초록 ▼

Low-odor microwaveable mineral-filled polypropylene food contact articles are disclosed. The articles are prepared by low temperature processing and typically include odor-suppressing basic organic or inorganic compounds. Preferably, the articles are substantially free from C8 and C9 organic ketones

Low-odor microwaveable mineral-filled polypropylene food contact articles are disclosed. The articles are prepared by low temperature processing and typically include odor-suppressing basic organic or inorganic compounds. Preferably, the articles are substantially free from C8 and C9 organic ketones associated with undesirable odors. Further improvements to the articles include crack-resistant embodiments with synergistic amounts of polyethylene and titanium dioxide.

대표청구항 ▼

Low-odor microwaveable mineral-filled polypropylene food contact articles are disclosed. The articles are prepared by low temperature processing and typically include odor-suppressing basic organic or inorganic compounds. Preferably, the articles are substantially free from C8 and C9 organic ketones

Low-odor microwaveable mineral-filled polypropylene food contact articles are disclosed. The articles are prepared by low temperature processing and typically include odor-suppressing basic organic or inorganic compounds. Preferably, the articles are substantially free from C8 and C9 organic ketones associated with undesirable odors. Further improvements to the articles include crack-resistant embodiments with synergistic amounts of polyethylene and titanium dioxide. ve surface of said semiconductor die; an underfill material substantially free of filler material filling said gap formed between said active surface of said semiconductor die and said extending free portion of said at least one lead member of said plurality of lead members and extending outwardly from said outer edge of said each adhesive segment only to said outer edge of said semiconductor die, said underfill material preventing flow of encapsulant material into said gap; and an encapsulant material encapsulating portions of said semiconductor die and said plurality of lead members, said encapsulant material including at least one of a material substantially free of abrasive particles, an epoxy resin, and an acrylic resin. 2. The semiconductor die assembly of claim 1, wherein said underfill material further covers said active surface of said semiconductor die. 3. The semiconductor die assembly of claim 1, wherein said underfill material further covers said portion of said active surface of said semiconductor die. 4. The semiconductor die assembly of claim 1, wherein said underfill material further covers said active surface of said semiconductor die and said plurality of lead members. 5. The semiconductor die assembly of claim 1, wherein said underfill material further covers said portion of said active surface of said semiconductor die, at least a portion of each of said plurality of lead members, and a portion of each of said plurality of wires.