초록 ▼

This invention is a method and system for determining whether the engine should be running in a Hybrid Electric Vehicle during vehicle idle conditions. Specifically, a controller determines if the vehicle is in idle and if engine operation is necessary. To determine whether engine operation is neces

This invention is a method and system for determining whether the engine should be running in a Hybrid Electric Vehicle during vehicle idle conditions. Specifically, a controller determines if the vehicle is in idle and if engine operation is necessary. To determine whether engine operation is necessary, the controller determines whether the battery needs charging, whether vacuum needs to be replaced in the climate control system or brake system reservoir, whether the vapor canister requires purging, whether the adaptive fuel tables require fast adapting, whether the engine or catalyst temperatures are unacceptable, or whether the air conditioning has been requested. Once the controller determines that the engine must be running, the controller determines in which control mode to run the engine, either speed control mode (using powertrain controllers) or torque control mode (using a generator and generator controller). Finally, the controller optimizes engine running conditions, to the extent possible depending upon the control mode, to perform any necessary functions during vehicle idle.

대표청구항 ▼

This invention is a method and system for determining whether the engine should be running in a Hybrid Electric Vehicle during vehicle idle conditions. Specifically, a controller determines if the vehicle is in idle and if engine operation is necessary. To determine whether engine operation is neces

This invention is a method and system for determining whether the engine should be running in a Hybrid Electric Vehicle during vehicle idle conditions. Specifically, a controller determines if the vehicle is in idle and if engine operation is necessary. To determine whether engine operation is necessary, the controller determines whether the battery needs charging, whether vacuum needs to be replaced in the climate control system or brake system reservoir, whether the vapor canister requires purging, whether the adaptive fuel tables require fast adapting, whether the engine or catalyst temperatures are unacceptable, or whether the air conditioning has been requested. Once the controller determines that the engine must be running, the controller determines in which control mode to run the engine, either speed control mode (using powertrain controllers) or torque control mode (using a generator and generator controller). Finally, the controller optimizes engine running conditions, to the extent possible depending upon the control mode, to perform any necessary functions during vehicle idle. n said base member further comprises columnar shaped members disposed about said perimeter of said first semiconductor chip. 5. A semiconductor device according to claim 1, wherein said second semiconductor chip is wire-bonded to said substrate. 6. The semiconductor device of claim 1 wherein a size of a surface area of said base member contacting said second semiconductor chip is substantially equal to a size of a surface area of the first semiconductor chip contacting said second semiconductor chip. 7. The semiconductor device of claim 1 wherein said base member includes a surface contacting said second semiconductor chip, a portion of said surface extending beyond an outboard edge of said second semiconductor chip. 8. The semiconductor device of claim 1 further comprising a sealing resin disposed between said base layer and said first semiconductor chip. 9. The semiconductor device of claim 1 wherein said base member has a coefficient of thermal expansion which is different from a coefficient of thermal expansion of at least one of said first and second semiconductor chips. 10. A semiconductor device comprising: a first semiconductor chip mounted on a substrate; a second semiconductor chip directly mounted on the first semiconductor chip with an adhesive, the second semiconductor chip extending beyond a perimeter of the first semiconductor chip; and a non-compliant filler layer provided between the second semiconductor chip and the substrate; wherein the second semiconductor chip is supported by the filler layer. 11. The semiconductor device of claim 10 wherein said filler layer further comprises a thermosetting resin. 12. The semiconductor device of claim 10 wherein said filler layer further comprises a non-conduction material. 13. The semiconductor device of claim 12 wherein said filler layer further comprises a die-bonding material. 14. The semiconductor device of claim 10 wherein a size of a surface area of said filler layer contacting said second semiconductor chip is substantially equal to a size of a surface area of the first semiconductor chip contacting said second semiconductor chip. 15. The semiconductor device of claim 10 wherein a size of a surface area of said filler layer contacting said second semiconductor chip is greater than a size of a surface area of the first semiconductor chip contacting said second semiconductor chip. 16. The semiconductor device of claim 10 wherein said filler layer includes a portion disposed between said first semiconductor chip and said substrate. 17. The semiconductor device of claim 16 wherein a viscosity of said portion of said filler layer disposed between said first semiconductor chip and said substrate is lower than a viscosity of another portion of said filler layer disposed outboard of said first semiconductor chip between said second semiconductor chip and said substrate.