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Heat sink subassembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0135502 (2002-04-30)
발명자 / 주소
  • Eyman, Lewis Michael
  • Paulsel, Roger Q.
  • Sharp, Stanley O.
  • Delso, James W.
출원인 / 주소
  • Advanced Micro Devices, Inc.
대리인 / 주소
    Kowert, Robert C.Meyertons, Hood, Kivlin & Kowert & Goetzel, P.C.
인용정보 피인용 횟수 : 60  인용 특허 : 6

초록

A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating device is coupled to at least one of the att

대표청구항

A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating device is coupled to at least one of the att

이 특허에 인용된 특허 (6)

  1. Mellberg Hans T. ; Chan Bertram Kim Cheong ; Gardner Susannah, EMI reduction device and assembly.
  2. Bright Edward J. (Middletown PA) Maltais Jay F. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), EMI shield, and assembly using same.
  3. Hughes Richard P. (Kanata CAX), Electronic devices with electromagnetic radiation interference shields and heat sinks.
  4. Wong Thomas J. ; Ulen Neal ; Shah Ketan R. ; Raza Ishfaqur, Heat sink retention components and system.
  5. Wyler Gregory T., Integrated processor mounting mechanism and heat sink.
  6. Dean Frederick Herring ; Beth Frayne Loebach, Tilt-away processor retention module with hold-down screw device.

이 특허를 인용한 특허 (60)

