초록 ▼

A two-way ultrasonic positioning and navigation system and method involve a plurality of objects each capable of transmitting and receiving ultrasonic signals. A first object transmits an initiating ultrasonic signal and identifies a second object for responding to the initiating ultrasonic signal.

A two-way ultrasonic positioning and navigation system and method involve a plurality of objects each capable of transmitting and receiving ultrasonic signals. A first object transmits an initiating ultrasonic signal and identifies a second object for responding to the initiating ultrasonic signal. The second object transmits a responding ultrasonic signal after a predetermined time delay from receiving the initiating ultrasonic signal. The first objectives the responding ultrasonic signal, and determines a distance between the first object and the second object based on a time period starting at the transmission of the initiating ultrasonic signal and ending at the reception of the responding ultrasonic signal, and on knowledge about the predetermined time delay and other known in advance time delays.

대표청구항 ▼

A two-way ultrasonic positioning and navigation system and method involve a plurality of objects each capable of transmitting and receiving ultrasonic signals. A first object transmits an initiating ultrasonic signal and identifies a second object for responding to the initiating ultrasonic signal.

A two-way ultrasonic positioning and navigation system and method involve a plurality of objects each capable of transmitting and receiving ultrasonic signals. A first object transmits an initiating ultrasonic signal and identifies a second object for responding to the initiating ultrasonic signal. The second object transmits a responding ultrasonic signal after a predetermined time delay from receiving the initiating ultrasonic signal. The first objectives the responding ultrasonic signal, and determines a distance between the first object and the second object based on a time period starting at the transmission of the initiating ultrasonic signal and ending at the reception of the responding ultrasonic signal, and on knowledge about the predetermined time delay and other known in advance time delays. s for transferring data from said latch circuit into said non-volatile storage circuit in response to a second control signal. 13. A method of storing and retrieving data comprising the steps of: (A) transferring data from a non-volatile storage element into a latch circuit in response to a first control signal; and (B) transferring data from said latch circuit into said non-volatile storage circuit in response to a second control signal. 14. The method according to claim 13, further comprising the step of writing said data to said latch circuit from said non-volatile storage circuit on system startup. 15. The method according to claim 13, further comprising the step of erasing said non-volatile storage circuit. 16. The method according to claim 15, further comprising the step of re-programming said non-volatile storage circuit. 17. The method according to claim 15,further comprising the step of re-programming a silicon, oxide, nitride, oxide, silicon (SONOS) non-volatile storage circuit. 18. The method according to claim 16, wherein the number of times said re-programming step is performed is unlimited. 19. The method according to claim 13, wherein said latch circuit transfers data to and from one or more data busses. 20. The method according to claim 13, further comprising the step of: storing system configuration data in said non-volatile storage circuit, wherein said system configuration data comprises information for frequency tables, look-up tables, selection of chip pins, familiarization of A/D converters, function enabling, spread spectrum values, capacitance values, and/or voltage to capacitance parameters. to electrically insulate the electronic circuitry from other circuitry and components within the electronic device while simultaneously implementing a shielding functionality that permits management of electromagnetic emissions from some or all of the electronic circuitry. e also coupled to a wall of the openable display section of the portable computer, wherein an auxiliary heat transfer path is defined from the thermally conductive plate through the air-cooled fins to the wall of the openable display section of the portable computer. 4. The cooling system of claim 2, wherein the air moving device is positioned and the air-cooled fins are configured to form a converging plenum within the openable display section of the portable computer to facilitate the movement of air across the air-cooled fins. 5. The cooling system of claim 4, wherein the air moving device comprises a low profile pancake type fan, and wherein the air-cooled fins are defined by a folded fin structure. 6. The cooling system of claim 3, wherein the air-cooled fins are defined by a folded fin structure. 7. The cooling system of claim 3, wherein the hollow channel is coupled to one main surface of the thermally conductive plate by means of a thermal epoxy or solder, and wherein the air-cooled fins are coupled to an opposite main surface of the thermally conductive plate by means of a thermal epoxy or solder. 8. The cooling system of claim 5, wherein the folded fin structure is coupled to the thermally conductive plate, and is coupled to a wall of the openable display section of the portable computer, wherein an auxiliary heat transfer path is formed from the thermally conductive plate through the folded fin structure to the wall of the openable display section of the portable computer. 