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Silica-based slurry 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G09G-001/02
  • G09G-001/07
출원번호 US-0882548 (2001-06-14)
발명자 / 주소
  • Hellring, Stuart D.
  • McCann, Colin P.
  • Kahle, Charles F.
  • Li, Yuzhuo
  • Keleher, Jason
출원인 / 주소
  • PPG Industries Ohio, Inc.
대리인 / 주소
    Marmo, Carol A.
인용정보 피인용 횟수 : 26  인용 특허 : 28

초록 ▼

This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles an

대표청구항 ▼

This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles an

이 특허에 인용된 특허 (28)

  1. Swift Harold E. ; Krivak Thomas G. ; Jones Laurence E., Amorphous precipitated silica characterized by high dispersion in cured organic rubber compositions.
    상세보기
  2. Swift Harold E. ; Krivak Thomas G. ; Jones Laurence E., Amorphous precipitated silica characterized by high dispersion in cured organic rubber compositions.
    상세보기
  3. Krivak Thomas G. ; Jones Larry E., Amorphous precipitated silica having a low proportion of small pores.
    상세보기
  4. Kohyama Katsuhisa (Kita-Kyushu JPX) Kimura Tsuneo (Kita-Kyushu JPX) Kidera Teruo (Fukumamachi JPX) Kajiwara Yukio (Kita-Kyushu JPX), Aqueous dispersion of silicic anhydride and abrasive composition comprising the dispersion.
    상세보기
  5. Grumbine Steven K. ; Streinz Christopher C. ; Mueller Brian L., Composition and slurry useful for metal CMP.
    상세보기
  6. Patkar Shailesh D. ; Swift Harold E. ; Scott William B., Dispersible free flowing particulate silica composition.
    상세보기
  7. Clapp Clarence P. (Danville IL) Torrey George S. (Danville IL), Food release compositions.
    상세보기
  8. Shechter Tal, Forming emulsions.
    상세보기
  9. Maloney James E. (Eagan MN) Oakes Thomas R. (Stillwater MN), Hydrophobic silica or silicate, compositions containing the same and methods for making and using the same.
    상세보기
  10. Grabbe Alexis ; Michalske Terry Arthur ; Smith William Larry, Method for chemical surface modification of fumed silica particles.
    상세보기
  11. Kobayashi Hideki (Chiba JPX) Ohnishi Masayuki (Chiba JPX), Method for modifying the surface of finely divided silica.
    상세보기
  12. Griffith Phillip Joseph,GBX ; Herron William,GBX ; Harkness Brian Robert,GBX ; Taylor Rosemary Margaret,GBX ; Wilson David James,GBX, Method for preparing hydrophobic fumed silica.
    상세보기
  13. Burns Gary Thomas ; Hahn James Richard ; Reese Clifford Carlton, Method for preparing hydrophobic silica gels.
    상세보기
  14. Sasaki Shigeo (Yokkaichi JPX), Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same.
    상세보기
  15. Stoll, Robert W.; MacLaury, Michael R., Method for treating fumed silica.
    상세보기
  16. Muroyama Masakazu,JPX, Method of forming a wiring layer on a semiconductor by polishing with treated slurry.
    상세보기
  17. Griffith Phillip J.,GBX ; Harkness Brian R.,GBX ; Herron William,GBX ; Taylor Rosemary M.,GBX ; Wilson David J.,GBX, Method of preparing hydrophobic precipitated silica.
    상세보기
  18. Sollman Kenneth J. (Brewster NY) Pickwell Robert J. (Mt. Kisco NY) Ranney Maurice W. (Tokyo JPX), Organofunctional silane coupling agent-powder mixtures.
    상세보기
  19. Dew James T. (Jeannette PA) Evans Larry R. (Jeannette PA) Waddell Walter H. (Pittsburgh PA), Particulate amorphous precipitated silica.
    상세보기
  20. Ronay Maria, Polish process and slurry for planarization.
    상세보기
  21. Grumbine Steven K. ; Streinz Christopher C. ; Hoglund Eric W.G., Polishing composition including an inhibitor of tungsten etching.
    상세보기
  22. Kato Hiroshi,JPX ; Hayashi Kazuhiko,JPX ; Kohno Hiroyuki,JPX, Polishing slurries and a process for the production thereof.
    상세보기
  23. Reinhardt Helmut (Rodenkirchen DT) Trebinger Karl (Wesseling DT) Kallrath Gottfried (Wesseling DT), Process for hydrophobizing silicas and silicates with organosilanes.
    상세보기
  24. Laufer ; Siegmar, Process for preparing finely divided hydrophobic oxide particles.
    상세보기
  25. Jansen Rolf-Michael (Kelkheim DEX) Zimmermann Andreas (Griesheim DEX), Process for the preparation of xerogels.
    상세보기
  26. Muller, Karl-Hans; Tailfer, Roland, Shoe cream polish composition.
    상세보기
  27. Kennan Linda D. (Midland MI) Knapp Theodore L. (Midland MI) Monroe Carl M. (Midland MI) Skostins Olgerts (Midland MI), Treated silica for reinforcing silicone elastomer.
    상세보기
  28. Garafalo Theresa A. ; Smith Robert A., Treating process for precipitated silica fillers.
    상세보기

