초록 ▼

A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assemb

A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.

대표청구항 ▼

A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assemb

A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase. inding of the first multibinding compound to the biological substrate and so increasing the binding of the probe compound to the first binding site; (b) determining the amount of probe compound that binds to the first binding site of the biological substrate in step (a); (c) comparing the amount of probe compound determined in step (b) with a pre-determined amount of probe compound that binds to the first binding site when the biological substrate is contacted with the probe compound and the first multibinding binding compound in the absence of the candidate compound or compounds, and identifying as a ligand for a second binding site of the biological substrate a candidate compound that has the effect of increasing the binding of the probe compound to the first binding site of the biological substrate. 10. The method of claim 9, wherein the probe compound is radiolabeled, fluorescent or chemiluminescent. 11. The method of claim 9, wherein the first multibinding compound is present at a concentration in the range of from 5 to 10 times the Kd of the first multibinding compound. 12. The method claim 9, wherein the probe compound is present at a concentration less than the Kdof the probe compound. 13. The method of claim 9, wherein the candidate compound is present at a concentration in the range of from 100 to 1000 μM.