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A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material lay

A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.

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1. A heat dissipating structure for positioning between an electronic component and a heat dissipating component, the heat dissipating structure comprising a graphite sheet; and a layer comprising a heat conducting material provided on at least one surface of said graphite sheet, wherein said h

1. A heat dissipating structure for positioning between an electronic component and a heat dissipating component, the heat dissipating structure comprising a graphite sheet; and a layer comprising a heat conducting material provided on at least one surface of said graphite sheet, wherein said heating conducting material has no fluidity at room temperature when said electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under influence of heat generated during operation of said electronic component; said heat conducting material comprises a silicone resin, which forms a matrix phase, and a heat conducting filler; and said silicone resin comprises T units represented by the formula RSiO3/2and D units represented by the formula R2SiO, where R stands for a monovalent hydrocarbon group of 1 to 10 carbon atoms, at a ratio of T units to D units ranging from 10:90 to 90:10. 2. The heat dissipating structure according to claim 1, wherein said heat conducting material undergoes a reduction in viscosity, softens or melts, within a temperature range from 40 to 100° C. 3. The heat dissipating structure according to claim 1, wherein a thickness of said graphite sheet is within a range from 0.01 to 1.5 mm. 4. The heat dissipating structure according to claim 3, wherein a thickness of said graphite sheet is within a range from 0.1 to 1.0 mm. 5. The heat dissipating structure according to claim 1, wherein an average particle diameter of said heat conducting filler is within a range from 0.1 to 100 μm. 6. The heat dissipating structure according to claim 5, wherein an average particle diameter of said heat conducting filler is within a range from 0.1 to 25 μm. 7. The heat dissipating structure according to claim 1, wherein particles of said heat conducting filler are a spherical shape. 8. The heat dissipating structure according to claim 1, wherein a thickness of said layer comprising a heat conducting material is within a range from 0.005 mm to 1.0 mm. 9. The heat dissipating structure according to claim 1, wherein said silicone resin is a copolymer comprising the T units and the D units. 10. The heat dissipating structure according to claim 1, wherein said silicone resin comprises a polymer incorporating the T units, and a silicone oil or a silicone gum formed of the D units. 11. The heat dissipating structure according to claim 1, wherein said ratio of T units to D units ranges from 10:80 to 80:20. 12. A heat dissipating structure for positioning between an electronic component and a heat dissipating component, the heat dissipating structure comprising a graphite sheet; and a layer consisting of a heat conducting material provided on at least one surface of said graphite sheet, wherein said heating conducting material has no fluidity at room temperature when said electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under influence of heat generated during operation of said electronic component; and said heat conducting material consists essentially of a silicone resin, which forms a matrix phase, and a heat conducting filler. 13. The heat dissipating structure according to claim 12, wherein said heat conducting material consists of said silicone resin and said heat conducting filler. 14. A method of making a heat dissipating structure, the method comprising laminating a graphite sheet and a layer comprising a heat conducting material; and producing the heat dissipating structure of claim 1. 15. A method of making a heat dissipating structure, the method comprising laminating a graphite sheet and a layer consisting of a heat conducting material; and producing the heat dissipating structure of claim 12.