IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0900874
(2001-07-10)
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발명자
/ 주소 |
- Lof, Per-Anders Kristian
- Gertmar, Lars Gustaf Ingolf
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출원인 / 주소 |
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대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
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인용정보 |
피인용 횟수 :
152 인용 특허 :
5 |
초록
▼
An electric power system provides a coordinated and controlled intercommunication and operation of power engineering equipment and converters, e.g., rotating AC machines, power electronic converters and transformers as well as power grids in order to enhance electric power produced by renewable faci
An electric power system provides a coordinated and controlled intercommunication and operation of power engineering equipment and converters, e.g., rotating AC machines, power electronic converters and transformers as well as power grids in order to enhance electric power produced by renewable facilities. As viewed from the power grid and its stakeholders' perspective, enhanced renewable facilities are more stiff than conventional renewable facilities, and produce power that is as commercially valuable and fungible as electric power produced by traditional plants such as fossil fuel power plants, hydroelectric plants, nuclear plants and the like. xMs and SMs, or more generally yMs, fulfill the demands of stiffness and reduced variability, which have conventionally limited the commercial usefulness of a large scale use of renewables delivering power to a power grid.
대표청구항
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An electric power system provides a coordinated and controlled intercommunication and operation of power engineering equipment and converters, e.g., rotating AC machines, power electronic converters and transformers as well as power grids in order to enhance electric power produced by renewable faci
An electric power system provides a coordinated and controlled intercommunication and operation of power engineering equipment and converters, e.g., rotating AC machines, power electronic converters and transformers as well as power grids in order to enhance electric power produced by renewable facilities. As viewed from the power grid and its stakeholders' perspective, enhanced renewable facilities are more stiff than conventional renewable facilities, and produce power that is as commercially valuable and fungible as electric power produced by traditional plants such as fossil fuel power plants, hydroelectric plants, nuclear plants and the like. xMs and SMs, or more generally yMs, fulfill the demands of stiffness and reduced variability, which have conventionally limited the commercial usefulness of a large scale use of renewables delivering power to a power grid. omprising a gas disposed within the enclosure and in contact with the conductive link, the gas having a pressure of from about 5 atmospheres to about 50 atmospheres above a pressure external to the enclosure. 7. The package of claim 1 wherein the enclosure includes an aperture and a seal sealably positioned proximate to the aperture to at least restrict a flow of gas outwardly from the enclosure. 8. The package of claim 1 wherein the enclosure includes a contact structure having electrical contacts with solder balls for coupling the microelectronic package to other components, the contact structure having an aperture for disposing the gas in the enclosure, a seal to close the aperture, and a solder joint between the seal and the contact structure, the solder joint having a melting point higher than a melting point of the solder balls. 9. The package of claim 1 wherein the enclosure includes a contact structure having electrical contacts for coupling the microelectronic package to other components, the enclosure further including walls between the contact structure and the microelectronic substrate, and wherein the walls are configured to support a weight of the microelectronic substrate when the contact surface faces downwardly. 10. The package of claim 1 wherein the microelectronic substrate is supported on a support substrate, the microelectronic substrate having a first bond site electrically coupled to the at least one microelectronic device feature, the support substrate having a second bond site, and wherein the conductive link is connected between the first and second bond sites. 11. The package of claim 1, further comprising a foam material disposed between the conductive link and an interior surface of the enclosure. 12. The package of claim 1 wherein the enclosure includes a contact structure having electrical contacts for coupling the microelectronic package to other components, the enclosure further including walls between the contact structure and the microelectronic substrate, and wherein the contact structure has a sealed aperture initially open to allow gas to enter the enclosure and then closed to at least restrict the gas from exiting the enclosure. 13. The package of claim 1 further comprising a gas within the enclosure and wherein the gas includes a reducing agent. 14. The package of claim 1 wherein the enclosure includes an electrically insulative material sealed about the microelectronic substrate. 15. The package of claim 1 wherein the microelectronic device feature is a first microelectronic device feature and the microelectronic substrate has a second microelectronic device feature with the conductive link connected between the first and second microelectronic device features and suspended between two points positioned between the first and second microelectronic device features. 16. The package of claim 1 wherein the enclosure includes an electrically conductive material. 17. The package of claim 1 wherein the enclosure includes at least one of copper, a copper alloy, aluminum and an aluminum alloy. 18. The package of claim 1 wherein the enclosure includes at least one of silicon dioxide and silicon nitride. 