Leukocyte depletion filter media, filter produced therefrom, method of making same and method of using same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B01D-061/00
B01D-037/00
출원번호
US-0746202
(2000-12-19)
발명자
/ 주소
Sheikh-Ali, Bashir Musse
출원인 / 주소
Kimberly-Clark Corporation
대리인 / 주소
Flack, Steven D.Robinson, James B.
인용정보
피인용 횟수 :
34인용 특허 :
168
초록▼
A leukocyte depletion filter media includes nonwoven material or microfiber glass which has been coated with a polysaccharide originally containing functionalized side chains capable of crosslinking with each other and the filter media. The leukocyte depletion filter media preferably includes a poly
A leukocyte depletion filter media includes nonwoven material or microfiber glass which has been coated with a polysaccharide originally containing functionalized side chains capable of crosslinking with each other and the filter media. The leukocyte depletion filter media preferably includes a polysaccharide having a charge density of up to 5 meq/g.
대표청구항▼
A leukocyte depletion filter media includes nonwoven material or microfiber glass which has been coated with a polysaccharide originally containing functionalized side chains capable of crosslinking with each other and the filter media. The leukocyte depletion filter media preferably includes a poly
A leukocyte depletion filter media includes nonwoven material or microfiber glass which has been coated with a polysaccharide originally containing functionalized side chains capable of crosslinking with each other and the filter media. The leukocyte depletion filter media preferably includes a polysaccharide having a charge density of up to 5 meq/g. ssembly for processing substrates of different configurations and/or dimensions on a sequential basis in a substrate processing system incorporating a ventable vacuum chamber with an access port, comprising: a backplane base mountable within the vacuum chamber of the substrate processing system and at a position suitable for processing substrates, said backplane base including an inlet passageway for heat transfer gas; a first faceplate sized to be insertable through the access port and removably mountable to said backplane base, said first faceplate having a first contact surface dimensioned and configured to provide an efficient thermal contact with a correspondingly dimensioned and/or configured first type of substrate, said first faceplate including a first inlet port coupled with the inlet passageway for directing heat transfer gas to the first contact surface when the corresponding said first faceplate is mounted to said backplane base to form the mated configuration; a second faceplate sized to be insertable through the access port and removably mountable to said backplane base, said second faceplate having a second contact surface dimensioned and configured differently than said first contact surface to provide an efficient thermal contact with a correspondingly dimensioned and/or configured second type of substrate, said second faceplate including a second inlet port coupled with the inlet passageway for directing heat transfer gas to the second contact surface when said second faceplate is mounted to said backplane base to form the mated configuration, wherein said first faceplate and said second faceplate are alternatively mountable to said backplane base to form a mated configuration therewith for alternatively processing the first and second types of substrates, respectively, in the vacuum chamber; and a vented mounting bolt threadingly received within the inlet passageway and one of the first and second inlet ports for mounting the corresponding one of said first and second faceplates to the backplane base to form the mated configuration, said vented mounting bolt having a bore permitting heat transfer gas to flow from each of the first and second inlet ports to the corresponding one of the first and second contact surfaces. 2. The backplane assembly of claim 1, further comprising a third faceplate, sized to be insertable through the access port and removably mountable to said backplane base, said third faceplate having a contact surface uniquely dimensioned and configured to provide an efficient thermal contact with a correspondingly dimensioned and/or configured third type of substrate, wherein said first faceplate, said second faceplate, and said third faceplate are alternatively mountable to said backplane base to form a mated configuration therewith for alternatively processing the first, second and third types of substrates, respectively, in the vacuum chamber. 3. The backplane assembly of claim 1, further comprising a plurality of more than two faceplates; each sized to be insertable through the access port and removably mountable to said backplane base, each of said plurality of more than two faceplates having a contact surface uniquely dimensioned and configured to provide an efficient thermal contact with a correspondingly dimensioned and/or configured third type of substrate, wherein said plurality of more than two faceplates are alternatively mountable to said backplane base to form a mated configuration therewith for alternatively processing more than two types of substrates in the vacuum chamber. 4. The backplane assembly of claim 1, wherein: said backplane base includes an exhaust passageway for heat transfer gas; said first faceplate includes a first exhaust port coupled with the exhaust passageway for draining heat transfer gas from the first contact surface when said first faceplate is mounted to said backplane base to form the mated configuration and the first type of substrate is c ontacting the first contact surface; and said second faceplate includes a second exhaust port coupled with the exhaust passageway for draining heat transfer gas from the second contact surface when said second faceplate is mounted to the backplane base to form the mated configuration and the second the of substrate is contacting the second contact surface. 5. The backplane assembly of claim 4 wherein: the first contact surface includes a first gas channel configured to direct the heat transfer gas between the first type of substrate and the first contact surface when the first type of substrate is contacting the first contact surface; and the second contact surface includes a second gas channel configured to direct heat transfer gas between the second type of substrate and the second contact surface when the second type of substrate is contacting the second contact surface. 6. The backplane assembly of claim 5, wherein: the first gas channel includes a first peripheral gas channel extending about a perimeter of the first contact surface and a first connecting gas channel extending from the first gas inlet port to the first peripheral gas channel, and a second connecting gas channel extending from the first gas exhaust port to the first peripheral gas channel; and the second gas channel includes a second peripheral gas channel extending about a perimeter of the second contact surface, a third connecting gas channel extending from the second gas inlet port to the second peripheral gas channel, and a fourth connecting gas channel extending from the second gas exhaust port to the second peripheral gas channel. 7. The backplane assembly of claim 6, wherein: the first contact surface has a circular outer rim, the first peripheral gas channel extends about a circumference of the outer rim, and the first and second connecting gas channels extend radially from the first gas inlet port to the first peripheral gas channel; and the second contact surface has a circular outer rim, the second peripheral gas channel extends about a circumference of the outer rim, and the third and fourth connecting gas channels extend radially to the second peripheral gas channel. 8. The backplane assembly of claim 1, wherein: the first contact surface includes a first gas channel configured to direct heat transfer gas from the first gas inlet port between the first type of substrate and the first contact surface when the first type of substrate is contacting the first contact surface; and the second contact surface includes a second gas channel configured to direct heat transfer gas from the second gas inlet port between the second type of substrate and the second contact surface when the second type of substrate is contacting the second contact surface. 9. The backplane assembly of claim 8, wherein: the first gas channel includes a first peripheral gas channel extending about a perimeter of the first contact surface and a first connecting gas channel extending from the first gas inlet port to the first peripheral gas channel; and the second gas channel includes a peripheral gas channel extending about a perimeter of the second contact surface and a second connecting gas channel extending from the second gas inlet port to the second peripheral gas channel. 10. The backplane assembly of claim 9, wherein the first contact surface has a circular outer rim, the first peripheral gas channel extends about a circumference of the outer rim, and the first connecting gas first gas inlet port to the first peripheral gas channel; and the second contact surface has a circular outer rim, the second peripheral gas channel extends about a circumference of the outer rim, and the second connecting gas channel extends radially from the second gas inlet port to the second peripheral gas channel. 11. The backplane assembly of claim 1, wherein: said first faceplate includes a first mating surface opposite the first contact surface and a
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