초록 ▼

A device for holding a plurality of firearm magazines is disclosed. The device includes a single-piece body having a first compartment adapted to receive a first magazine, and a second compartment adapted to receive a second magazine. The first and second compartments are separated by a divider. The

A device for holding a plurality of firearm magazines is disclosed. The device includes a single-piece body having a first compartment adapted to receive a first magazine, and a second compartment adapted to receive a second magazine. The first and second compartments are separated by a divider. The device also optionally includes a first securing member located within a first housing of the divider, and a second securing member located within a second housing of the divider. The first securing member is adapted to engage the first magazine when the first magazine is seated in the first compartment, typically by engaging a groove of the first magazine. Similarly, the second securing member is adapted to engage the second magazine when the second magazine is seated in the second compartment, typically by engaging a groove of the second magazine.

대표청구항 ▼

A device for holding a plurality of firearm magazines is disclosed. The device includes a single-piece body having a first compartment adapted to receive a first magazine, and a second compartment adapted to receive a second magazine. The first and second compartments are separated by a divider. The

A device for holding a plurality of firearm magazines is disclosed. The device includes a single-piece body having a first compartment adapted to receive a first magazine, and a second compartment adapted to receive a second magazine. The first and second compartments are separated by a divider. The device also optionally includes a first securing member located within a first housing of the divider, and a second securing member located within a second housing of the divider. The first securing member is adapted to engage the first magazine when the first magazine is seated in the first compartment, typically by engaging a groove of the first magazine. Similarly, the second securing member is adapted to engage the second magazine when the second magazine is seated in the second compartment, typically by engaging a groove of the second magazine. vable along said measurement axis, wherein said spindle, scale, resilient support and scale substrate are formed integrally through photolithography and etching processes applied to a laminated substrate of Si--SiO2--Si. 2. The scale member according to claim 1, wherein said resilient support comprises a parallel leaf spring that has an anchor, the parallel leaf spring being coupled to said scale substrate through the anchor for supporting said spindle and scale in a state floating from said scale substrate. 3. The scale member according to claim 1, wherein said scale substrate has a groove formed in a proximity of said spindle. 4. The scale member according to claims 1, wherein said scale substrate has a notch formed in a proximity of said spindle. 5. A displacement measuring apparatus, comprising: a scale member including a scale substrate, a spindle arranged coaxially along a measurement axis for receiving a displacement input along said measurement axis, a scale displacing along said measurement axis, wherein the scale moves together with said spindle, and a resilient support for supporting said spindle and scale on said scale substrate, the resilient support movable along said measurement axis, wherein said spindle, scale, resilient support and scale substrate are formed integrally using fine patterning technologies; and a sensor for detecting a displacement of said scale of said scale member along said measurement axis, wherein said sensor includes a sensor substrate, and a detecting device mounted on said sensor substrate for detecting a displacement of said scale, and wherein said scale member has a spacer and couples to said sensor substrate through the spacer so that said scale oppositely spaces a certain gap from said detecting device, wherein said space is formed integrally with said scale member, said spacer and said sensor substrate having an anodic bonding therebetween. 6. The displacement measuring apparatus according to claim 5, wherein said sensor comprises an optical sensor including a light source for providing a light illuminating said scale and a photosensitive device for optically receiving a light from said scale, the optical sensor being configured to form an optical encoder together with said scale member. 7. The displacement measuring apparatus according to claim 5, wherein said sensor comprises an electrostatic capacitance sensor configured to form an electrostatic capacitance encoder together with said scale member. 8. The displacement measuring apparatus according to claim 5, wherein said sensor comprises an induced current sensor configured to form an induced current encoder together with said scale member. 9. The displacement measuring apparatus according to claim 5, wherein said sensor comprises a magnetic sensor configured to form a magnetic encoder together with said scale member. 10. A method of producing a scale member, said member including: a scale substrate, a spindle arranged coaxially along a measurement axis for receiving a displacement input along said measurement axis, a scale displacing along said measurement axis, wherein the scale moves together with said spindle, and a resilient support for supporting said spindle and scale on said scale substrate, the resilient support movable along said measurement axis, wherein said spindle, scale, resilient support and scale substrate are formed integrally using fine patterning technologies, said method comprising: providing a laminated substrate including a first semiconductor substrate, a sacrifice layer and a second semiconductor substrate laminated in this order; performing a photolithography and anisotropic etching to said second semiconductor substrate to form portions to be said spindle, scale and resilient support linked together and a part of said resilient support extended wider that others; and performing an isotropic etching to said sacrifice layer to remove a part of said sacrifice layer tha t is beneath said spindle, scale and resilient support while keeping another part of said sacrifice layer that is beneath said wider extended part of said resilient support. 11. The method of producing the scale member according to claim 10, further comprising the step of forming a spacer from a part of said second semiconductor substrate through a photolithography and anisotropic etching.