초록 ▼

An oil-pump-screen (1) cleaning method and apparatus with which an oil pan (3) of an internal-combustion engine (2) is drained by removal of a drain plug (7) from a drain aperture (15); the drain plug is reinserted in the drain aperture; a measured amount of a predetermined carbon-disintegrative liq

An oil-pump-screen (1) cleaning method and apparatus with which an oil pan (3) of an internal-combustion engine (2) is drained by removal of a drain plug (7) from a drain aperture (15); the drain plug is reinserted in the drain aperture; a measured amount of a predetermined carbon-disintegrative liquid is put in the oil pan, preferably through a dipstick tube (10), to immerse the oil-pump pickup screen, but not the oil pump (41) without contacting engine bearings, gaskets, or other engine components that could be deteriorated or otherwise damaged by the carbon-disintegrative liquid. The cleaner liquid is left in the oil pan long enough, preferably about one hour, for it to disintegrate and dislodge all carbonic and other material from the oil-pump pickup screen while not running the engine or otherwise conveying the carbon-disintegrative liquid to other parts of the engine. The oil pan is drained to remove the cleaner liquid, the drain plug is replaced and flush liquid is put into the oil pan where it is left for about forty-five minutes. The oil pan is then drained and filled with new engine oil or other liquid lubricant. A clean-run oil filter (5), which can be the old oil filter, is left in or put into the oil-filter cannister (6) while the engine is run for about two-to-ten minutes. Then, the oil filter is replaced with a new one and the oil level is adjusted to complete the method.

대표청구항 ▼

An oil-pump-screen (1) cleaning method and apparatus with which an oil pan (3) of an internal-combustion engine (2) is drained by removal of a drain plug (7) from a drain aperture (15); the drain plug is reinserted in the drain aperture; a measured amount of a predetermined carbon-disintegrative liq

