초록 ▼

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

대표청구항 ▼

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation. d so as to define an inside edge of an effective display area; a light-shielding case made from light-shielding material and having an upper edge being formed so as to overlap an area for forming the seal material and a side edge connected to the upper edge and covering side faces of the first, second and third substrates the upper edge has a larger opening than the opening of the light-shielding film, and the light-shielding case accommodates the first substrate the second substrate and the third substrate such that the side edge prevents light from entering from the side faces of the first, second and third substrates; and a non-effective display area formed by the light shielding film and the edge of the light-shielding case. 2. The electronic optical device according to claim 1, a size of the third substrate and one of the second substrate are substantially the same. 3. The electronic optical device according to claim 1, at least an outer surface of the light-shielding film is formed of a light reflection film having an OD value of 2 or more. 4. The electronic optical device according to claim 1, at least an inner surface of the light-shielding film is formed of a light-absorbing film having an OD value of 2 or more. 5. The electronic optical device according to claim 1, further comprising a second light-shielding film provided in an outer surface of the third substrate. 6. The electronic optical device according to claim 1, wherein an inner edge of the light-shielding case and an outer edge of the light-shielding film are at a substantially same position as seen in plan view. 7. An electronic optical device, comprising: a first substrate on a display area of which pixel electrodes are formed, the first substrate having an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of the first substrate; a first light-shielding film provided in an outer surface of the third substrate and with an opposing surface side between the first substrate and the third substrate; the first light-shielding film being formed so as to overlap an area for forming the seal material, and the first light-shielding film having a larger opening than a second light-shielding film; the second light-shielding film provided with an opposing surface side between the first substrate and the second substrate, the second light-shielding film is provided so as to define an effective display area and to expose the area for forming the seal material; a light-shielding case made from light-shielding material and having an edge being formed so as to overlap an area for forming the seal material, the edge is closer to the first light-shielding than to the second light-shielding film and has a larger opening than the opening of the first light-shielding film, and the light-shielding case accommodates the first substrate, the second substrate and the third substrate; and a non-effective display area formed by the light-shielding film, the second light-shielding film and the edge of the light-shielding case. 8. The electronic optical device according to claim 7, a plan-view size of the third substrate and a plan-view size of the second substrate being substantially the same. 9. The electronic optical device according to claim 7, at least an outer surface of at least one of the first and second light-shielding films being formed of a light reflection film having an OD value of 2 or more. 10. The electronic optical device according to claim 7, at least an inner surface of at least one of the first and second light-shielding films being formed of a light-absorbing film having an OD value of 2 or more. 11. An electronic optical device, comprising: a first substrate on which pixel electrodes are formed, the first substrate ha ving an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of at least one of the first substrate and the second substrate, the third substrate having a thickness of at least 1.0 mm; a display area formed more inner side than the seal material; a light-shielding film provided with an opposing surface side between the first substrate and the second substrate, the light-shielding film provided so as to define an effective display area; a light-shielding case that has an edge being formed so as to overlap an area for forming the seal material, the edge has a larger-opening than the opening of the light-shielding film, and the light-shielding case accommodates the first substrate, the second substrate and the third substrate. 12. The electronic optical device according to claim 11, a plan-view size of the third substrate and a plan-view size of the second substrate being substantially the same. 13. The electronic optical device according to claim 11, at least an outer surface of the light-shielding film being formed of a light reflection film having an OD value of 2 or more. 14. The electronic optical device according to claim 11, at least an inner surface of the light-shielding film being formed of a light-absorbing film having an OD value of 2 or more. 15. The electronic optical device according to claim 11, further comprising a second light-shielding film provided on an outer surface of the third substrate. 16. An electronic optical device, comprising: a first substrate on a display area of which pixel electrodes are formed, the first substrate having an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of the first substrate, the third substrate having a thickness of at least 1.0 mm; a first light-shielding film provided in an outer surface of the third substrate and with an opposing surface side between the first substrate and the third substrate; the first light-shielding film being formed so as to overlap an area for forming the seal material; and a second light-shielding film provided with an opposing surface side between the first substrate and the second substrate, the second light-shielding film is provided so as to define an effective display area and to expose the area for forming the seal material. 17. The electronic optical device according to claim 16, a plan-view size of the third substrate and a plan-view size of the second substrate being substantially the same. 18. The electronic optical device according to claim 16, at least an outer surface of at least one of the first and second light-shielding films being formed of a light reflection film having an OD value of 2 or more. 19. The electronic optical device according to claim 16, at least an inner surface of at least one of the first and second light-shielding films being formed of a light-absorbing film having an OD value of 2 or more. 20. An electronic optical device, comprising: a first substrate on which pixel electrodes are formed, the first substrate having an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of at least one of the first substrate and the second substrate; a display area formed more inner side than the seal material; a light-shielding film provided with an opposing surface side between the first substrate and the second substrate , the light-shielding film provided so as to define an effective display area and having an OD value of 2 or more; a light-shielding case that has an edge being formed so as to overlap an area for forming the seal material, the edge has a larger opening than the opening of the light-shielding film, and the light-shielding case accommodates the first substrate, the second substrate and the third substrate. 21. The electronic optical device according to claim 20, a plan-view size of the third substrate and a plan-view size of the second substrate being substantially the same. 22. The electronic optical device according to claim 20, at least an outer surface of the light-shielding film being formed of a light reflection film having an OD value of 2 or more. 23. The electronic optical device according to claim 20, at least an inner surface of the light-shielding film being formed of a light-absorbing film having an OD value of 2 or more. 24. The electronic optical device according to claim 20, further comprising a second light-shielding film provided on an outer surface of the third substrate. 25. An electronic optical device, comprising: a first substrate on a display area of which pixel electrodes are formed, the first substrate having an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of the first substrate; a first light-shielding film provided in an outer surface of the third substrate and with an opposing surface side between the first substrate and the third substrate; the first light-shielding film being formed so as to overlap an area for forming the seal material, at least one of the first and second light-shielding films having an OD value of 2 or more; and a second light-shielding film provided with an opposing surface side between the first substrate and the second substrate, the second light-shielding film is provided so as to define an effective display area and to expose the area for forming the seal material. 26. The electronic optical device according to claim 25, a plan-view size of the third substrate and a plan-view size of the second substrate being substantially the same. 27. The electronic optical device according to claim 25, both of the first and second light-shielding films having the OD value of 2 or more. 28. The electronic optical device according to claim 25, at least an outer surface of the light-shielding film being formed of a light reflection film having the OD value of 2 or more. 29. The electronic optical device according to claims 25, at least an inner surface of the light-shielding film being formed of a light-absorbing film having the OD value of 2 or more. 30. An electronic optical device, comprising: a first substrate on which pixel electrodes are formed, the first substrate having an outer surface; a second substrate opposing the first substrate, the second substrate having an outer surface; an electronic optical material disposed between the second substrate and the first substrate and sealed by a seal material; a third substrate provided at the outer surface of at least one of the first substrate and the second substrate; a display area formed more inner side than the seal material; a light-shielding film provided with an opposing surface side between the first substrate and the second substrate, the light-shielding film provided so as to define an effective display area; a light-shielding case that has an edge being formed so as to overlap an area for forming the seal material, the edge has a larger opening than the opening of the light-shielding film, and the light-shielding case accommodates the first substrate, the second substrate and the third substrate; and at least one adhesive layer adhering the third substrate with at least