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특허 상세정보

Chip on board package for optical mice and lens cover for the same

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/06    H01L-023/495   
미국특허분류(USC) 257/684; 257/680; 257/697; 257/584; 257/666
출원번호 US-0198982 (2002-07-22)
우선권정보 KR-0024663 (2002-05-06)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Lowe Hauptman Gilman & Berner LLP
인용정보 피인용 횟수 : 21  인용 특허 : 17
초록

Disclosed herein is a chip on board lead package for optical mice and lens cover for the same. A semiconductor chip on board package for optical mice has a board, a semiconductor chip, at least one circuit pattern, at least one bonding wire, and a lens cover. The board has top and bottom surfaces, and a pair of via holes. The semiconductor chip is attached to a center portion on the top surface of the board and provided with a plurality of electrode terminals. The circuit pattern is formed on the top surface of the board. The bonding wire electrically co...

대표
청구항

Disclosed herein is a chip on board lead package for optical mice and lens cover for the same. A semiconductor chip on board package for optical mice has a board, a semiconductor chip, at least one circuit pattern, at least one bonding wire, and a lens cover. The board has top and bottom surfaces, and a pair of via holes. The semiconductor chip is attached to a center portion on the top surface of the board and provided with a plurality of electrode terminals. The circuit pattern is formed on the top surface of the board. The bonding wire electrically co...

이 특허에 인용된 특허 (17)

  1. Victor Kenneth E. (Mountain View CA) Goy Carl A. (Fremont CA). Detector system for optical mouse. USP1990044920260.
  2. Yamaguti Yukio,JPX ; Ikeda Hironobu,JPX. Electronic device. USP2001086271480.
  3. Stevenson David W. (Mesa AZ). Hot alignment assembly method for optoelectronic packages. USP1987034650285.
  4. Ogata Shiro (Nishigyo JPX) Imanaka Koichi (Minami JPX) Goto Hiroshi (Yamatokoriyama JPX) Ito Yoshinori (Takatsuki JPX) Kitajima Kourou (Higashiyodogawa JPX). Light emitting semiconductor device having an optical element. USP1994035296724.
  5. Mahulikar Deepak (Meriden CT). Metal pin grid array package. USP1992045103292.
  6. Kman Stephen Joseph ; Stubecki John Arthur ; Sondej William Richard. Method of forming a pinned module. USP1998025715595.
  7. Montgomery James R. (211 Durham St. Menlo Park CA 94025) Figueroa John A. (P.O. Box 160 Mountain View CA 94042) White George (25785 Bassett La. Los Altos Hills CA 94022). Optical scanner including position sensors. USP1989014797544.
  8. McShane Michael B. (Austin TX) Lin Paul T. (Austin TX) Wilson Howard P. (Austin TX). Packaged semiconductor device having a low cost ceramic PGA package. USP1991045006922.
  9. Dibble Eric P. ; Laine Eric H. ; MacQuarrie Stephen W.. Pin attach structure for an electronic package. USP1999095952716.
  10. Hirata Atsuomi (Nara JPX) Nakamura Yoshihiko (Nishinomiya JPX) Morii Kensaku (Takatsuki JPX). Plastic molded pin grid chip carrier package. USP1989094868638.
  11. Cohn Charles (Wayne NJ). Plastic pin grid array package. USP1992045102829.
  12. Ishida Yoshihiro (Tokorozawa JPX) Komatsu Katsuji (Kawagoe JPX) Mimura Seiichi (Kawagoe JPX) Takenouchi Kikuo (Higashimurayama JPX) Yabe Isao (Tokorozawa JPX) Ichikawa Shingo (Sayama JPX) Shimada Yos. Resin encapsulated pin grid array and method of manufacturing the same. USP1993085233225.
  13. Gross Larry D. ; Cadovius Richard W.,CAX. Semiconductor cap. USP1998085789810.
  14. Crane ; Jr. Stanford W. ; Portuondo Maria M.. Semiconductor chip carrier including an interconnect component interface. USP2000086097086.
  15. Arai Kiyoshi (Fukuoka JPX) Takagi Yoshio (Fukuoka JPX) Iwasa Tatsuya (Fukuoka JPX). Semiconductor device having integral structure of case and external connection terminals. USP1997115686758.
  16. McMahon John Francis. Shared socket multi-chip module and/or piggyback pin grid array package. USP1998035734555.
  17. Chiba Taneaki,JPX. Structure for mounting device on circuit board. USP2000086100585.

이 특허를 인용한 특허 피인용횟수: 21

  1. Nasiri,Steven S.; Liberkowski,Janusz; Chen,Zhenfang; Jarfa,Jeff. Apparatus for holding a fiber array. USP2007097267260.
  2. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  3. Liu, Chin-Lin. Cob module of an optical mouse. USP2015028952896.
  4. Zhou, Yu; Yu, David. Contact structure and production method thereof and probe contact assembly using same. USP2005076917102.
  5. Isoda, Takeshi; Shinoda, Koji. Device module and method of manufacturing the same. USP2018019872409.
  6. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  7. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  8. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  9. Stark, David H. Insulated glazing units. USP2010117832177.
  10. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  11. Okazaki, Tomokazu. Light emitting device. USP2014038678619.
  12. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  13. Isoda, Takeshi; Shinoda, Koji. Method of manufacturing a device module. USP20181210154602.
  14. Cheng, Chia-Chu; Lee, Ya-Lun; Lu, Yu-Wei. Motion-detecting module. USP2010037675027.
  15. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  16. Tang, Jeffrey Yuh Fong; Yang, Tsen Shau; Ni, James Seng Ju. Optical navigator sensor and optical navigator apparatus using the same. USP2010077755029.
  17. Nagata, Michikazu. Optical semiconductor apparatus. USP2015049018747.
  18. Spurlock, Brett A.; Sanders, Steven; Carlisle, Clinton B.. Self-aligning optical sensor package. USP2009077567235.
  19. Nemoto, Kazuhiko. Semiconductor integrated apparatus. USP2005036867366.
  20. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.
  21. Stark, David H.. Wafer-level hermetic micro-device packages. USP2005116962834.