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Cooler for electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/467
출원번호 US-0890776 (2001-08-06)
우선권정보 RU-1999127326 (1999-12-09); RU-2000111919 (2000-05-05); RU-2000115814 (2000-06-09)
국제출원번호 PCT/US00/33145 (2000-12-07)
국제공개번호 WO01/43519 (2001-06-14)
발명자 / 주소
  • Lopatinsky, Edward
  • Fedoseyev, Lev A.
  • Fedosov, Yuriy Igorevich
  • Askhatov, Nil
출원인 / 주소
  • Advanced Rotary Systems, LLC
대리인 / 주소
    Frishauf, Holtz, Goodman & Chick, P.C.
인용정보 피인용 횟수 : 29  인용 특허 : 15

초록

An apparatus and method for a centrifugal pump (1) for pumping sensitive biological fluids which includes (i) an integral impeller and rotor (21) which is entirely supported and rotated magnetically by electromagnets (52, 54), (ii) a pump housing (12, 14) and arcuate passages for fluid flow and cont

대표청구항

An apparatus and method for a centrifugal pump (1) for pumping sensitive biological fluids which includes (i) an integral impeller and rotor (21) which is entirely supported and rotated magnetically by electromagnets (52, 54), (ii) a pump housing (12, 14) and arcuate passages for fluid flow and cont

이 특허에 인용된 특허 (15)

  1. Hsieh Hsin M. (No. 6 ; E. Sec. ; Chiao Nan Li ; Industrial 6th Rd. Pingtung City ; Pingtung Hsien TWX), Cooling device for central processing unit.
  2. Kodama Nobumasa (Ueda JPX) Ogawara Toshiki (Chiisagata-gun JPX), Electronic component cooling apparatus.
  3. Herbert Edward, Fan with heat sink using stamped heat sink fins.
  4. Lopatinsky Edward, Fan with magnetic blades.
  5. Negishi Masataka (Urawa JPX), Flow generating apparatus and method of manufacturing the apparatus.
  6. Webster ; Jr. Leo H. ; Mok Lawrence Shungwei ; Kamath Vinod ; Mansuria Mohanlal S., Forced air cooling apparatus for semiconductor chips.
  7. Katsui Tadashi (Kawasaki JPX), Heat sink and mounting structure for heat sink.
  8. Amou Mitsuru,JPX ; Mehara Koji,JPX, Heat sink apparatus.
  9. Higgins ; III. Leo M. (Middleboro MA), Heat sink apparatus.
  10. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  11. Barker ; III Charles R. (Harvard MA) Olson Richard E. (Boylston MA) Lindquist Stephen E. (Boylston MA) Hartsarich Massimo (Kunzelsau DEX) Cease David A. (Avon CT) Sobolewski Robert S. (Woodbury CT), High performance fan heatsink assembly.
  12. Mira Ali (San Jose CA), High performance spiral heat sink.
  13. Kitajo Sakae,JPX, Miniaturized cooling fan type heatsink for a semiconductior device.
  14. Lopatinsky Edward L. ; Rosenfield Saveliy T., Rotor drive motor with u-shaped stator cores.
  15. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Staggered radial-fin heat sink device for integrated circuit package.

이 특허를 인용한 특허 (29)

  1. Kaslusky, Scott F.; St. Rock, Brian; Lee, Jaeseon; Jiang, Yirong, Active structures for heat exchanger.
  2. Koplow, Jeffrey P., Axial flow heat exchanger devices and methods for heat transfer using axial flow devices.
  3. Hashimoto,Toshio; Kimura,Toru; Kaneko,Sachiko, Cooling apparatus and electronic equipment.
  4. Bahl,Manish; Mok,Lawrence S., Cooling apparatus for heat generating devices.
  5. Schaff, Ulrich Y.; Koh, Chung-Yan; Sommer, Gregory J., Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation.
  6. Schaff, Ulrich Y.; Sommer, Gregory J.; Singh, Anup K.; Hatch, Anson V., Devices, systems, and methods for conducting sandwich assays using sedimentation.
  7. Koh, Chung-Yan; Schaff, Ulrich Y.; Sommer, Gregory J., Devices, systems, and methods for detecting nucleic acids using sedimentation.
  8. Sommer, Gregory J.; Hatch, Anson V.; Wang, Ying-Chih; Singh, Anup K., Devices, systems, and methods for microscale isoelectric fractionation.
  9. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan.
  10. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan heat sink.
  11. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan sink.
  12. Kaslusky, Scott F.; St. Rock, Brian, Electronics package with radial heat sink and integrated blower.
  13. Qin, Biao, Flat heat pipe radiator and application thereof.
  14. Chang, Bor-Haw; Chou, Chu-Hsien, Heat dissipating module.
  15. Chang, Bor-Haw; Chou, Chu-Hsien, Heat dissipating module.
  16. Chuang, Ping-Yang, Heat dissipation structure.
  17. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  18. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  19. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  20. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  21. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  22. Ma, Mou-Ming; Tseng, Hsiang-Chieh; Lee, Tung-Shan; Liu, Yi-Song; Chou, Chia-Min, Heat-dissipating device.
  23. Bhatti,Mohinder Singh; Ghosh,Debashis; Joshi,Shrikant Mukund, Impingement cooled heat sink with uniformly spaced curved channels.
  24. Tsao, Pei Haw; Pan, Hsin Yu, Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC).
  25. Novotny,Shlomo; Rousmaniere,Arthur S.; Vogel,Marlin, Method and system for cooling electronic components.
  26. St. Rock, Brian; Kaslusky, Scott F., Non-circular radial heat sink.
  27. Wang, Chin Wen; Wang, Pei Choa; Wang, Ching Chung, Planar heat pipe structure.
  28. Williams, Arthur R., Rotating bernoulli heat pump.
  29. Schaff, Ulrich Y.; Sommer, Gregory J.; Singh, Anup K., Systems, devices, and methods for agglutination assays using sedimentation.
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