Vehicle power distributor and method of producing the same
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0908567
(2001-07-20)
|
우선권정보 |
JP-0233996 (2000-08-02) |
발명자
/ 주소 |
- Yamane, Shigeki
- Isshiki, Isao
|
출원인 / 주소 |
- Autonetworks Technologies, LTD, Sumitomo Wiring Systems, LTD, Sumitomo Electric Industries, LTD
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
4 인용 특허 :
8 |
초록
▼
A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar a
A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar aggregation B. Amethod of manufacturing the power distributor is constituted by the steps of: forming the bus bar aggregation B; molding the housing 22 around the bus bar aggregation B after the semiconductor switching devices 14 are mounted on the bus bar aggregation B; and completing a power distribution circuit after cutting off suitable portions of the bus bar aggregation B after the molding.
대표청구항
▼
A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar a
A power distributor having: a bus bar aggregation B made out of a single plate material; semiconductor switching devices 14 mounted on the bus bar aggregation B; and a housing 22 made out of an electrical insulating material such as resin or the like and molded around the device-containing bus bar aggregation B. Amethod of manufacturing the power distributor is constituted by the steps of: forming the bus bar aggregation B; molding the housing 22 around the bus bar aggregation B after the semiconductor switching devices 14 are mounted on the bus bar aggregation B; and completing a power distribution circuit after cutting off suitable portions of the bus bar aggregation B after the molding. ly over the solder bumps and not on any other portions of the underfill material. 15. The bumped semiconductor chip as described in claim 11, wherein the colorant is a dye. 16. The bumped semiconductor chip as described in claim 11, wherein the colorant is a pigment. 17. The bumped semiconductor chip as described in claim 11, wherein the colorant is selected from the group consisting of red, amber, yellow, green, blue, violet, or a material that fluoresces in ultraviolet light. 18. The bumped semiconductor chip as described in claim 11, wherein the colorant is one or more materials selected from the group consisting of benzopyran, benzenamine, perylene, rhodamine, ardrox, diazole, fuschin, safranin O, zinc chloride, and zinc nitrate. 19. The bumped semiconductor chip as described in claim 11, wherein the light source is selected from the group consisting of red, amber, yellow, green, blue, violet, or ultraviolet light. 20. The bumped semiconductor chip as described in claim 11, wherein the light source is of a color that corresponds to the color of the colorant. 21. The bumped semiconductor chip as described in claim 11, wherein the flux containing a colorant is deposited on at least two of the plurality of solder bumps. 22. In the automatic high speed assembly of bumped semiconductor chips to printed circuit boards, a bumped semiconductor chip exhibiting enhanced pattern recognition when illuminated in a machine vision system, comprising: a flip chip integrated circuit having a plurality of solder bumps on an active face thereof; an underfill material coated on the active face such that at least a portion of each of the solder bumps remains uncoated; and a flux containing a red dye, deposited only on each of the solder bumps, to modify the optical characteristics of the solder bumps when illuminated by a red light source in the machine vision system. 23. A bumped semiconductor package exhibiting enhanced pattern recognition when illuminated in a machine vision system, comprising: a circuit carrying substrate having first and second sides; a semiconductor device electrically and mechanically mounted on the first side of the circuit carrying substrate; the circuit carrying substrate second side having a substantially coplanar array of solder bumps; a coating of an underfill material on the circuit carrying substrate second side; a fluxing composition containing an image enhancing agent, selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps; and wherein the deposited image enhancing agent causes the solder bumps to appear bright against the underfill material when the circuit carrying substrate second side is illuminated by selected wavelengths of light.
이 특허에 인용된 특허 (8)
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LaBelle James L., Antitheft interrupt system for vehicle starter power circuit.
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Hill Mark G. (Novi MI) Stern Eric J. (Farmington Hills MI), Battery-mounted power distribution module.
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Ogden Christopher ; Lindsey Denis M. ; Stibgen Michael, Bus bar having embedded switching device.
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Kondo Kazuharu,JPX ; Yamaguchi Tohru,JPX ; Yokoyama Kazuaki,JPX, Electric junction box.
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Neibecker Niels,DEX ; Schubotz Horst,DEX ; Stadler Peter,DEX, Electrical distribution system.
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Whitson Duane E. (Amboy IN) Lawlyes Daniel A. (Cicero IN), Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a term.
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Umemoto Hiroshi ; Yang Shenghua, Power distribution center with improved power supply connection.
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Suzuki Masataka,JPX ; Ashiya Hiroyuki,JPX ; Maki Yayoi,JPX ; Masuda Atsushi,JPX, Resin-coated mount substrate and method of producing the same.
이 특허를 인용한 특허 (4)
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Sauer, Fred W; Schmitz, Scott C; Mueller, Eric W; Bergman, Nils A, Power distribution module.
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Maegawa,Akihito; Nagashima,Shinyu, Resin molded component fitted with a metal plate and molding method therefor.
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Harao, Akira; Matsunaga, Mototatsu; Sugiura, Yasuhiro; Kubota, Minoru, Wiring substrate and manufacturing method thereof.
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Harao, Akira; Matsunaga, Mototatsu; Sugiura, Yasuhiro; Kubota, Minoru, Wiring substrate and manufacturing method thereof.
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