초록 ▼

Substrate positioning and substrate transporting are processed in parallel, thereby reducing substrate transfer apparatus wait time and improving substrate processing throughput. A substrate transfer apparatus 1 is configured in a single unit, a plural number of wafers W prior to notch alignment is

Substrate positioning and substrate transporting are processed in parallel, thereby reducing substrate transfer apparatus wait time and improving substrate processing throughput. A substrate transfer apparatus 1 is configured in a single unit, a plural number of wafers W prior to notch alignment is transported at one time from a substrate accommodating container to a substrate alignment apparatus 22, and the plural number of notch aligned wafers is transported from the substrate alignment apparatus 22 to a boat 21. Two stages (upper and lower) of notch alignment units 4 and 5 that configure the substrate alignment apparatus 22 operate independently, and are capable of performing notch alignment, in total, on a number of wafers to be processed that is twice the number of wafers transported at one time by the substrate transfer apparatus 1. While notch alignment is being performed in the one notch alignment unit 4, notch aligned wafers W are transported by the substrate transfer apparatus from the other notch alignment unit 5 to the boat 21, and then wafers prior to notch alignment are transported from the substrate accommodating container to the other notch alignment unit 5.

대표청구항 ▼

Substrate positioning and substrate transporting are processed in parallel, thereby reducing substrate transfer apparatus wait time and improving substrate processing throughput. A substrate transfer apparatus 1 is configured in a single unit, a plural number of wafers W prior to notch alignment is

Substrate positioning and substrate transporting are processed in parallel, thereby reducing substrate transfer apparatus wait time and improving substrate processing throughput. A substrate transfer apparatus 1 is configured in a single unit, a plural number of wafers W prior to notch alignment is transported at one time from a substrate accommodating container to a substrate alignment apparatus 22, and the plural number of notch aligned wafers is transported from the substrate alignment apparatus 22 to a boat 21. Two stages (upper and lower) of notch alignment units 4 and 5 that configure the substrate alignment apparatus 22 operate independently, and are capable of performing notch alignment, in total, on a number of wafers to be processed that is twice the number of wafers transported at one time by the substrate transfer apparatus 1. While notch alignment is being performed in the one notch alignment unit 4, notch aligned wafers W are transported by the substrate transfer apparatus from the other notch alignment unit 5 to the boat 21, and then wafers prior to notch alignment are transported from the substrate accommodating container to the other notch alignment unit 5. oint and a machining unit end point; sets machining data including at least machining speed data for each of the machining units; calculates an arrival time at each of the inflection points based on the machining speed data; calculates a position of at least one of the workpiece and the tool at each of the inflection points; sets a rotation angle position of the workpiece corresponding to the arrival time as an accumulated count value for each of the machining units; and thereby outputs a command to the driving means for controlling the movement of at least one of the workpiece and the tool according to the calculated position of at least one of the workpiece and the tool and the set accumulated count value. city than said model layer. 13. The method according to claim 12 wherein said support layer includes at least a plurality of release blocks. 14. The method of claim 1, comprising repeating said dispensing and combining steps to construct multiple layers of a three-dimensional model. 15. The method of claim 1, comprising combining said first and second photopolymers to produce a support layer. 16. The method of claim 1, comprising combining said first and second photopolymer materials to produce a model layer. 17. The method of claim 1, comprising combining said first and second photopolymers to produce a release layer. 18. The method according to claim 1, comprising: combining said first and second photopolymers to produce a support layer; and combining said first and second photopolymers to produce a model layer, the support layer having a lower modulus of elasticity than the model layer. 19. The method according to claim 1, comprising: combining said first and second photopolymers to produce a release layer; and combining said first and second photopolymers to produce a model layer, the release layer having a lower modulus of elasticity than the model layer. 20. A system for three-dimensional printing of a model, the system comprising: at least one print head; at least first and second dispensers connected to said at least one printing head for dispensing at least first and second photopolymers respectively in variably selectable proportions, said first photopolymer and said second photopolymer being different; and a controller connected to said at least one printing head to cause said at least one printing head to dispense said first photopolymer and second photopolymer, so that said first photopolymer and second photopolymer mix within the same layer to produce a layer of third material, said third material being a photopolymer layer having prerequisite hardness and modulus of elasicity. 21. The system according to claim 20 further comprising an electromagnetic radiation source for curing at least one of said photopolymers. 22. The system according to claim 21 wherein said first photopolymer has a first modulus of elasticity and said second photopolymer has a second modulus of elasticity and said electromagnetic radiation source includes at least: a first electromagnetic radiation source for curing said first photopolymer for a first period of time and at a first radiation wavelength to obtain said first modulus of elasticity; and a second electromagnetic radiation source for curing said second photopolymer for a second period of time and at a second radiation wavelength to obtain said second modulus of elasticity. 23. The system according to claim 20, wherein said printing head includes first and second printing heads and wherein said first photopolymer and second photopolymer are dispensed from first and second printing heads, respectively. 24. The system according to claim 20 further comprising a positioning apparatus coupled to said controller for selectively positioning said first and second printing heads by commands from said controller. 25. The system according to claim 20, wherein said first and second photopolymers are curable by the application of any one of a group including ultra-violet radiation, infra red radiation and E-beam. 26. The system according to claim 20, wherein said first photopolymer is a different color than said second photopolymer. 27. The system according to claim 20, wherein said first photopolymer is transparent. 28. The system according to claim 20, wherein said second photopolymer is transparent. 29. The system according to claim 20 wherein first and second photopolymers are combined into build layers and support layers, said build layers and support layers each including differing proportions of said first and said second photopolymers. 30. The system of claim 20, wherein said controller is operative to cause said at least one printing head to dispense said fir