초록

An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of electrically conductive bumps.

대표청구항 ▼

1. A method, comprising: depositing a dielectric layer over a top metal layer of a die having one or more power lines and one or more ground lines formed thereon; depositing a passivation layer upon the dielectric layer; creating one or more passivation openings in the dielectric layer and the

1. A method, comprising: depositing a dielectric layer over a top metal layer of a die having one or more power lines and one or more ground lines formed thereon; depositing a passivation layer upon the dielectric layer; creating one or more passivation openings in the dielectric layer and the passivation layer such that a portion of at least one of the power lines and ground lines is exposed; lining the passivation openings with a conductive material; and depositing a plurality of electrically conductive bars on the top surface of the passivation layer that are in contact with the lined passivation openings. 2. The method of claim 1 further comprising: placing an array of solder lands on a substrate; and connecting the die to the substrate such that the array of solder lands mate with the plurality of electrically conductive bars on the die. 3. The method of claim 2 wherein at least one of the electrically conductive bars connects to power. 4. The method of claim 2 wherein at least one of the electrically conductive bars connects to ground. 5. The method of claim 2 wherein the plurality of the electrically conductive bars forms a periphery around the die.