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The invention provides a supported metal membrane which contains a metal membrane on a support surface of a porous membrane support. The supported metal membrane is obtainable by applying the metal membrane to the support surface of the membrane support, wherein the pores in the membrane support are

The invention provides a supported metal membrane which contains a metal membrane on a support surface of a porous membrane support. The supported metal membrane is obtainable by applying the metal membrane to the support surface of the membrane support, wherein the pores in the membrane support are sealed, at least in the region of the support surface, prior to applying the metal membrane and are opened by removing the auxiliary substance only after applying the metal membrane.

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1. A supported metal membrane comprising a metal membrane on a support surface of a porous membrane support, wherein the pores of the membrane support are formed by electrochemically dissolving the copper-rich phase from eutetic alloy AgCu. 2. The supported metal membrane of claim 1, wherein the met

1. A supported metal membrane comprising a metal membrane on a support surface of a porous membrane support, wherein the pores of the membrane support are formed by electrochemically dissolving the copper-rich phase from eutetic alloy AgCu. 2. The supported metal membrane of claim 1, wherein the metal membrane consists of palladium or a palladium alloy. 3. The supported metal membrane of claim 2, wherein the palladium alloy is PdAg23, PdCu40 or PdY10. 4. The supported metal membrane of claim 1, wherein the metal membrane has a thickness of less than 5 μ. 5. The supported metal membrane of claim 1, wherein the metal membrane has a thickness of 2 to 0.3μ. 6. The supported metal membrane of claim 1, wherein the metal membrane is multilayered. 7. The supported metal membrane of claim 1, further comprising a diffusion barrier layer between the metal membrane and the membrane support. 8. The supported metal membrane of claim 1, wherein the supported metal membrane is in the form of a foil or tubule. 9. The supported metal membrane of claim 1, wherein the membrane support is in the form of a porous honeycomb. 10. The supported metal membrane of claim 1, further comprising a catalytically active coating on the surface of the porous membrane support opposite the metal membrane. 11. The supported metal membrane of claim 1, further comprising a functional layer on the surface of the porous membrane support opposite the metal membrane, wherein said functional layer is for removing impurities and harmful substances. 12. A method for preparing a supported metal membrane comprising: filling the pores of a porous membrane support with an auxiliary substance in at least a region defining a support surface; then applying a metal membrane to the support surface; and then removing the auxiliary substance from the pores of the porous membrane support. 13. The method of claim 12, further comprising smoothing and cleaning the support surface after filling the pores of the porous membrane support. 14. The method of claim 12, wherein the porous membrane support is made from a porous metal, a metal alloy, a sintered metal, a sintered steel, a glass or a ceramic, and the auxiliary substance is a chemically readily removable metal, salt, graphite, polymer or high molecular weight organic compound. 15. The method of claim 12, wherein the metal membrane is applied by electrochemical deposition or by a PVD or a CVD process. 16. The method of claim 15, wherein the metal membrane is comprised of palladium or a palladium alloy. 17. The method of claim 16, wherein the metal membrane contains PdAg23, PdCu40 or PdY10. 18. A method for preparing a supported metal membrane comprising: applying a metal membrane to a support surface of a membrane support consisting of a multi-phase eutectic alloy having a phase more base than another phase; then electrochemically dissolving the more base phase from the membrane support to form pores in the membrane support. 19. The method of claim 18, further comprising: cleaning the support surface of the membrane support before applying the metal membrane, and heating the applied metal membrane and membrane support to a temperature between 300 and 700° C. before dissolving the more base phase from the membrane support. 20. The method of claim 18, wherein the multiphase eutectic alloy is AgCu. 21. The method of claim 18, wherein the metal membrane is applied by electrochemical deposition or by PVD or a CVD process. 22. The method of claim 21, wherein the metal membrane is comprised of palladium or a palladium alloy. 23. The method of claim 22, wherein the metal membrane contains PdAg23, PdCu40 or PdY10.