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특허 상세정보

Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01P-001/00    H01P-003/08    H05K-007/20   
미국특허분류(USC) 333/247; 333/246; 361/704
출원번호 US-0099221 (2002-03-13)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 9  인용 특허 : 13
초록

A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and ha...

대표
청구항

A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and ha...

이 특허에 인용된 특허 (13)

  1. Giannetti William B. (Fall River MA) Hess David G. (Atkinson NH) McCord Stuart J. (Westford MA) Rudd ; III Robert E. (Vergennes VT) Shih Wei-Tei (Yorba Linda CA). Composite enclosure for electronic hardware. USP1996055520976.
  2. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M.. Electronic structure having an embedded pyrolytic graphite heat sink material. USP2000066075701.
  3. Kibler John J. (Lansdale PA) Cassin Thomas G. (Prospectville PA). High conductivity hydrid material for thermal management. USP1994035296310.
  4. Rawal Suraj Prakash. High thermal conductivity plugs for structural panels. USP1999035876831.
  5. Schmidt Detlef ; Pais Martin R.. Hybrid substrate for cooling an electronic component. USP1999095958572.
  6. Browne James M.. Method of making and using thermally conductive joining film. USP1998125849130.
  7. Tanino Noriyuki (Itami JPX). Microwave integrated circuit having a passive circuit substrate mounted on a semiconductor circuit substrate. USP1994105352998.
  8. Kobiki Michihiro (Itami JPX) Yoshida Masahiro (Itami JPX) Ishikawa Takahide (Itami JPX). Microwave monolithic integrated circuit with heat radiating electrode. USP1990094956697.
  9. Makowiecki Daniel M. (Livermore CA) Ramsey Philip B. (Livermore CA) Juntz Robert S. (Hayward CA). Process for the fabrication of aluminum metallized pyrolytic graphite sputtering targets. USP1995075428882.
  10. Heckaman Douglas E. (Indialantic FL) Perkins Gilbert R. (Palm Bay FL) Higman Roger H. (Palm Bay FL). Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing. USP1989124890195.
  11. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH). Semiconductor cooling apparatus. USP1993065224030.
  12. Borkowski Michael T. ; Sikina Thomas V. ; Roman John W.. Solid interface module. USP2001126324755.
  13. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523). Thermally conductive joining film. USP1997125695847.