  1. Homer, Steven S.; Hoffman, Dustin L.; Lev, Jeffrey A.; Tracy, Mark S.; Armendariz, Luis C.; Ruch, Mark H., Apparatuses and methods for dissipating heat from a computer component.
  2. Rubenstein,Brandon Aaron; Delano,Andrew D.; Clements,Bradley E., Bolster plate assembly for processor module assembly.
  3. Degner, Brett W.; Tice, Gregory, Consolidated thermal module.
  4. Heesen,Klaus, Cooling apparatus.
  5. Gasbarro, Henry Frank; Carpenter, Joseph Edwin; Berry, Robert R., Dismount tablet computer assembly for wireless communication applications.
  6. Lin, Kuang Hsi; Wang, Hsu-Chu; Su, Chih Min, Ensuring proper heat sink installation in information handling systems.
  7. Barsun,Stephan Karl; Bolich,Bryan; Miner,Richard A.; Wortman,Michael, Expandable bracing apparatus and method.
  8. Meier, Steffen; Brunner, Volker, Fastening apparatus for a battery in a motor vehicle, and motor vehicle having a fastening apparatus of this type.
  9. Lin, Sheng-Huang, Fastening structure for thermal module.
  10. Lin, Sheng-Huang, Fastening structure for thermal module.
  11. Lin, Sheng-Huang, Fastening structure for thermal module.
  12. Lin, Sheng-Huang, Fastening structure for thermal module.
  13. Hasegawa, Tsuyoshi, Fixture for semiconductor device and assembly of semiconductor device.
  14. Taylor,Paul R., Flexible circuit connector assembly.
  15. Tseng, Chun Fa; Yang, Chi Hsueh; Huang, Yu Nien, Heat dissipation module.
  16. Kawano, Kayoko, Heat sink and method for fixing heat sink.
  17. Lee,Hsieh Kun; Xia,WanLin; Wang,Gen Cai; Li,Tao, Heat sink assembly with retention module and clip.
  18. Lee,Hsieh Kun; Xia,Wellint; Lee,Toly; Wang,Gen Cai, Heat sink clip with cammed handle.
  19. Wang,Frank; Fan,Jui Chan; Chang,Chun Yi, Heat sink module for an electronic device.
  20. Coleman,Richard A.; Christensen,Steven M.; Pugley,John R., Heat sink mounting systems and methods.
  21. Oliver, Michael J., Heat-dissipating electromagnetic shield.
  22. Colbert, John L.; Corbin, Jr., John S.; Eagle, Jason R.; Hamilton, Roger Duane; Mikhail, Amanda E.; Sinha, Arvind K.; Sobotta, Terry L., Heatsink apparatus for applying a specified compressive force to an integrated circuit device.
  23. Augustin, Thomas J.; Cromwell, Stephen D., Leaf spring load plate with retained linear cam slide.
  24. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Carman, Dan D.; Reed, William R., Lightweight audio system for automotive applications and method.
  25. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Moeschberger, Donald G.; Hatcher, Rick L.; Nguyen, Quan N., Lightweight audio system for automotive applications and method.
  26. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Moeschberger, Donald G.; Hatcher, Rick L.; Nguyen, Quan N., Lightweight audio system for automotive applications and method.
  27. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  28. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  29. Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  30. Snider, Chris R.; Gupta, Vineet; Coady, Michael G., Lightweight audio system for automotive applications and method.
  31. Snider, Chris R.; Gupta, Vineet; Coady, Michael G.; Bell, Jeffrey T.; Burton, Paul C.; Hassler, Edgar Glenn, Lightweight audio system for automotive applications and method.
  32. Snider, Chris R.; Gupta, Vineet; Coady, Michael G.; Stapert, Curtis Allen; Bell, Jeffrey T.; Vadas, Robert L.; Moeschberger, Donald G.; Oberlin, Allen E.; Hassler, Edgar Glenn; Piel, Kip R.; Kenworthy, Tim A.; Uglum, Paul A.; Fye, Michael E.; Scott, Philip M., Lightweight audio system for automotive applications and method.
  33. Snider, Chris R.; Gupta, Vineet; Coady, Michael G.; Stapert, Curtis Allen; Moeschberger, Donald G.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  34. Snider, Chris R.; Gupta, Vineet; Coady, Michael G.; Stapert, Curtis Allen; Moeschberger, Donald G.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  35. Snider, Chris R.; Gupta, Vineet; Coady, Michael G.; Stapert, Curtis Allen; Moeschberger, Donald G.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  36. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G., Lightweight audio system for automotive applications and method.
  37. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G., Lightweight audio system for automotive applications and method.
  38. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G., Lightweight audio system for automotive applications and method.
  39. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  40. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Moeschberger, Donald G.; Oberlin, Allen E.; Burton, Paul C.; Carman, Dan D.; Stahl, Gary L.; Matly, John Michael; Hatcher, Rick L.; Hassler, Edgar Glenn; Nguyen, Quan N.; Reed, William R.; Piel, Kip R.; Wendling, Jerry J.; Kenworthy, Tim A.; Uglum, Paul A.; Fye, Michael E.; Scott, Philip M., Lightweight audio system for automotive applications and method.
  41. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Moeschberger, Donald G.; Oberlin, Allen E.; Matly, John Michael; Piel, Kip R.; Wendling, Jerry J., Lightweight audio system for automotive applications and method.
  42. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  43. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  44. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Bell, Jeffrey T.; Vadas, Robert L.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  45. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  46. Snider, Chris R.; Gupta, Vineet; Huntzinger, Joseph K.; Coady, Michael G.; Stapert, Curtis Allen; Meyer, Kevin Earl; Garner, Timothy D.; Oberlin, Allen E., Lightweight audio system for automotive applications and method.
  47. Snider, Chris R.; Hassler, Edgar Glenn, Lightweight audio system for automotive applications and method.
  48. Snider, Chris R.; Hassler, Edgar Glenn, Lightweight audio system for automotive applications and method.
  49. Floyd, Michael Richard; Smith, Peter Andrew, Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes.
  50. Campbell, Levi A.; Colbert, John L.; Ellsworth, Jr., Michael J.; Sinha, Arvind K., Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates.
  51. Colbert, John Lee; Eckberg, Eric Alan; Hamilton, Roger Duane; Hoffmeyer, Mark Kenneth; Mikhail, Amanda Elisa Ennis; Sinha, Arvind Kumar, Mounting a heat sink in thermal contact with an electronic component.
  52. Colbert,John Lee; Eckberg,Eric Alan; Hamilton,Roger Duane; Hoffmeyer,Mark Kenneth; Mikhail,Amanda Elisa Ennis; Sinha,Arvind Kumar, Mounting a heat sink in thermal contact with an electronic component.
  53. Yeh, Cheng-Chi, Retention device and electrical connector assembly used thereof.
  54. Brunschwiler, Thomas J.; Despont, Michel; Lantz, Mark A.; Michel, Bruno; Vettiger, Peter, Semiconductor device with a high thermal dissipation efficiency.
  55. Vetter,Stephan Michael; Parisi,Mark Joseph, Simplified mounting configuration that applies pressure force to one central location.
  56. Dai,Xiang; Cromwell,Dan, Supporting a circuit package including a substrate having a solder column array.
  57. Vinson,Wade; Volkmann,Art; Franz,John, System and method for cooling electronic devices.
  58. Edwards, Darvin R., System and method for self-leveling heat sink for multiple height devices.
  59. Degner, Brett W.; Reid, Gavin J.; Smith, Brandon S.; Shan, Raymond S., Thermal module accounting for increased board/die size in a portable computer.
  60. Ooyabu,Yasunari; Ohwaki,Yasuhito, Wired circuit board and connecting structure thereof.
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