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Short carbon fiber enhanced thermal grease 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0894259 (2001-06-28)
발명자 / 주소
  • Chiu, Chia-Pin
  • Shipley, James C.
  • Simmons, Craig B.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 27  인용 특허 : 11

초록

A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplicati

대표청구항

1. An information handling system comprising: a memory device; a processor device; a thermal conducting material coupled to the processor device, including: a viscous matrix material; a distribution of carbon fibers within the viscous matrix material; a heat transfer device coupled to the

이 특허에 인용된 특허 (11)

  1. Martin Jacob H. (Wellesley MA), Composite heat transfer device.
  2. Bunyan Michael H. ; de Sorgo Miksa, Conformal thermal interface material for electronic components.
  3. Schuft Charles F. (Westford MA), Controlled highly densified diamond packing of thermally conductive electrically resistive conduit.
  4. Deeney Jeffrey L., Electrically conductive thermal interface.
  5. Layton Wilbur T. (San Diego CA) Morange Blanquita O. (San Diego CA) Torres Angela M. (Vista CA), Liquid metal heat conducting member and integrated circuit package incorporating same.
  6. Booth Richard B. (Wappingers Falls) Grube Gary W. (Washingtonville) Gruber Peter A. (Mohegan Lake) Khandros Igor Y. (Peekskill) Zingher Arthur R. (White Plains NY), Liquid metal matrix thermal paste.
  7. Nakai Mikio (Shizuoka JPX) Ishikawa Takayuki (Shizuoka JPX), Liquid-crystal polyester resin composition which exhibits excellent high temperature stability.
  8. Fujimori Yoshinori (Tokyo JPX) Momma Jun (Yokohama JPX) Sasaki Tomiya (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Sakamoto Toshiya (Yokohama JPX) Endo Hiroshi (Yokohama JPX) Hisano Katsumi (Yokohama , Thermal conductivity sheet.
  9. Daszkowski Joseph M. (New Hyde Park NY), Thermal link.
  10. Ameen Joseph G. (Bear DE) Mortimer ; Jr. William P. (Conowingo MD) Yokimcus Victor P. (Newark DE), Thermally conductive interface.
  11. Hanrahan James R., Thermally conductive polytrafluoroethylene article.

이 특허를 인용한 특허 (27)

  1. Hardin, Randall; Keihl, John; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  2. Hardin, Randall; Keihl, Jonathan; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  3. Farrow, Timothy S.; Herring, Dean F., Apparatus, system, and method for thermal conduction interfacing.
  4. Dani, Ashay A.; Prakash, Anna M.; Jayaraman, Saikumar; Patel, Mitesh; Wakharkar, Vijay S., Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same.
  5. Dani,Ashay A.; Prakash,Anna M.; Jayaraman,Saikumar; Patel,Mitesh; Wakharkar,Vijay S., Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same.
  6. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket.
  7. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings.
  8. Ishikawa,Takahiro; Shinkai,Masayuki; Miyahara,Makoto; Ishikawa,Shuhei; Nakayama,Nobuaki; Inoue,Kazuyoshi, Heat spreader module.
  9. De Lorenzo, David S.; Montgomery, Stephen W.; Fite, Robert J., Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD.
  10. Abazarnia, Nader; Gupta, Ashish X; Prstic, Suzana, Liquid TIM dispense and removal method and assembly.
  11. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
  12. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
  13. Koning, Paul A.; White, Bryan M., Nanotube modified solder thermal intermediate structure, systems, and methods.
  14. Dubin, Valery M.; Dory, Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
  15. Dubin, Valery M; Dory, Thomas S., Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface.
  16. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  17. Anderson, Brent A.; Lukaitis, Joseph M.; Rankin, Jed H.; Robison, Robert R., Semiconductor structure incorporating multiple nitride layers to improve thermal dissipation away from a device and a method of forming the structure.
  18. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
  19. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrode assemblies and plasma processing chambers incorporating the same.
  20. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  21. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  22. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrodes.
  23. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  24. Dhindsa, Rajinder, Temperature controlled hot edge ring assembly.
  25. Zhang,Yuegang; Garner,C. Michael; Berlin,Andrew A.; Rao,Valluri; White,Bryan M.; Koning,Paul A., Thermal interface apparatus, systems, and methods.
  26. Cheng,Ching Tai; Cheng,Nien Tien, Thermal interface material.
  27. White, Bryan M.; Koning, Paul A.; Zhang, Yuegang; Garner, C. M., Thermal intermediate apparatus, systems, and methods.
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