9. The cooling system of claim 5, wherein the openable display section of the portable computer includes air intake openings near the air moving device and air outlet vents aligned at least partially to channels formed by the air cooling fins to facilitate dissipation of air passing across the air-cooled fins. 10. The cooling system of claim 7, wherein the air-cooled fins are further coupled to the wall of the openable display section of the portable computer by means of a thermal epoxy or solder. 11. An electronic apparatus comprising: a base housing having a heat-generating component disposed therein; a lid supported on the base housing for movement relative thereto between open and closed positions; and a cooling system for dissipating operating heat generated by the heat-generating component, the cooling system including: a cold plate assembly having a surface coupled to the heat-generating component; a heat exchange assembly disposed within the lid housing, the heat exchange assembly including a hollow channel for carrying coolant; a conduit for carrying coolant between the cold plate assembly and the hollow channel within the heat exchange assembly; a circulation pump for circulating coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner causing heat from the heat-generating component to be transferred to the coolant, and carried by the coolant to the heat exchange assembly for dissipation therefrom; and wherein the heat exchange assembly includes a thermally conductive plate and air-cooled fins, the hollow channel being coupled to the thermally conductive plate for facilitating the transfer of heat from coolant within the hollow channel to the thermally conductive plate, and the air-cooled fins being coupled to the thermally conductive plate for facilitating the dissipation of heat transferred to the thermally conductive plate from coolant within the hollow channel. 12. The electronic apparatus of claim 11, wherein the electronic apparatus is one of a portable computer or a notebook computer. 13. The electronic apparatus of claim 11, wherein the heat exchange assembly further includes an air moving device disposed within the lid, the air moving device being positioned to move air across the air-cooled fins of the heat exchange assembly. 14. The electronic apparatus of claim 11, wherein the air-cooled fins are also coupled to a wall of the lid, wherein an auxiliary heat transfer p ath is defined from the thermally conductive plate through the air-cooled fins to the wall of the lid. 15. The electronic apparatus of claim 13, wherein the air moving device is positioned and the air-cooled fins are configured to form a converging plenum within the lid to facilitate the movement of air across the air-cooled fins. 16. The electronic apparatus of claim 13, wherein the air-cooled fins are defined by a folded fin structure, and wherein the folded fin structure is coupled to the thermally conductive plate, and is coupled to a wall of the lid, wherein an auxiliary heat transfer path is formed from the thermally conductive plate through the folded fin structure to the wall of the lid of the electronic apparatus. 17. The electronic apparatus of claim 14, wherein the hollow channel is coupled to one main surface of the thermally conductive plate by means of a thermal epoxy or solder, and wherein the air-cooled fins are coupled to an opposite main surface of the thermally conductive plate by means of a thermal epoxy or solder. 18. A method of fabricating a cooling system for a portable computer which includes a computer body having a heat-generating electronic element therein, and a display section having a screen connected in an openable manner to the computer body, the method comprising: coupling a cold plate assembly to the heat-generating electronic element; disposing a heat exchange assembly within the openable display section of the portable computer, the heat exchange assembly including a hollow channel for carrying coolant; providing a conduit for carrying coolant between the cold plate assembly and the hollow channel within the heat exchange assembly; disposing a circulation pump in the computer body for circulating coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner causing heat from the heat-generating electronic element to be transferred to the coolant, and carried by the coolant to the heat exchange assembly for dissipation therefrom; and providing the heat exchange assembly with a thermally conductive plate and air-cooled fins, the hollow channel being coupled to the thermally conductive plate for facilitating the transfer of heat from coolant within the hollow channel to the thermally conductive plate, and the air-cooled fins being coupled to the thermally conductive plate for facilitating the dissipation of heat transferred to the thermally conductive plate from coolant within the hollow channel. 19. The method of claim 18, further comprising providing an air moving device disposed within the openable display section of the portable computer, the air moving device being positioned to move air across the air-cooled fins of the heat exchange assembly. 20. The method of claim 19, further comprising coupling the air-cooled fins to a wall of the display section of the portable computer, wherein an auxiliary heat transfer path is formed from the thermally conductive plate through the air-cooled fins to the wall of the openable display section of the portable computer. S-6317352, 20011100, Halbert et al.; US-6328572, 20011200, Higashida et al., 439/061; US-6349050, 20020200, Woo et al.; US-6353539, 20020300, Horine et al.; US-6376904, 20020400, Haba et al., 257/686; US-6381164, 20020400, Fan et al.; US-6404660, 20020600, Gamini et al.; US-6438012, 20020800, Osaka et al.; US-6496445, 20021200, Lee