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Method of preventing junction leakage in field emission displays 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01J-009/24
출원번호 US-0077529 (2002-02-14)
발명자 / 주소
  • Cathey, Jr., David A.
  • Lee, John
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 0  인용 특허 : 54

초록

A method for fabricating a field emission display (FED) with improved junction leakage characteristics is provided. The method includes the formation of a light blocking element between a cathodoluminescent display screen of the FED and semiconductor junctions formed on a baseplate of the FED. The l

대표청구항

A method for fabricating a field emission display (FED) with improved junction leakage characteristics is provided. The method includes the formation of a light blocking element between a cathodoluminescent display screen of the FED and semiconductor junctions formed on a baseplate of the FED. The l

이 특허에 인용된 특허 (54)

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  5. Cathey ; Jr. David A. (Boise ID) Frankamp Harlan (Boise ID), Dry etching method and method for prevention of low temperature post etch deposit.
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  7. Komatsu Hiroshi (Suwa JPX), Field electron emission device.
  8. Kobori Yoichi (Mobara JPX) Tanaka Mitsuru (Mobara JPX), Field emission cathode.
  9. Nakamoto Masayuki (Yokohama JPX) Ono Tomio (Yamato JPX), Field emission cold cathode and method for production thereof.
  10. Makishima Hideo (Tokyo JPX) Yamada Keizo (Tokyo JPX) Imura Hironori (Tokyo JPX), Field emission cold cathode element having exposed substrate.
  11. Scoggan John W. (Southlake TX) Lee Edward C. (Dallas TX), Field emission device cathode and method of fabrication.
  12. Levine Jules D. (Dallas TX) Vickers Kenneth G. (Whitesboro TX), Field emission device with over-etched gate dielectric.
  13. Jin Sungho (Millington NJ) Kochanski Gregory Peter (Dunellen NJ) Zhu Wei (North Plainfield NJ), Field emission devices employing improved emitters on metal foil and methods for making such devices.
  14. Sung Kang H. (Seoul KRX) Huh Chang W. (Seoul KRX), Field emission display and method for fabricating the same.
  15. Itoh Shigeo (Mobara JPX) Watanabe Teruo (Mobara JPX) Nakata Hisashi (Mobara JPX) Nishimura Norio (Mobara JPX) Itoh Junji (Tsukuba JPX) Kanemaru Seigo (Tsukuba JPX), Field emission element and process for manufacturing same.
  16. Cathey David A. (Boise ID) Rolfson J. Brett (Boise ID) Lowrey Tyler A. (Boise ID) Doan Trung T. (Boise ID), Field emission structures produced on macro-grain polysilicon substrates.
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  25. Hirt Alfred (Munich DEX), Method and apparatus for transmitting images to a viewing screen.
  26. Tjaden Kevin (Boise ID) Rolfson J. Brett (Boise ID), Method for formation of a trench accessible cold-cathode field emission device.
  27. Cathey David A. (Boise ID) Tjaden Kevin (Boise ID), Method for forming a substantially uniform array of sharp tips.
  28. Kim Kyung-seob (Seoul KRX) Kim Chi-woo (Seoul KRX) Kweon Young-chan (Seoul KRX) Chang Won-kie (Seoul KRX), Method for manufacturing a flat-panel display.
  29. Cathey ; Jr. David A. ; Lee John, Method for preventing junction leakage in field emission displays.
  30. Tomo Yoichi (Tokyo JPX) Watanabe Hidetoshi (Tokyo JPX), Method for producing planar electron radiating device.
  31. Dieumegard Dominique (Mareil-Marly FRX) Garry Guy (Rueil Malmaison FRX) Karapiperis Lonidas (Bourg la Reine FRX) Pribat Didier (Paris FRX) Collet Christian (Limours FRX), Method for the fabrication of field emission type sources, and application thereof to the making of arrays of emitters.
  32. Reinberg Alan R. (Westport CT) Rhodes Howard E. (Boise ID), Method of creating sharp points and other features on the surface of a semiconductor substrate.
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  35. Cathey David A. (Boise ID), Method of partially eliminating the bird\s beak effect without adding any process steps.
  36. Cathey ; Jr. David A. ; Lee John, Method of preventing junction leakage in field emission displays.
  37. Cathey ; Jr. David A. ; Lee John, Method of preventing junction leakage in field emission displays.
  38. David A. Cathey, Jr. ; John Lee, Method of preventing junction leakage in field emission displays.
  39. Lowrey Tyler A. (Boise ID) Doan Trung T. (Boise ID) Cathey David A. (Boise ID) Rolfson J. Brett (Boise ID), Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology.
  40. Doan Trung T. (Boise ID) Lowrey Tyler A. (Boise ID) Cathey David A. (Boise ID) Rolfson J. Brett (Boise ID), Method to form self-aligned gate structures and focus rings.
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  43. Doan Trung T. (Boise ID) Rolfson J. Brett (Boise ID) Lowrey Tyler A. (Boise ID) Cathey David A. (Boise ID), Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technol.
  44. Sandhu Gurtej S. (Boise ID), Method to form self-aligned tips for flat panel displays.
  45. Smith Donald O. (Lexington MA) Judge John S. (Lexington MA), Micro-structure field emission electron source.
  46. Marcus Robert B. (Murray Hill NJ) Ravi Tirunelveli S. (Eatontown NJ), Microminiature tapered all-metal structures.
  47. Cathey David A. (Boise ID) Rolfson J. Brett (Boise ID), Process for etching a semiconductor device using an improved protective etching mask.
  48. Cathey ; Jr. David A. (Boise ID), Process for fabricating conductors used for integrated circuit connections and the like.
  49. Cathey David A. (Boise ID), Process for isotropically etching semiconductor devices.
  50. MacDonald Noel C. (Ithaca) Spallas James P. (Ithaca NY), Silicon tip field emission cathode arrays and fabrication thereof.
  51. Huang Jammy C. (Taipei TWX), Single tip redundancy method with resistive base and resultant flat panel display.
  52. Cathey David A. (Boise IA) Yu Chris C. (Boise IA) Doan Trung T. (Boise IA) Lowrey Tyler A. (Boise IA) Rolfson J. Brett (Boise IA), Spacers for field emission display fabricated via self-aligned high energy ablation.
  53. Cathey David A. (Boise ID) Freeman John C. (Boise ID) Dale James (Boise ID) Crane William J. (Boise ID) Powell Eric A. (Boise ID) Musser Jeffrey V. (Boise ID), Temperature controlled anode for plasma dry etchers for etching semiconductor.
  54. Ludwig Bryan J. (Boise) Cathey David A. (Boise) Marks Ernest E. (Boise) Jurica Leo B. (Boise) Dunn L. Brian (Boise) Gibbons Loyal R. (Boise ID), Wafer rinser/dryer.
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