이 특허를 인용한 특허 (26)

  1. Hayashi, Hirokatsu; Fukunaga, Kenji; Fukuda, Kentaro, Cake of easily dispersible precipitated silica.
    상세보기
  2. Sun,Fred F.; Lu,Bin; Lightle,Ethan K.; Wang,Shumin, Coated metal oxide particles for CMP.
    상세보기
  3. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
    상세보기
  4. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
    상세보기
  5. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
    상세보기
  6. Fu, Lin; Dysard, Jeffrey; Grumbine, Steven, Composition for tungsten buffing.
    상세보기
  7. Carter, Phillip; Bogush, Gregory H; Khan, Farhana; Johns, Timothy P; Vacassy, Robert, Compositions and methods for dielectric CMP.
    상세보기
  8. Belmont, James A., Compositions comprising silane modified metal oxides.
    상세보기
  9. Lu, Jiong-Ping; Xia, Changfeng, Copper surface passivation during semiconductor manufacturing.
    상세보기
  10. van Kessel, Theodore G., Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry.
    상세보기
  11. van Kessel, Theodore G., Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry.
    상세보기
  12. Grumbine, Steven; Dysard, Jeffrey, Mixed abrasive tungsten CMP composition.
    상세보기
  13. Ward, William; Whitener, Glenn; Grumbine, Steven; Dysard, Jeffrey, Mixed abrasive tungsten CMP composition.
    상세보기
  14. Yadav, Tapesh, Nano-engineered inks, methods for their manufacture and their applications.
    상세보기
  15. Daley, Jon; Campbell, Kristy A., Phase change current density control structure.
    상세보기
  16. Daley, Jon; Campbell, Kristy A., Phase change current density control structure.
    상세보기
  17. Daley, Jon; Campbell, Kristy A., Phase change current density control structure.
    상세보기
  18. Daley, Jon; Campbell, Kristy A., Phase change current density control structure.
    상세보기
  19. Iwata, Toru; Sugawa, Akira, Polishing composition and method for polishing magnetic disk substrate.
    상세보기
  20. Iwata, Toru; Sugawa, Akira, Polishing composition and method for polishing magnetic disk substrate.
    상세보기
  21. Dysard, Jeffrey; Anjur, Sriram; Grumbine, Steven; White, Daniela; Ward, William, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  22. Grumbine, Steven; Li, Shoutian; Ward, William; Singh, Pankaj; Dysard, Jeffrey, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  23. Chen, Wei; Moyer, Eric Scott; Nguyen, Binh Thanh; Wang, Sheng; Wanous, Mark A.; Zhou, Xiaobing, Polysilane—polysilazane copolymers and methods for their preparation and use.
    상세보기
  24. Swisher,Robert G.; Wang,Alan E.; Allison,William C., Polyurethane urea polishing pad.
    상세보기
  25. Hellring,Stuart D.; McCann,Colin P.; Babu,Suryadevara V.; Li,Yuzhuo; Narayanan,Satish; Auger,Robert L., Silica and silica-based slurry.
    상세보기
  26. Siddiqui,Junaid Ahmed; Compton,Timothy Frederick; Hu,Bin; Richards,Robin Edward, Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole.
    상세보기

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