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Thermal management system and method for electronics system

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0180166 (2002-06-26)
발명자 / 주소
  • Garner, Scott D.
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 61  인용 특허 : 28

초록

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The hea

대표청구항

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The hea

이 특허에 인용된 특허 (28)

  1. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  2. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  3. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  4. Osakabe Hiroyuki (Chita-gun JPX) Kawaguchi Kiyoshi (Toyota JPX) Suzuki Masahiko (Hoi-gun JPX), Cooling apparatus using boiling and condensing refrigerant.
  5. Osakabe Hiroyuki,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Suzuki Manji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  6. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX, Cooling apparatus using boiling and condensing refrigerant.
  7. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Sugito Hajime,JPX ; Kobayashi Kazuo,JPX ; Kadota Shigeru,JPX, Cooling apparatus using boiling and condensing refrigerant.
  8. Iversen Arthur H. (Saratoga CA), Cooling of large high power semi-conductors.
  9. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  10. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  11. LaViolette Kerry D. (Liverpool NY) Uhl Robert F. (Manlius NY) Vinkenvleugel Lucius T. (Eindhoven NLX), Electronics housing with improved heat rejection.
  12. Crowe Lawrence E. (Lindenwood IL), Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling.
  13. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  14. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  15. Lynes Kenneth W. (Lindsay CAX) Nepovim Zdenek (Lindsay CAX), Finned housing.
  16. Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY), Heat pipe cooled electronic circuit card.
  17. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  18. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  19. Berndlmaier Erich (Wappingers Falls NY) Clark Bernard T. (Poughquag NY) Dorler Jack A. (Wappingers Falls NY), Heat transfer structure for integrated circuit package.
  20. Lijoi Bruno (Farmingdale NY) Cirrito Vincent (Massapequa Park NY) Edelstein Fred (Hauppauge NY), Heat-pipe cooled electronic circuit card.
  21. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  22. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  23. Balan Albert L. (Endwell NY), Multileveled electronic assembly with cooling means.
  24. Anderson Timothy Merrill ; Chrysler Gregory Martin ; Chu Richard Chao-Fan, Orientation independent evaporator.
  25. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  26. Ohashi Shigeo (Chiyoda JPX) Kuwabara Heikichi (Minori JPX) Nakajima Tadakatsu (Chiyoda JPX) Nakayama Wataru (Kashiwa JPX) Sato Motohiro (Minori JPX) Kasai Kenichi (Ushiku JPX), Semiconductor cooling apparatus and cooling method thereof.
  27. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.
  28. Grunes Howard E. (Santa Cruz CA) Morrison Dennis J. (Santa Cruz CA), Two-phase thermosyphon heater.

이 특허를 인용한 특허 (61)

  1. Straznicky, Ivan; Power Fardy, Richard Jude, Adjustable height liquid cooler in liquid flow through plate.
  2. Rockenfeller,Uwe, Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection.
  3. Foster, Sr.,Jimmy Grant; June,Michael S.; Makley,Albert Vincent; Matteson,Jason Aaron, Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board.
  4. Rosenfeld, John H.; Minnerly, Kenneth G., Capillary assisted loop thermosiphon apparatus.
  5. Belady, Christian L.; Womack, Christopher C., Cell thermal connector.
  6. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  7. Tozer, Robert; Bash, Cullen; Patel, Chandrakant, Cooling.
  8. Kondo, Yoshihiro; Idei, Akio; Tsubaki, Shigeyasu; Matsushima, Hitoshi; Nakajima, Tadakatsu; Toyoda, Hiroyuki; Hayashi, Tomoo; Saito, Tatsuya; Kato, Takeshi; Ogiro, Kenji, Cooling device and electronic apparatus using the same.
  9. Fonfara,Harald; G��stl,Herbert; Miltkau,Thorsten; Eberl,Markus; Mollik,Ralf, Cooling device for an electronic component, especially for a microprocessor.
  10. Lee, Shih-Chang; Chu, Ming-Lee; Lin, Chih-Hsun, Cooling system for an electronic rack.
  11. Lee, Shih-Chang; Jin, Chi-Hao; Chu, Ming-Lee; Lin, Chih-Hsun, Cooling system for an electronic rack.
  12. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  13. Matsumura, Kazuyuki, Electronic apparatus.
  14. Matsumura, Kazuyuki, Electronic apparatus.
  15. Matsushima, Hitoshi; Nakajima, Tadakatsu; Atarashi, Takayuki; Kondo, Yoshihiro; Toyoda, Hiroyuki; Hayashi, Tomoo; Idei, Akio; Tsubaki, Shigeyasu; Sugiura, Takumi; Kashirajima, Yasuhiro, Electronic apparatus.
  16. Ukegawa, Hiroshi; Liu, Yanghe; Zhou, Feng; Joshi, Shailesh N.; Dede, Ercan, Electronics assemblies incorporating three-dimensional heat flow structures.
  17. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  18. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  19. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  20. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  21. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  22. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  23. Buckman, Clint G.; Seitz, Katrina M.; Bronnenberg, Christofer, Flexible thermal interface for electronics.
  24. Lai,Cheng Tien; Zhou,Zhi Yong; Wen,Jiang Jian, Heat dissipation device.
  25. Huang, Chiu-Mao; Huang, Chang-Mou, Heat dissipation device for communication chassis.
  26. Dhar, Sandeep; Greenwood, Peter James; Gadiyaram, Janaki; Prasad, Manish, Heat transfer system for use with electrical devices and method of operating the same.
  27. Wu, Chi-Jung, Host apparatus with waterproof function and heat dissipation module thereof.
  28. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Integrated thermal systems.
  29. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  30. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  31. Hamman,Brian A., Liquid cooling system.
  32. Ota,Shigemi; Matsushita,Shinji, Liquid cooling system for a rack-mount server system.
  33. Spearing, Ian G.; Schrader, Timothy J, Liquid cooling systems for server applications.
  34. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof.
  35. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  36. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  37. Madison, Jr., Carl T.; Kostraba, Jr., John R., Molded heat sink and method of making same.
  38. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
  39. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  40. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  41. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  42. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes.
  43. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  44. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  45. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, Semiconductor-based porous structure enabled by capillary force.
  46. Bash,Cullen E.; Simon,Glenn C.; Malone,Christopher G., Small form factor cooling system.
  47. Henderson, H. Thurman; Shuja, Ahmed; Parimi, Srinivas; Gerner, Frank M.; Medis, Praveen, System and method of a heat transfer system with an evaporator and a condenser.
  48. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  49. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  50. Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
  51. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E., Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack.
  52. Nordin, Ronald A.; Babu, Surendra Chitti; Bolouri-Saransar, Masud, Thermal management infrastructure for IT equipment in a cabinet.
  53. Garner, Scott D., Thermal management system and method for electronics system.
  54. Garner,Scott D., Thermal management system and method for electronics system.
  55. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  56. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  57. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  58. Shuja, Ahmed, Two-phase cooling for light-emitting devices.
  59. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  60. Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
  61. Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
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