초록 ▼

A method for refrigerating a high temperature superconducting device to maintain superconducting operating conditions wherein a first heat transfer means such as a first heat transfer fluid is cooled to a temperature greater than the temperature of saturated liquid nitrogen and is used for ambient h

A method for refrigerating a high temperature superconducting device to maintain superconducting operating conditions wherein a first heat transfer means such as a first heat transfer fluid is cooled to a temperature greater than the temperature of saturated liquid nitrogen and is used for ambient heat intercept while a second heat transfer means such as a second heat transfer fluid is cooled to a temperature within the high temperature superconductivity temperature operating range to maintain superconducting operating conditions.

대표청구항 ▼

1. A method for cooling a high temperature superconducting device comprising: (A) providing a high temperature superconducting device operating at a temperature within a high temperature superconductivity temperature range of from 20 to 80 K; (B) cooling a first heat transfer means to a first te

1. A method for cooling a high temperature superconducting device comprising: (A) providing a high temperature superconducting device operating at a temperature within a high temperature superconductivity temperature range of from 20 to 80 K; (B) cooling a first heat transfer means to a first temperature which exceeds the temperature of saturated liquid nitrogen, and warming the cooled first heat transfer means by intercepting ambient heat from passing to the high temperature superconducting device; and (C) cooling a second heat transfer means to a second temperature within the high temperature superconductivity temperature range, and warming the cooled second heat transfer means by heat exchange with the high temperature superconducting device to maintain the high temperature superconducting device within the high temperature superconductivity temperature range, wherein the first heat transfer means comprises first heat transfer fluid and the second heat transfer means comprises second heat transfer fluid and wherein the first heat transfer fluid and the second heat transfer fluid circulate in an integrated circuit. 2. The method of claim 1 wherein the high temperature superconducting device is insulated using an outer insulation layer and an inner insulation layer which is positioned closer to the high temperature superconducting device than is the outer insulation layer. 3. The method of claim 2 wherein the cooled first heat transfer fluid is passed between the inner and outer insulation layers. 4. The method of claim 2 wherein the cooled second heat transfer fluid is passed between the inner insulation layer and the high temperature superconducting device. 5. The method of claim 1 wherein the first heat transfer fluid is cooled by indirect heat exchange with a multicomponent refrigerant fluid. 6. The method of claim 1 wherein the second heat transfer fluid is cooled by indirect heat exchange with a multicomponent refrigerant fluid. 7. The method of claim 1 wherein the high temperature superconducting device is electrical cable. 8. A method for cooling a high temperature superconducting device comprising: (A) providing a high temperature superconducting device operating at a temperature within a high temperature superconductivity temperature range of from 20 to 80 K; (B) cooling a first heat-transfer means to a first temperature which exceeds the temperature of saturated liquid nitrogen, and warming the cooled first heat transfer means by intercepting ambient heat from passing to the high temperature superconducting device; and (C) cooling a second heat transfer means to a second temperature within the high temperature superconductivity temperature range, and warming the cooled second heat transfer means by heat exchange with the high temperature superconducting device to maintain the high temperature superconducting device within the high temperature superconductivity temperature range, wherein the first heat transfer means comprises first heat transfer fluid and the second heat transfer means comprises second heat transfer fluid and further comprising cooling a third heat transfer fluid to a third temperature which is less than the first temperature and greater than the second temperature, and warming the cooled third heat transfer fluid by indirect heat exchange with the high temperature superconducting device.