19. The package of claim 1 wherein the enclosure includes the same conductive material as is included in the conductive link. 20. The package of claim 1 wherein the microelectronic substrate is supported by and electrically coupled to a support substrate, and wherein the enclosure is sealably connected to the support substrate. 21. A microelectronic device package, comprising: a microelectronic substrate having at least one microelectronic device feature; a first bond site electrically coupled to the at least one microelectronic device feature; a support substrate engaged with the microelectronic substrate, the support substrate having a second bond site; a conductive link connected between the first and second bond sites; and an enclosure sealably disposed around the microelectronic substr ate and the conductive link, the enclosure being configured to contain a gas in contact with the conductive link at a pressure at least one atmosphere greater than a pressure external to the enclosure. 22. The package of claim 21, wherein the enclosure is configured to contain a gas at a pressure of from about 5 atmospheres above the external pressure to a pressure of about 50 atmospheres above the external pressure. 23. The package of claim 21, further comprising a gas within the enclosure. 24. The package of claim 21 wherein the conductive link includes a wire bond. 25. The package of claim 21 wherein the conductive link includes a solder ball. 26. The package of claim 21 wherein the enclosure is sealably attached to the support substrate. 27. The package of claim 21 wherein the conductive link is a first conductive link and the microelectronic device feature is a first microelectronic device feature, and wherein the package further comprises a second conductive link coupled between the first and second microelectronic device features. 28. The package of claim 21, wherein the conductive link is a first conductive link and the microelectronic device feature is a first microelectronic device feature, and wherein the package further comprises a second conductive link coupled between the first and second microelectronic device features, with at least a portion of the second conductive link between the first and second microelectronic device features being suspended between a first point and a second point. 29. The package of claim 21 wherein the enclosure includes a metallic material. 30. The package of claim 21 wherein the enclosure is a first enclosure and wherein the package further comprises a second enclosure disposed within the first enclosure and adjacent to the microelectronic substrate. 31. The package of claim 21 wherein the enclosure is a first enclosure, the conductive link is a first conductive link, and the at least one microelectronic device feature includes a first microelectronic device feature, and wherein the microelectronic substrate has a second microelectronic device feature, and further wherein the package further comprises: a second conductive link coupled between the first and second microelectronic device features; and a second enclosure disposed within the first enclosure and adjacent to the microelectronic substrate, the second enclosure having the first bond site and having an aperture positioned to allow fluid communication between an interior region of the first enclosure and an interior region of the second enclosure with the interior regions of the first and second enclosures at approximately the same pressure. 32. A microelectronic package manufactured by a process that comprises: forming at least one microelectronic device feature at least proximate to a surface of a microelectronic substrate; coupling a conductive link to the at least one microelectronic device feature of the microelectronic substrate; disposing an enclosure around at least a portion of the microelectronic substrate; sealing a gas within the enclosure and in contact with the conductive link with the gas at a pressure at least one atmosphere above atmospheric pressure; and exposing the enclosure to atmospheric pressure while the gas remains sealed within the enclosure. 33. The package of claim 32 wherein the process further comprises: placing the microelectronic substrate, the enclosure, and the conductive link in an elevated pressure environment having a pressure at least one atmosphere greater than atmospheric pressure while the enclosure remains open to the elevated pressure environment; sealing the enclosure while the enclosure remains in the elevated pressure environment; and removing the enclosure, the microelectronic substrate and the conductive link as a unit from the elevated pressure environment. 34. The package of claim 32 wherein the enclosure includes an aperture and wherein sealing the gas within the enclosure includes disposing solder on a metallic ring disposed around an aperture in the enclosure, disposing a metallic lid on the solder, and elevating a temperature of the enclosure to bond the metallic lid to the metallic ring. 35. The package of claim 32, wherein the process further comprises selecting the gas disposed within the enclosure to include at least one of hydrogen and helium. 36. The package of claim 32 wherein exposing the enclosure to a pressure includes exposing the enclosure to a pressure of from about 5 atmospheres to about 50 atmospheres below a pressure within the enclosure. 37. The package of claim 32 wherein the at least one microelectronic device feature includes a first microelectronic device feature and a second microelectronic device feature, and wherein the method further comprises suspending at least a portion of the conductive link between two points positioned between the first and second microelectronic device features. 38. The package of claim 32, further comprising selecting the enclosure to include an electrically conductive material. 39. The package of claim 32, further comprising selecting the enclosure to include the same conductive material as is included in the conductive link. 40. 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