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System including power conditioning modules 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/18
출원번호 US-0114005 (2002-03-27)
발명자 / 주소
  • Kenny, Jr., Thomas William
  • Goodson, Kenneth E.
  • Santiago, Juan G.
  • Kim, John J.
  • Chaplinsky, Robert C.
  • Everett, Jr., George Carl
출원인 / 주소
  • Cooligy, Inc.
대리인 / 주소
    Haverstock & Owens LLP
인용정보 피인용 횟수 : 37  인용 특허 : 156

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (156)

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  54. Hsiao Chieh-Jen,TWX, Heat-dissipating apparatus for an integrated circuit device.
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  55. Turlik Iwona (Raleigh NC) Reisman Arnold (Raleigh NC) Nayak Deepak (Los Angeles CA) Hwang Lih-Tyng (Durham NC) Dishon Giora (Jerusalem NC ILX) Jacobs Scott L. (Apex NC) Darveaux Robert F. (Raleigh NC, High performance integrated circuit chip package.
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