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Liquid-to-air cooling system for portable electronic and computer devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
출원번호 US-0183671 (2002-06-27)
발명자 / 주소
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Simons, Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Wojnicki, Jr., Esq., Andrew J.Radigan, Esq., Kevin P.Heslin Rothenberg Farley & Mesiti P.C.
인용정보 피인용 횟수 : 14  인용 특허 : 21

초록

A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portab

대표청구항

A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portab

이 특허에 인용된 특허 (21)

  1. von Gutfeld Robert Jacob, Case for portable computers for enhanced heat dissipation.
  2. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration system.
  3. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  4. Chrysler Gregory M.. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  5. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
  6. Patel Chandrakant ; Aoki Edward M. ; Bash Cullen, Cooling apparatus for computer subsystem.
  7. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  8. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Cooling system for portable electronic and computer devices.
  9. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  10. Cheng Ted,TWX, Data processing apparatus having a liquid heat-dissipating system.
  11. Christopher G. Hipp ; David M. Kirkeby, High density web server chassis system and method.
  12. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  13. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  14. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Method of cooling electronic devices using a tube in plate heat sink.
  15. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  16. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  17. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  18. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  19. Villaume Henry F. (Intervale NH), Thermal management system having a thermally conductive sheet and a liquid transporting material.
  20. Curlee, James D.; Worley, Richard; Shepherd, Jason Alan, Tongue and groove gasket seam for EMI.
  21. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.

이 특허를 인용한 특허 (14)

  1. Bauer, Jr., John Albert; Schwager, Mark A.; Osborne, Jeremy J., Apparatus and methods for supporting a display panel of a portable information handling system.
  2. Lōcker,Jury Peter, Cooled computer casing display frame.
  3. Agostini, Bruno; Torresin, Daniele; Agostini, Francesco; Riedel, Gernot; Habert, Mathieu, Cooling apparatus and method.
  4. Kusaka, Hiroyuki; Tomioka, Kentaro; Tanimoto, Mitsuyoshi, Electronic apparatus having a plurality of radiators in which liquid coolant flows.
  5. Saroor, Shaheen; Brooks, Robert C.; Biggs, Kent E.; Castell, Robin T., Electronic devices with multi-layer heat reduction components.
  6. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  7. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  8. Yamada,Shigeru; Chiba,Toshimi, Keyboard apparatus.
  9. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  10. Garrett, Gerald Bruce, Liquid storage and cooling computer case.
  11. Chiriac, Victor; Rosales, Jorge; Anderson, Jon; Molloy, Stephen, Multi-phase heat dissipating device embedded in an electronic device.
  12. Junge, Brent Alden; Kyriacou, Stephanos; Weirich, Kristin Marie; Katu, Umakant Suresh; Mitchell, Alan Joseph, Refrigerator.
  13. Mitchell, Alan Joseph; Junge, Brent Alden, Refrigerator.
  14. Launay, Stephane; Federov, Andrei G.; Joshi, Yogendra, Thermal management devices, systems, and methods.
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