$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Radial folded fin heat sinks and methods of making and using same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0950101 (2001-09-10)
발명자 / 주소
  • Crocker, Michael T.
  • Carter, Daniel P.
  • Byquist, Tod A.
  • Broili, Ben M.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 36  인용 특허 : 30

초록

Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to fol

대표청구항

Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to fol

이 특허에 인용된 특허 (30)

  1. Bortolini James R. ; Farleigh Scott E. ; Grimes Gary J. ; Peck Stephen R. ; Sherman Charles J., Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure.
  2. Chuang Wen-Hao,TWX, Bushing for combining fan and heat sink.
  3. Chiou Ming Der (3F. ; No. 3 ; Alley 11 ; Lane 327 ; Sec. 2 ; Chung Shan Rd. Chung Ho City ; Taipei TWX), CPU heat dissipating fan device.
  4. Sagues, Paul; Sagues, Peter, Combined housing and heat sink for electronic engine control system components.
  5. Guy R. Wagner, Cooling apparatus for electronic devices.
  6. Hanzlik Steven E. ; Hansen Michael A. ; Wagner Guy R., Cooling apparatus for electronic devices.
  7. Wagner Guy R., Cooling device and method.
  8. Kiefer James R., Electronic control with heat sink.
  9. Azar Kaveh, Enhanced cooling of a heat dissipating circuit element.
  10. Wagner Guy R., Fan assisted heat sink device.
  11. Wagner Guy R., Fan assisted heat sink device.
  12. Goetz ; Jr. Edward E. (27935 Quail Hollow Ct. Farmington Hills MI 48331), Fin strip and heat exchanger construction.
  13. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  14. Matsunaga Katsuki (Kawasaki JPX) Kojima Yasushi (Kawasaki JPX) Yamazaki Naoya (Kawasaki JPX) Yoshida Kiyoshi (Kawasaki JPX) Hoshino Yoshinori (Kawasaki JPX), Heat radiating apparatus for semiconductor device.
  15. Checchetti Maurizio,ITX, Heat sink.
  16. Higgins ; III Leo M. (Middleboro MA), Heat sink apparatus with an air deflection member.
  17. Gabuzda Paul G. (Laguna Beach CA), Heat sink device assembly for encumbered IC package.
  18. Dean Ronald P., Heat sink device having radial heat and airflow paths.
  19. Goodman Lloyd Jack ; Chiu Chai-Pin ; Watwe Abhay W. ; Viswanath Ram, Heat sink with a heat pipe for spreading of heat.
  20. Noriyasu Sasa JP; Toshiki Ogawara JP; Michinori Watanabe JP; Haruhisa Maruyama JP, Heat sink-equipped cooling apparatus.
  21. Toshiki Ogawara JP; Haruhisa Maruyama JP; Michinori Watanabe JP; Noriyasu Sasa JP, Heat sink-equipped cooling apparatus.
  22. Gardner Susannah ; Chu Herman Wai-Tong ; Bertolami Gwen M., Heat transfer device for a retention assembly.
  23. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  24. Barker ; III Charles R. (Harvard MA) Olson Richard E. (Boylston MA) Lindquist Stephen E. (Boylston MA) Hartsarich Massimo (Kunzelsau DEX) Cease David A. (Avon CT) Sobolewski Robert S. (Woodbury CT), High performance fan heatsink assembly.
  25. Mira Ali (San Jose CA), High performance spiral heat sink.
  26. Miki Isao (Shimizu JPX) Kawai Toshiyuki (Shimizu JPX), Method for producing profiled product having fins.
  27. Hideyuki Miyahara JP, Method of forming a hollow pole projecting on a plate and a method of manufacturing a heat sink using said method.
  28. Brady Kevin J. (Millington NJ) Cohn Charles (Wayne NJ), Pin-fin heat sink.
  29. Wakabayashi Tetsushi (Yokohama JPX) Sugimoto Masahiro (Yokosuka JPX) Muratake Kiyoshi (Kawasaki JPX), Semiconductor device having radiator.
  30. Nakajima Hirofumi,JPX, Semiconductor module for microprocessor.

