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Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0746554 (2000-12-22)
발명자 / 주소
  • Prasher, Ravi
  • Watwe, Abhay A.
  • Chrysler, Gregory M.
  • Frutschy, Kristopher
  • Ofman, Leo
  • Sathe, Ajit V.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 21  인용 특허 : 28

초록

Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in tel

대표청구항

1. An assembly having an integrated heat sink and spreader for cooling an item, comprising: a microelectronic die to be cooled; a vapor chamber heat sink defined by a thinner first wall and a thicker second wall, the thicker second wall having a substantially uniform thickness and having a flat

이 특허에 인용된 특허 (28)

  1. Hindman George W., Apparatus and method for a mobile computer architecture and input/output management system.
  2. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  3. Gonsalves Daniel D. ; Antonuccio Robert S. ; Carney James M. ; Montagna Joseph J., Apparatus for dissipating heat from a circuit board having a multilevel surface.
  4. Villani Angelo (Shrewsbury MA), Clip-on heat sink.
  5. Remsburg Ralph ; Scholder Erica, Computer system with heat sink having an integrated grounding tab.
  6. Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.
  7. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  8. Gates William George,GBX, Electronic apparatus.
  9. Gates William George,GBX, Electronic apparatus.
  10. Johnson Philip A. (Exeter NH) McCarthy Alfred F. (Belmount NH), Electronic chip-carrier heat sinks.
  11. Xie Hong, Heat pipe lid for electronic packages.
  12. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  13. Neville ; Jr. Robert J. ; Hodgkins Daniel, Heatsink assembly.
  14. Dauksis William P. (91 Jennifer Cir. Ponce Inlet FL 32127), Hybrid internal combustion engine/electrical motor ground vehicle propulsion system.
  15. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  16. Bookhardt Gary L. ; McEuen Shawn S., Integrated heat dissipation apparatus.
  17. Patel Janak G., Integrated heatsink and heatpipe.
  18. David J. Koenen, Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink.
  19. Lin Liken,TWX, Method for manufacturing the heat pipe integrated into the heat sink.
  20. Raskas Eric J., Micro sensor device.
  21. Ueki Tatsuhiko,JPX ; Yamamoto Masaaki,JPX ; Ikeda Masami,JPX, Plate type heat pipe and a cooling system using same.
  22. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Sho Hitoshi,JPX ; Ueki Tatsuhiko,JPX, Plate type heat pipe and cooling structure using it.
  23. Kim Dong-Hwan,KRX, Portable computer being powered by either a battery pack or an AC adapter.
  24. Belady Christian L., Semiconductor package lid with internal heat pipe.
  25. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  26. Hamburgen William R. (Palo Alto CA) Fitch John S. (Newark CA) Jouppi Norman P. (Palo Alto CA), Thermosiphon for cooling a high power die.
  27. Welle Richard P., Ultrasonic data communication system.
  28. Milling ; Robert W., Waste heat converter for an internal combustion engine.

이 특허를 인용한 특허 (21)

  1. Yang, Jin; Shia, David, Adjustable heat pipe thermal unit.
  2. Chen,Chin Hui, Air guiding cover.
  3. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  4. Maveety,James G.; Chrysler,Gregory M.; Vadakkanmaruveedu,Unnikrishnan, Carbon nanotube micro-chimney and thermo siphon die-level cooling.
  5. Sakamoto, Hitoshi; Hsu, Chenpin, Cooling structure for an electronic component and electronic instrument.
  6. Usui, Masahiko; Enami, Takafumi; Ikeda, Sho; Tsubaki, Shigeyasu, Cooling structure for electronic equipment.
  7. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  8. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  9. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
  10. Sauciuc,Ioan; Chrysler,Gregory M., Electronic thermal management.
  11. Sauciuc, Ioan, Flow solutions for microelectronic cooling.
  12. Zhao, Yuan; Chen, Chunglung, Heat pipe dissipating system and method.
  13. Foster, Sr., Jimmy G.; Hardee, Donna C.; Keener, Don S.; Wolford, Robert R., Heat sink for dissipating a thermal load.
  14. Foster, Sr., Jimmy G.; Hardee, Donna C.; Keener, Don S.; Wolford, Robert R., Heat sink for dissipating a thermal load.
  15. Foster, Sr.,Jimmy G.; Hardee,Donna C.; Keener,Don S.; Wolford,Robert R., Heat sink for distributing a thermal load.
  16. Shimura, Takahiro; Enomoto, Hisao; Nakajima, Yuzo; Yamamoto, Masaaki, Heat sink with fins and manufacturing method thereof.
  17. Lankston, II, Robert J.; Malone, Christopher G.; Cromwell, Stephen D., Heat sink with surface-formed vapor chamber base.
  18. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  19. Holalkere,Ven R.; Prasher,Ravi; Montgomery,Stephen, Integrated stacked microchannel heat exchanger and heat spreader.
  20. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  21. Rush, Brian Magann; Kim, Joo Han, System and method for passively cooling an enclosure.
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