IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0180166
(2002-06-26)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
61 인용 특허 :
28 |
초록
▼
A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The hea
A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
대표청구항
▼
A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The hea
A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate. dimethyl carbonate, dimethyl ketone, acetic acid, and mixtures thereof. 16. The method of claim 15, wherein the oxygenate-containing feedstock comprises methanol or dimethyl ether. 17. The method of claim 16, wherein the oxygenate-containing feedstock comprises methanol. 18. The method of claim 1, wherein the molecular sieve is a silicoaluminophosphate molecular sieve selected from the group consisting of SAPO-5, SAPO-8, SAPO-11, SAPO-16, SAPO-17, SAPO-18, SAPO-20, SAPO-31, SAPO-34, SAPO-35, SAPO-36, SAPO-37, SAPO-40, SAPO-41, SAPO-42, SAPO-44, SAPO-47, SAPO-56, metal containing forms thereof, mixtures thereof, and intergrowths thereof. 19. The method of claim 18, wherein the silicoaluminophosphate molecular sieve is SAPO-34 or SAPO-18. 20. The method of claim 19, wherein the silicoaluminophosphate molecular sieve is SAPO-34. 21. The method of claim 1, wherein the oxygenate-containing feedstock is contacted with the silicoaluminophosphate catalyst at a temperature ranging from 200° C. to 700° C. 22. The method of claim 1, wherein the oxygenate-containing feedstock is contacted with the silicoaluminophosphate catalyst in a reactor at a gas superficial velocity of at least 2 meters per second. 23. A method of inhibiting catalyst coke formation in the manufacture of an olefin-containing product, comprising: contacting an oxygenate-containing feedstock with a silicoaluminophosphate molecular sieve catalyst at an average reactor temperature of from 350 to 550° C. to form the olefin-containing product; separating the olefin-containing product from the catalyst; regenerating a first portion of the separated catalyst; cooling a second portion of the separated catalyst below the average reactor temperature; combining the regenerated and cooled catalyst portions; and contacting the combined catalyst portions with additional oxygenate containing feedstock. 24. The method of claim 23, wherein the cooled portion of the catalyst is at a temperature of from 300° C. to 525° C., and is lower than the average reactor temperature. 25. The method of claim 24, wherein the cooled portion of the catalyst is at least 10° C. lower than the average reactor temperature. 26. The method of claim 25, wherein the cooled portion of the catalyst is at least 20° C. lower than the average reactor temperature. 27. The method of claim 26, wherein the co
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