이 특허를 인용한 특허 (36)

  1. Kaslusky, Scott F.; St. Rock, Brian; Lee, Jaeseon; Jiang, Yirong, Active structures for heat exchanger.
  2. Ruud, Alan J.; Wilcox, Kurt S.; Walczak, Steven R., Aerodynamic LED light fixture.
  3. Bhatti,Mohinder Singh; Reyzin,Ilya; Ghosh,Debashis, Capillary-assisted compact thermosiphon.
  4. Carter,Daniel P.; Crocker,Michael T.; Broili,Ben M.; Byquist,Tod A.; Llapitan,David J., Electronic assemblies with high capacity heat sinks and methods of manufacture.
  5. Lin, Yu Chen; Xu, Hong Bo, Heat dissipation device.
  6. Liu, Yu-Pin, Heat dissipation device.
  7. Liu, Yu-Pin, Heat dissipation device.
  8. Liu, Yu-Pin, Heat dissipation device.
  9. Mochizuki,Hitoshi; Ogura,Yoshiaki, Heat exchanger element and heat exchanger member for a stirling cycle refrigerator and method of manufacturing such a heat exchanger member.
  10. Clifton, David Wiley, Heat sink.
  11. King, Leslie Charles, Heat sink.
  12. Mochizuki,Masataka, Heat sink.
  13. Shaner,Jeff R., Heat sink.
  14. Yamashita, Takamasa; Otsuki, Takaya; Hirakawa, Akira; Akase, Tatsuya, Heat sink.
  15. Yamashita,Takamasa; Inoue,Yoshinori, Heat sink.
  16. Delano, Andrew Douglas; Rubenstein, Brandon Aaron, Heat sink fin with stator blade.
  17. Mart, Gary K., Heat sink for an LED light fixture.
  18. Wolford,Robert Russell; Foster, Sr.,Jimmy Grant; Hardee,Donna Casteel; Keener,Don Steven, Heat sink made from a singly extruded heatpipe.
  19. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  20. Mart, Gary K.; Newman, Jeffrey, LED light bulb.
  21. Kinnune, Brian; Ruud, Alan J.; Guillien, Wayne; Miletich, Don; Wilcox, Kurt; Schultz, Russell S., LED light fixture.
  22. Kinnune, Brian; Ruud, Alan J.; Wilcox, Kurt; Miletich, Don, LED light fixture.
  23. Kinnune, Brian; Ruud, Alan J.; Wilcox, Kurt; Miletich, Don, LED light fixture.
  24. Wilcox, Kurt S.; Kinnune, Brian; Snell, Nathan; Sorenson, Jeremy; Goldstein, Corey; Medendorp, Jr., Nicholas W., LED light fixture.
  25. Wilcox, Kurt S.; Kinnune, Brian; Sorenson, Jeremy; Goldstein, Corey, LED light fixture.
  26. Kinnune, Brian; Ruud, Alan J.; Wilcox, Kurt; Goelz, David P., LED light fixture with heat-dissipation-related high light output.
  27. Wilcox, Kurt; Bendtsen, Andrew; Quella, Dan, LED light fixtures with arrangement for electrical connection.
  28. Rudd, Alan J.; Wilcox, Kurt S.; Walczak, Steven R.; Guilllien, Wayne, LED lighting fixture.
  29. Ruud, Alan J.; Wilcox, Kurt S.; Walczak, Steven R.; Guillien, Wayne, LED lighting fixture.
  30. Ha, Jeongseok; Hong, Jaepyo; Chang, Hyeuk, Lighting apparatus.
  31. Patkus, Steven; Sieberth, Bernd; Kinnune, Brian, Lighting fixture with flow-through cooling.
  32. St. Rock, Brian; Kaslusky, Scott F., Non-circular radial heat sink.
  33. Yamaoka, Naoto; Yamashita, Takamasa, Radiator, heat sink fan, and radiator manufacturing method.
  34. Rivas,Nelson; Abdale,Joseph, Spherical heat sink.
  35. Barr,Andrew Harvey; Barsun,Stephan Karl; Dobbs,Robert William, System and method for heat dissipation and air flow redirection in a chassis.
  36. Hegde,Shankar, Twin fin arrayed cooling device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로