초록 ▼

A connector terminal has a base with an opening extending therethrough. The opening is surrounded by an inner border of the base. A series of resilient contacts extend away from the base from the inner border to form a socket. The contacts have opposed surfaces which are spaced apart from each other

A connector terminal has a base with an opening extending therethrough. The opening is surrounded by an inner border of the base. A series of resilient contacts extend away from the base from the inner border to form a socket. The contacts have opposed surfaces which are spaced apart from each other and positioned to define the socket. The contacts have tips that extend in an outwardly direction relative to the opening to allow easy insertion into and removal of a male terminal from the socket. A securement portion on the base allows a conductor to be secured to the connector terminal.

대표청구항 ▼

A connector terminal has a base with an opening extending therethrough. The opening is surrounded by an inner border of the base. A series of resilient contacts extend away from the base from the inner border to form a socket. The contacts have opposed surfaces which are spaced apart from each other

A connector terminal has a base with an opening extending therethrough. The opening is surrounded by an inner border of the base. A series of resilient contacts extend away from the base from the inner border to form a socket. The contacts have opposed surfaces which are spaced apart from each other and positioned to define the socket. The contacts have tips that extend in an outwardly direction relative to the opening to allow easy insertion into and removal of a male terminal from the socket. A securement portion on the base allows a conductor to be secured to the connector terminal. an abrasive slurry in a chemical-mechanical-polishing process on semiconductor surfaces comprising providing a rotary pump having a maximum efficiency, operating the pump at a reduced efficiency of less than about half the maximum efficiency of the pump, and flowing the slurry through the pump while the pump operates at the reduced efficiency, whereby the efficiency of the rotary pump is such that a volumetric slurry flow through the pump is substantially directly related to the rotational speed of the pump and thereby accurately metered. 21. A chemical-mechanical-polishing process for a semiconductor wafer comprising rotary polishing a surface of the wafer, and supplying metered amounts of a slurry including abrasives by providing a rotary pump, having a maximum efficiency, operating the pump at a reduced efficiency of less than about half the maximum efficiency of the pump, and flowing the slurry through the pump while the pump operates at the reduced efficiency, whereby the efficiency of the rotary pump is such that a volumetric slurry flow through the pump is substantially directly related to the rotational speed of the pump and thereby accurately metered.