초록 ▼

The present application discloses plug and play modular mission payloads in the context of aerial vehicles, and a supporting open system architecture that moves the control function of mission payloads away from the ground station and into the aerial vehicle. The plug-and-play (PnP) modular mission

The present application discloses plug and play modular mission payloads in the context of aerial vehicles, and a supporting open system architecture that moves the control function of mission payloads away from the ground station and into the aerial vehicle. The plug-and-play (PnP) modular mission payloads and web-based payload interface software resides in a payload computer in the vehicle, and this is networked via a uniform resource locator (URL) addressing scheme to a ground control station. Consequently, when new payload types are added to the system, integration issues and costs are minimized.

대표청구항 ▼

The present application discloses plug and play modular mission payloads in the context of aerial vehicles, and a supporting open system architecture that moves the control function of mission payloads away from the ground station and into the aerial vehicle. The plug-and-play (PnP) modular mission

The present application discloses plug and play modular mission payloads in the context of aerial vehicles, and a supporting open system architecture that moves the control function of mission payloads away from the ground station and into the aerial vehicle. The plug-and-play (PnP) modular mission payloads and web-based payload interface software resides in a payload computer in the vehicle, and this is networked via a uniform resource locator (URL) addressing scheme to a ground control station. Consequently, when new payload types are added to the system, integration issues and costs are minimized. irst superconducting loop, wherein said second pickup coil has a second input coil in said second loop for inputting magnetic flux generated by a second current induced in said second pickup coil by the magnetic field in the z-direction into said second superconducting loop. 4. A gradiometer integrated with pickup coils comprising: a first, a second, a third and a fourth pickup coils fabricated of a thin film on a substrate; a first differential SQUID fabricated of a thin film on said substrate and magnetically coupled to said first and second pickup coils, said first differential SQUID including a first and a second superconducting loop connected in series or in parallel; and a second differential SQUID fabricated of a thin film on said substrate and magnetically coupled to said third and fourth pickup coils, said second differential SQUID including a third and a forth superconducting loop connected in series or in parallel, wherein a first segment resulting from projecting a segment connecting the center of said first pickup coil with the center of said second pickup coil perpendicularly onto the surface of said substrate overlaps a second segment resulting from projecting a segment connecting the center of said first superconducting loop with the center of said second superconducting loop perpendicularly onto the surface of said substrate, wherein a third segment resulting from projecting a segment connecting the center of said third pickup coil with the center of said fourth pickup coil perpendicularly onto the surface of said substrate overlaps a fourth segment resulting from projecting a segment connecting the center of said third superconducting loop with the center of said fourth superconducting loop perpendicularly onto the surface of said substrate, wherein said first segment and said third segment cross at light angles, wherein a midpoint of said first segment, a midpoint of said second segment, a midpoint of said third segment, and a midpoint of said fourth segment match one another, and wherein said gradiometer integrated with pickup coils detects a field gradient in a z-direction with respect to an x-direction and a y-direction parallel with the surface of said substrate and perpendicular to the z-direction perpendicular to the surface of said substrate. 5. A gradiometer integrated with pickup coi