IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0014957
(2001-10-26)
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발명자
/ 주소 |
- Brewer, Christopher Michael
- Chorvath, Igor
- Fournier, Frances Marie
- Lee, Michael Kang-Jen
- Li, Dawei
- Oldinski, Robert Leo
- Petroff, Lenin James
- Rabe, Richard Leroy
- Romenesko, David Joseph
- Lee,
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
22 인용 특허 :
18 |
초록
▼
A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C., (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysi
A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C., (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and (B") 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15, (C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate, (D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and (II) dynamically curing said diorganopolysiloxane (B').
대표청구항
▼
A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C., (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysi
A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25° C. to 275° C., (B) a silicone base comprising (B') 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and (B") 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15, (C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate, (D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and (II) dynamically curing said diorganopolysiloxane (B'). stituted by one or more Re; Reis selected from the group consisting of C1-5 alkyl, C3-7 cycloalkyl, aryl, heterocyclyl selected from the group consisting of pyrrolidinyl, piperidinyl, morpholinyl, thiomorpholinyl, piperazinyl and indolinyl; heteroaryl selected from the group consisting of furanyl, thienyl, pyrrolyl, oxazolyl, thiazolyl, imidazolyl, triazolyl, tetrazolyl, pyridinyl, pyrimidinyl, pyrazinyl, indolyl, benzofuranyl, benzothienyl, benzimidazolyl, benzthiazolyl, quinolinyl, isoquinolinyl, quinazolinyl and quinoxalinyl, C1-5 alkoxy, aryloxy, arylC1-5alkoxy, heteroarylC1-5alkoxy, C1-5 alkoxycarbonyl, aryloxycarbonyl, C1-5 alkanoyloxy, aroyloxy, carbamoyl wherein the nitrogen atom may be independently mono or di-substituted by C1-5 alkyl, aryl, heterocyclyl selected from the group consisting of pyrrolidinyl, piperidinyl, morpholinyl, thiomorpholinyl, piperazinyl and indolinyl or heteroaryl selected from the group consisting of furanyl, thienyl, pyrrolyl, oxazolyl, thiazolyl, imidazolyl, triazolyl, tetrazolyl, pyridinyl, pyrimidinyl, pyrazinyl, indolyl, benzofuranyl, benzothienyl, benzimidazolyl, benzthiazolyl, quinolinyl, isoquinolinyl, quinazolinyl and quinoxalinyl, C1-5 alkanoylamino, aroylamino, C1-5 alkylthioarylthioarylC1-5 alkylthio, ureido wherein either nitrogen atom may be independently substituted by C1-5 alkyl, aryl, heterocyclyl selected from the group consisting of pyrrolidinyl, piperidinyl, morpholinyl, thiomorpholinyl, piperazinyl and indolinyl or heteroaryl selecte
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