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Spray evaporative cooling system and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0860038 (2001-05-16)
발명자 / 주소
  • Pautsch, Gregory W.
출원인 / 주소
  • Cray Inc.
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 44  인용 특허 : 25

초록 ▼

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic compon

대표청구항 ▼

A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic compon

이 특허에 인용된 특허 (25)

  1. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic comp.
    상세보기
  2. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
    상세보기
  3. Daikoku Takahiro (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Apparatus for cooling heat generating members.
    상세보기
  4. Kobrinetz Anthony ; Bullock Michael K., Circuit board apparatus and apparatus and method for spray-cooling an electronic component.
    상세보기
  5. Jose Javier Macias ; Rogelio Hernandez Silva, Computer enclosure cooling unit.
    상세보기
  6. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
    상세보기
  7. Daikoku Takahiro (Ushiku JPX) Takagi Ryuichi (Tokyo JPX), Cooling system and method for electronic circuit devices.
    상세보기
  8. Tilton Charles L. ; Smetana Bruce A, EMI shielding fluid control apparatus.
    상세보기
  9. Koizumi Shigeru (Hadano JPX) Zushi Shizuo (Hadano JPX) Komiya Mitsuo (Hadano JPX), Electronic apparatus and method of cooling the same.
    상세보기
  10. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Environmentally isolated enclosure for electronic components.
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  11. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
    상세보기
  12. Havey Mort L. ; Hitch William Robert, Heat spreader system for cooling heat generating components.
    상세보기
  13. Tilton Donald E. (Kent WA) Tilton Charles L. (Kent WA), High heat flux evaporative spray cooling.
    상세보기
  14. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
    상세보기
  15. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
    상세보기
  16. Sherwood Gregory J. (Colorado Springs CO) Quaderer Chris M. (Colorado Springs CO), Logic module assembly for confining and directing the flow of cooling fluid.
    상세보기
  17. Cromwell S. Daniel ; Nobi Laszlo, Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management.
    상세보기
  18. Root Loren F. ; McDunn Kevin J., Method for spray-cooling a tunable semiconductor device.
    상세보기
  19. Edwards Michael Ray ; Morris Garron Koch ; Estes Kurt Arthur ; Pais Martin, Multi-mode, two-phase cooling module.
    상세보기
  20. Simmons Frederick J. (Neillsville WI) Chen Steve S. (Chippewa Falls WI) Pautsch Greg W. (Chippewa Falls WI) Rabska Michael H. (Eau Claire WI) Girling Dennis F. (Cadott WI) Paffel Douglas C. (Stanley , Packaging architecture for a highly parallel multiprocessor system.
    상세보기
  21. McDunn Kevin J. ; Limper-Brenner Linda, Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device.
    상세보기
  22. Tennant David T. ; McDunn Kevin J. ; Limper-Brenner Linda ; Bullock Michael K., Radio frequency filter and apparatus and method for cooling a heat source using a radio frequency filter.
    상세보기
  23. Tilton Donald E. ; Seaney Kevin D. ; Baddeley Ryan J ; Tilton Charles L, Spray cooled circuit card cage.
    상세보기
  24. Hileman Vince P., Spray cooled module with removable spray cooled sub-module.
    상세보기
  25. Chandrakant D. Patel ; Cullen E. Bash, Spray cooling system.
    상세보기

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  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
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  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
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  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
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  4. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
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  5. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
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  6. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit; Zhang, Jing, Cooling method with automated seasonal freeze protection.
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  7. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit; Zhang, Jing, Cooling system with automated seasonal freeze protection.
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  8. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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  9. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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  10. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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  11. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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  12. Knight,Paul A.; Kabrell,Carl Axel Ingemar, Dry-wet thermal management system.
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  13. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
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  14. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
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  15. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
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  16. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
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  17. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
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  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
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  19. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling apparatus for an electronics rack.
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  20. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
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  21. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
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  22. Cader, Tahir; Ressa, Robert J., Low momentum loss fluid manifold system.
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  23. Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling.
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  24. Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling.
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  25. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
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  26. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
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  27. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
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  28. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
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  29. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Multi-fluid cooling system and method with freeze protection for cooling an electronic device.
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  30. Patel,Chandrakant D.; Bash,Cullen E.; Sharma,Ratnesh, Multi-state spray cooling system.
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  31. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
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  32. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
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  33. Tilton, Charles L.; Tilton, Donald; Weir, Thomas D; Palmer, Randall T., Passive fluid recovery system.
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  34. Tilton, Charles L; Tilton, Donald; Weir, Thomas D; Palmer, Randall T., Passive fluid recovery system.
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  35. Breinlinger, Keith; Ostertag, Edward; Sartschev, Ronald A.; Teneketges, Nicholas J., Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment.
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  36. Zimmerman, Sammy Lee; Tilton, Charles L, Pumping system resistant to cavitation.
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  37. Knudsen, Corey; McDaniel, Kent T.; Smith, Bradley J.; Pautsch, Gregory W.; Lakin, Eric D., Rack mounted electronics having connectors with heat cooling fingers.
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  38. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
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  39. Knight,Paul A.; Fales,Brent M., Spray cool system with a dry access chamber.
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  40. Knight,Paul A., Spray coolant reservoir system.
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  41. Tilton,Donald E.; Tilton,Charles L.; Weiler,Jeffery K., Spray cooling system for transverse thin-film evaporative spray cooling.
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  42. Lee, Sang-cheol, Supporting block of VGA chipset cooling device.
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  43. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
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  44. Sharma,Ratnesh; Bash,Cullen E.; Patel,Chandrakant D., Two-fluid spray cooling system.
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