초록 ▼

A thermal cup includes a hollow inner cup body having an inner surrounding wall and an outer surrounding wall that confine an enclosed chamber therebetween, and an outer cup body made of a heat insulating material and disposed to surround the outer surrounding wall of the inner cup body. The inner s

A thermal cup includes a hollow inner cup body having an inner surrounding wall and an outer surrounding wall that confine an enclosed chamber therebetween, and an outer cup body made of a heat insulating material and disposed to surround the outer surrounding wall of the inner cup body. The inner surrounding wall further confines a space for containing liquid therein. The outer cup body cooperates with the outer surrounding wall of the inner cup body to confine a clearance therebetween. A thermal conductor unit is provided on the outer surrounding wall of the inner cup body, and is disposed in the clearance.

대표청구항 ▼

A thermal cup includes a hollow inner cup body having an inner surrounding wall and an outer surrounding wall that confine an enclosed chamber therebetween, and an outer cup body made of a heat insulating material and disposed to surround the outer surrounding wall of the inner cup body. The inner s

A thermal cup includes a hollow inner cup body having an inner surrounding wall and an outer surrounding wall that confine an enclosed chamber therebetween, and an outer cup body made of a heat insulating material and disposed to surround the outer surrounding wall of the inner cup body. The inner surrounding wall further confines a space for containing liquid therein. The outer cup body cooperates with the outer surrounding wall of the inner cup body to confine a clearance therebetween. A thermal conductor unit is provided on the outer surrounding wall of the inner cup body, and is disposed in the clearance. on the package, regardless of the actual performance of the IC. This method avoids a second marking step for all ICs sold as low-performance ICs. In another embodiment, only one inking and curing step is required for all ICs. According to this method, all specified performances are marked on the packaged IC at the first marking. The IC is then tested to determine the actual performance, and all performance markings not applicable to the IC are removed, preferably with a laser. Alternatively, all applicable performance markings are identified (e.g., underlined or enclosed with a laser marking).