An oil-pump-screen (1) cleaning method and apparatus with which an oil pan (3) of an internal-combustion engine (2) is drained by removal of a drain plug (7) from a drain aperture (15); the drain plug is reinserted in the drain aperture; a measured amount of a predetermined carbon-disintegrative liquid is put in the oil pan, preferably through a dipstick tube (10), to immerse the oil-pump pickup screen, but not the oil pump (41) without contacting engine bearings, gaskets, or other engine components that could be deteriorated or otherwise damaged by the carbon-disintegrative liquid. The cleaner liquid is left in the oil pan long enough, preferably about one hour, for it to disintegrate and dislodge all carbonic and other material from the oil-pump pickup screen while not running the engine or otherwise conveying the carbon-disintegrative liquid to other parts of the engine. The oil pan is drained to remove the cleaner liquid, the drain plug is replaced and flush liquid is put into the oil pan where it is left for about forty-five minutes. The oil pan is then drained and filled with new engine oil or other liquid lubricant. A clean-run oil filter (5), which can be the old oil filter, is left in or put into the oil-filter cannister (6) while the engine is run for about two-to-ten minutes. Then, the oil filter is replaced with a new one and the oil level is adjusted to complete the method. having a wafer-engaging surface for contacting a first surface of the wafer, and the clamp ring having an inclined surface positioned adjacent the central opening, the inclined surface ascending radially outwardly away from the central axis, the latch assembly comprising: a mounting post mountable to the inner peripheral flange of the clamp ring; a latch body rotatably carried on said mounting post, said latch body rotatable through a pivot arc between a latched position and an unlatched position; a clamping roller assembly mounted to said latch body, said clamping roller assembly having a resiliently-biased first rolling element adapted to apply a clamping force to a second surface of the wafer operable to capture the wafer between said first rolling element and the wafer-engaging surface of the inner peripheral flange when said mounting post is mounted to the clamp ring and when said latch body is in the latched position; and a supporting roller assembly mounted to said latch body and having a resiliently-biased second rolling element that rollingly engages the inclined surface when said mounting post is mounted to the clamp ring, wherein the rolling engagement between said second rolling element and the inclined surface separates said first rolling element from the second surface of the wafer in a non-contacting manner until said latch body is substantially in the latched position. 2. The latch assembly of claim 1, wherein said first rolling element is a spherical ball and said clamping roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical ball directed substantially parallel to a longitudinal axis of said sleeve, wherein contact with the second surface of the wafer deflects said spherical ball against the axial spring force from engagement with said open end to thereby apply a clamping force against the second surface of the wafer when said mounting post is mounted to the clamp ring. 3. The latch assembly of claim 1, wherein said second rolling element is a spherical ball and said supporting roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end, and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical ball directed substantially parallel to a longitudinal axis of said sleeve, said spherical ball being deflected against the axial spring force from engagement with said open end to rollingly engage the inclined surface when said mounting post is mounted to the clamp ring. 4. The latch assembly of claim 1, wherein said mounting post is removably mountable to the inner peripheral flange of the clamp ring. 5. The latch assembly of claim 1, wherein said rolling element of said clamping roller assembly engages the second surface of the wafer over an arc length of less than about three angular degrees of the pivot arc near the latched position. 6. The latch assembly of claim 5, wherein said rolling element of said clamping roller assembly engages the second surface of the wafer over an arc length of less than about one angular degree of the pivot arc near the latched position. 7. The latch assembly of claim 1, wherein the position of said clamping roller assembly is axially adjustable within said latch body relative to a plane containing th e wafer, the axial position being adjusted according to the thickness of the wafer to be held for minimizing the arc length of the pivot arc over which said rolling element of said clamping roller assembly applies a clamping force to the second surface of the wafer. 8. The latch assembly of claim 1, wherein the position of said supporting roller assembly is axially adjustable within said latch body relative to a plane containing the inclined surface, the axial position being adjusted so that said first rolling element is rollingly engaged with the inclined surface when said mounting post is mounted to the clamp ring. 9. The latch assembly of claim 1, further comprising a pair of ball bearings disposed between said mounting post and said latch body, said pair of ball bearings significantly reducing the amount of force need to rotate said latch body between the latched position and the unlatched position. 10. The latch assembly of claim 1, wherein said clamping roller assembly and said clamping roller assembly are individually and independently movable relative to said latch body. 11. A clamp ring assembly for a wafer holder of a semiconductor processing machine, the wafer holder having a support frame with an inner peripheral edge defining a first circular opening, the first circular opening being diametrically larger than the diameter of the wafer, the clamp ring assembly comprising: a clamp ring adapted to be attached to the support frame, said clamp ring having a face facing the support frame and an inner peripheral flange defining a second circular opening, said second circular opening being diametrically smaller than the diameter of the wafer and and having a central axis being substantially centered with the first circular opening, said inner peripheral flange having a wafer-engaging surface for contacting a first surface of the wafer when the wafer is inserted into the first circular opening and a plurality of inclined surfaces located adjacent said second central opening and positioned at spaced angular positions about said central axis, each of said plurality of inclined surfaces ascending radially outwardly away from said central axis; and a plurality of latch assemblies mounted to said clamp ring at one of said spaced angular positions, each of said plurality of latch assemblies including: a mounting post mounted to said inner peripheral flange of said clamp ring; a latch body rotatably carried on said mounting post, said latch body rotatable through a pivot arc between a latched position and an unlatched position; a clamping roller assembly mounted to said latch body, said clamping roller assembly having a resiliently-biased first rolling element adapted to apply a clamping force to a second surface of the wafer operable to capture the wafer between said first rolling element and said wafer-engaging surface of said inner peripheral flange when said latch body is in the latched position; and a supporting roller assembly mounted to said latch body and having a resiliently-biased second rolling element that rollingly engages one of said plurality of inclined surfaces, wherein the rolling engagement between said second rolling element and said inclined surface separates said first rolling element from the second surface of the wafer in a non-contacting manner until said latch body is substantially in the latched position. 