounted in the coin tube support for holding sorted coins. The plurality of coin tubes is inclined in relation to a vertical axis for receiving sorted coins when the drawer is in a retracted position. A reservoir is located directly above each of the coin tubes for holding at least one additional coin above a stack of coins completely filling the coin tube. rizing solution for a first period of time; and the second planarizing stage comprises planarizing the substrate assembly with the fresh planarizing solution for a second period of time. 4. The method of claim 3 wherein the metal cover layer comprises aluminum. 5. The method of claim 3 wherein the metal cover layer comprises tungsten. 6. The method of claim 3 wherein the metal cover layer comprises copper. 7. The method of claim 1 wherein the substrate assembly has a dielectric cover layer and the planarizing solution has abrasive particles, and wherein: the first planarizing stage comprises planarizing the substrate assembly with the initial volume of planarizing solution for a first period of time; and the second planarizing stage comprises planarizing the substrate assembly with the fresh planarizing solution for a second period of time. 8. The method of claim 1 wherein actively removing the used planarizing solution comprises sweeping at least a portion of the used planarizing fluid from the planarizing pad between the first and second planarizing stages. 9. A method of planarizing microelectronic-device substrate assembles in a web format machine, comprising: depositing an initial volume of fresh planarizing solution onto a planarizing surface of a stationary planarizing pad on the web format machine; performing a first planarizing stage; removing material from the substrate assembly by pressing the substrate assembly against the planarizing surface, holding the planarizing pad stationary, and moving the substrate assembly across the planarizing surface to remove material from the substrate to an intermediate point; performing a second planarizing stage by dispensing a subsequent volume of planarizing solution onto the pad and removing additional material from the substrate to a final endpoint; and actively removing planarizing solution deposited on the planarizing surface from the planarizing pad with a removing unit; wherein actively removing planarizing solution from the pad is performed between the first and second planarizing stages to remove the initial volume of planarizing solution used during the first planarizing stage. 10. A method of planarizing a microelectronic-device substrate assembly, comprising: performing a first planarizing stage of the substrate assembly by depositing an initial volume of planarizing solution onto the planarizing surface and initially moving the substrate across the planarizing surface while pressing the substrate assembly against the planarizing surface, at least a portion of the initial volume of planarizing solution becoming a used volume planarizing solution on the planarizing pad; stopping the first planarizing stage; exchanging at least a portion of the used volume of planarizing solution on the planarizing pad with fresh planarizing solution by actively removing used planarizing solution from an accumulation zone on the planarizing pad adjacent to a planarizing zone with an active removing unit other than solely the movement of the pad and depositing fresh planarizing solution in the planarizing zone; and performing a second planarizing stage of the substrate assembly after exchanging the used planarizing solution with the fresh planarizing solution. 11. The method of claim 10 wherein the substrate assembly has an aluminum cover layer and the planarizing solution has alumina abrasive particles, and wherein: the first planarizing stage comprises planarizing the substrate assembly with the initial volume of planarizing solution for approximately 100 seconds; and the second planarizing stage comprises planarizing the substrate assembly with the fresh planarizing solution for approximately 50 seconds. 12. A method of planarizing a microelectronic-device substrate assembly in a web format machine, comprising: removing material from a substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad on the web