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A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable po

A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together. A molding method includes the steps of providing the molding apparatus, placing the release films in the mold cavities, clamping the release films to one of the mold chases, and then injecting the molding compound into the mold cavities.

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A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable po

A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together. A molding method includes the steps of providing the molding apparatus, placing the release films in the mold cavities, clamping the release films to one of the mold chases, and then injecting the molding compound into the mold cavities. the seam tool about the seam region so that the resilient material on the inside surface of the rigid backing contacts the seam region; and introducing weld-forming material into the injection port to form a weld. 13. The method according to claim 12 where the pattern segments are coupled to a receiver. 14. The method according to claim 12 where the process is computer controlled. 15. The method according to claim 12 where the weld-forming material is selected from the group consisting of unfilled wax, filled wax, pattern wax, glue wax and gate wax. 16. The method according to claim 12 where the weld-forming material is gate wax. 17. The method according to claim 12 where the seam tool includes an injection fitting operably coupled thereto, the injection fitting having a diaphragm, the method further comprising: introducing a weld-forming-material injection nozzle through the diaphragm; and introducing weld-forming material into the seam region. 18. The method according to claim 17 where the injection nozzle is fitted with a depth stop for regulating injection nozzle penetration through the injection fitting. 19. The method according to claim 12 further comprising pulling a vacuum to facilitate introduction of weld-forming material into the seam region. 20. A method for forming a wax weld between investment casting pattern segments, comprising: providing at least two investment casting pattern segments; positioning the investment casting pattern segments adjacent one another to define a seam region therebetween; providing a seam tool for positioning about the seam region defined by adjacently positioned investment casting pattern segments, the seam tool comprising a rigid backing and pattern segment clamping means for clamping the seam tool to the pattern segments, at least one of the rigid backing and the clamping means including an injection port for receiving weld-forming material and an outlet port; clamping the seam tool about the seam region; and introducing weld-forming material into the injection port. 21. The method according to claim 20 where the clamping means include seal means. 22. The method according to claim 21 where the seal means are formed from a resilient material. 23. The method according to claim 21 where the seal means include a compensating groove. 24. The method according to claim 20 where the seam tool includes plural injection ports fluidly coupled to plural outlet ports. 25. A fitting for an injection port in a seam tool, the fitting comprising a wall having a first substantially planar surface, a recessed portion for receiving an injection nozzle, and an upwardly extending valve portion sized for coupling to an injection port, the valve having a top wall that defines a diaphragm. 26. A seam tool for forming welds between adjacent investment casting pattern segments, comprising: a rigid backing configured to be positioned about a seam region defined by at least two investment casting pattern segments adjacent one another, the rigid backing further including an injection port and a gas outlet port; and a resilient lining on a surface of the rigid backing which contacts and forms a seal with at least one surface of a pattern segment, the resilient lining further defining an air bladder fluidly coupled to an air injection port. 27. A seam tool for forming welds between adjacent pattern segments, comprising: a rigid backing configured to be positioned about a seam region defined by at least two pattern segments adjacent one another, the rigid backing further including an injection port and an outlet port; and a resilient lining on a surface of the rigid backing for contacting and forming a seal with surfaces of the pattern segments, the resilient lining further including a compensating groove and an air bladder fluidly coupled to an air injection port. 28. A seam tool for forming welds between adjacent investment casting pattern segments, the seam tool comprising: a rigi