12. The clamp ring assembly of claim 11, wherein said first rolling element is a spherical ball and said clamping roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical b all directed substantially parallel to a longitudinal axis of said sleeve, wherein contact with the second surface of the wafer deflects said spherical ball against the axial spring force from engagement with said open end to thereby apply a clamping force against the second surface of the wafer. 13. The clamp ring assembly of claim 11, wherein said second rolling element is a spherical ball and said supporting roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical ball directed substantially parallel to a longitudinal axis of said sleeve, said spherical ball being deflected against the axial spring force from engagement with said open end to rollingly engage said inclined surface. 14. The clamp ring assembly of claim 11, wherein each inclined surface includes: a first detent positioned to receive said second rolling element of said supporting roller assembly of one of said plurality of latch assemblies when said latch body is in the latched position; and a second detent positioned to receive said second rolling element of said supporting roller assembly of one of said plurality of latch assemblies when said latch body is in the unlatched position. 15. The clamp ring assembly of claim 11, wherein said latch body has a cylindrical bore into which said mounting post is inserted and said clamp ring includes a mounting member, said mounting member positioned between said mounting post and said cylindrical bore and an outer circumference of said mounting member carrying one of said plurality of inclined surfaces. 16. The clamp ring assembly of claim 11, wherein said mounting post is removably mountable to said clamp ring. 17. The clamp ring assembly of claim 11, wherein said first rolling element contacts the second surface of the wafer over an arc length of less than about three angular degrees of the pivot arc near the latched position. 18. The clamp ring assembly of claim 17, wherein said first rolling element contacts the second surface of the wafer over an arc length of less than about one angular degree of the pivot arc near the latched position. 19. The clamp ring assembly of claim 11, wherein an axial position of said clamping roller assembly is axially adjustable within said latch body relative to a plane containing the wafer, the axial position being adjusted according to the thickness of the wafer to be held by the wafer holder for minimizing the arc length of the pivot arc over which said first rolling element applies a clamping force to the second surface of the wafer. 20. The clamp ring assembly of claim 11, wherein each of said plurality of latch assemblies is positioned on said clamp ring such that said latch body does not occlude the first circular opening when said latch body is oriented in the unlatched position. 21. The clamp ring assembly of claim 11, wherein each of said plurality of latch assemblies further comprises a pair of ball bearings disposed between said mounting post and said latch body, said pair of ball bearings significantly reducing the amount of force need to rotate said latch body between the latched and the unlatched positions. 22. The clamp ring of claim 11, wherein said clamping roller assembly and said clamping roller assembly are individually and independently movable relative to said latch body. 23. A wafer holder for holding a wafer in a semiconductor processing machine, comprising: a support frame having an inner peripheral edge defining a first circular opening, said first circular opening being diametrically larger than the diameter of the wafer and having a central axis; a clamp ring attached to said support frame, said clamp ring having a face facing said support frame and an inner peripheral flange defining a second circular opening, said second circular opening being diametrically smaller than the diameter of the wafer and being substantially centered with said central axis, said inner peripheral flange having a wafer-engaging surface for contacting a first surface of the wafer when the wafer is inserted into said first opening and a plurality of inclined surfaces located adjacent said first opening and positioned at spaced angular positions about said central axis, each of said plurality of inclined surfaces ascending radially outwardly away from said central axis; and a plurality of latch assemblies mounted to said clamp ring at one of said spaced angular positions, each of said plurality of latch assemblies including: a mounting post mounted to said inner peripheral flange of said clamp ring; a latch body rotatably carried on said mounting post, said latch body rotatable through a pivot arc between a latched position and an unlatched position; a clamping roller assembly mounted to said latch body, said clamping roller assembly having a resiliently-biased first rolling element adapted to apply a clamping force to a second surface of the wafer operable to capture the wafer between said first rolling element and said wafer-engaging surface of said inner peripheral flange when said latch body is in the latched position; and a supporting roller assembly mounted to said latch body and having a resiliently-biased second rolling element that rollingly engages one of said plurality of inclined surfaces, wherein the rolling engagement between said second rolling element and said inclined surface separates said first rolling element from the second surface of the wafer in a non-contacting manner until said latch body is substantially in the latched position. 24. The wafer holder of claim 23, wherein said first rolling element is a spherical ball and said clamping roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end, and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical ball directed substantially parallel to a longitudinal axis of said sleeve, wherein contact with the second surface of the wafer deflects said spherical ball against the axial spring force from engagement with said open end to thereby apply a clamping force against the second surface of the wafer. 25. The wafer holder of claim 23, wherein said second rolling element is a spherical ball and said supporting roller assembly includes a compression spring and a thin-walled sleeve, said sleeve having a closed end, a frustoconical inwardly-tapered open end and a hollow interior extending longitudinally between said open and closed ends, said spherical ball captured within said hollow interior and engaging said open end, and said compression spring positioned within said hollow interior between said closed end and said spherical ball for applying an axial spring force to said spherical ball directed substantially parallel to a longitudinal axis of said sleeve, said spherical ball being deflected against the axial spring force from engagement with said open end to rollingly engage said inclined surface. 26. The wafer holder of claim 23, wherein each of said plurality of inclined surfaces includes: a first detent positioned to receive said second rolling element of said supporting roller assembly of one of said plurality of latch assemblies when each latch body is in the latched position; and a second detent positioned to receive said second roll