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A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of

A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or "primitives," that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

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A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of

A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or "primitives," that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization. n said bit error rate specific inspection system includes; signal light transmitting means for generating a light signal according to an electrical signal pattern; interference light transmitting means for generating an interference light according to a disturbance signal having a rectangular pulse waveform; a light coupler for mixing said signal light received from said signal light transmitting means optically with said interference light received from said interference light transmitting means; optical means for setting an optical power ratio (S/X) of an optical power of said signal light to an optical power of said interference light mixed by said light coupler to a predetermined value so as to change an optical power of said mixed light; receiving means for converting said mixed light received from said optical means to an electrical signal so as to be identified and regenerated; and calculating means for measuring a bit error rate of said mixed signal regenerated by said receiving means corresponding to a change of said optical power of said mixed light at said optical power ratio (S/X) set by said optical means, thereby calculating a calculated character of a bit error rate of a signal light to its optical power at said optical power ratio (S/X) according to this measured bit error rate corresponded to said change of said optical power of said mixed light at a measured optical power ratio (S/X), then extrapolating a theoretical character of a bit error rate when no interference light is detected on the basis of the calculated character of said bit error rate of said signal light to its optical power at the measured optical power ratio (S/X) so as to be inspected, wherein the theoretical character of said bit error rate in said calculating means of said bit error rate specific inspection system is obtained on the basis of degradation quantity D of a signal-noise ratio (S/N) obtained with addition of an interference light. 3. A method for manufacturing an optic transmission module according to claim 1 or 2; wherein a character of a bit error rate of 10-13or under is inspected in said inspecting process. 4. A method for manufacturing an optic transmission module, comprising the processes of: (A) manufacturing an optic transmission module provided with a transmitter and a receiver and employed for a light transmission system; and (B) inspecting said optic transmission module manufactured in said manufacturing process for a bit error rate; wherein said inspection process is conducted such that said transmitter receives a pattern signal and outputs a signal light, which is then mixed with a pulse-like interference light into a light signal, then said receiver receives said mixed light signal and outputs an output signal, which is then measured, thereby calculating a bit error rate of said measured output signal to said pattern signal inputted to said transmitter and from said calculated bit error rate calculating a theoretical bit error rate of an output signal from said receiver when said interference light is eliminated from said pattern signal inputted to said transmitter, wherein a pulse frequency of said pulse-like interference light is smaller than that of a signal of said light signal output from said transmitter. 5. A method for manufacturing an optic transmission module according to claim 4; wherein said receiver is a standard master module or a known module and both of said measured bit error rate and said calculated bit error rate are employed for a bit error rate of said transmitter in said inspection process. 6. A method for manufacturing an optic transmission module according to claim 4; wherein said transmitter is a standard master module or a known module and both of said measured bit error rate and said calculated bit error rate are employed for a bit error rate of said receiver in said inspection process. 7. A method for manufacturing an optic transmission mo dule, comprising the processes of: (A) manufacturing an optic transmission module employed for a light transmission system; and (B) inspecting said optic transmission module for a bit error rate; wherein said inspecting process makes it possible that; a pattern signal is entered to a transmitter of said optic transmission module; a signal light output from said transmitter according to an input of said pattern signal is mixed with a pulse-like interference light having a frequency smaller than a signal frequency of said signal light to obtain mixed light; said mixed light is entered to a receiver of said optic transmission module via an optical fiber; an output signal from said receiver that has received said mixed light is measured, thereby finding a bit error rate of a pattern of said output signal from said receiver to said pattern signal, then extrapolating a theoretical bit error rate of an output signal from said receiver to a pattern signal entered to said transmitter when said interference light is eliminated from said optic transmission module. 8. A method for manufacturing an optic transmission module according to any of claim 1, 2, 4 or 7; wherein said method further includes a process of: feeding back information related to a bit error rate of a pattern inspected in said inspection process to said manufacturing process. 9. A method for inspecting a character of a bit error rate, comprising the steps of: (A) entering a signal pattern to a transmitter of an optic transmission module, thereby generating a light signal from said transmitter; (B) generating a digital light signal whose frequency is lower than that of said light signal; (C) mixing said light signal with said digital light signal into a mixed light signal; (D) entering said mixed light signal to a receiver, thereby outputting a received signal from said receiver; (E) finding a measured bit error rate of a received signal pattern of said received signal to said signal pattern entered to said transmitter; and (F) extrapolating a theoretical bit error rate of the received signal pattern to said signal pattern entered to said transmitter according to said measured bit error rate when said digital light signal is not mixed. 10. A bit error rate specific inspection system employed for a light transmission system and composed so as to inspect an inspection object for a character of a bit error rate, comprising: signal light transmitting means for generating a light signal according to an electrical signal pattern; interference light transmitting means for generating an interference light according to a disturbance signal having a rectangular pulse waveform; a light coupler for mixing said light signal received from said signal light transmitting means with said interference light received from said interference light transmitting means, to obtain a mixed light; optical means for changing an optical power of said mixed light received from said light coupler; receiving means for converting said mixed light received from said optical means to an electrical signal so as to be identified and regenerated; and calculating means for measuring a measured bit error rate of said mixed signal regenerated by said receiving means corresponding to said optical power of said mixed light changed by said optical means, thereby calculating a measured character of a bit error rate of a signal light to its optical power according to this measured bit error rate corresponded to said change of said optical power of said mixed light, then extrapolating a theoretical character of a bit error rate when no interference light is detected on the basis of the measured character of said bit error rate of said signal light to its optical power so as to be inspected, wherein the theoretical character of said bit error rate is obtained in said calculating means on the basis of degradation quantity D of a signal-noise ratio (S/N) obtained with addition of an