Cooling device boiling and cooling refrigerant, with main wick and auxiliary wick
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0007240
(2001-10-22)
|
우선권정보 |
JP-0333302 (2000-10-31) |
발명자
/ 주소 |
- Kokubo, Akihisa
- Terao, Tadayoshi
|
출원인 / 주소 |
|
대리인 / 주소 |
Harness, Dickey & Pierce, PLC
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
10 |
초록
▼
In a cooling device for cooling a heat-generating member, a refrigerant tank includes a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite to the heat-receiving wall. A main wick is provided on an approximate entire inner surfac
In a cooling device for cooling a heat-generating member, a refrigerant tank includes a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite to the heat-receiving wall. A main wick is provided on an approximate entire inner surface of the heat-receiving wall, and an auxiliary wick is arranged opposite to at least a middle portion of an inner surface of the radiation wall within the attachment area. Condensation fins are provided to protrude from an inner surface of the radiation wall, and are separately arranged on both sides of the auxiliary wick. In the cooling device, the auxiliary wick is connected to the main wick and condensation fins.
대표청구항
▼
1. A cooling device for cooling a heat-generating member, the cooling device comprising: a tank for containing a predetermined amount refrigerant therein, the tank having a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite t
1. A cooling device for cooling a heat-generating member, the cooling device comprising: a tank for containing a predetermined amount refrigerant therein, the tank having a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite to the heat-receiving wall in a predetermined interval to form a closed space in the tank; a radiation fin mounted on an outer surface of the radiation wall; a main wick for transporting liquid refrigerant to the attachment area in the tank, the main wick being disposed in the tank to contact the heat-receiving wall; a plurality of condensation fins disposed on the radiation wall in the tank; and an auxiliary wick disposed in the tank for connecting the main wick and the condensation fins, wherein the auxiliary wick is arranged at least opposite to a part of the attachment area. 2. The cooling device as in claim 1, wherein the auxiliary wick is disposed to opposite to a center line of the attachment area. 3. The cooling device as in claim 2, wherein the auxiliary wick extends in the tank from one end to the other end of the tank. 4. The cooling device as in claim 1, wherein the condensation fins are separately provided on both sides of the auxiliary wick, and obliquely arranged with respect to the auxiliary wick. 5. The cooling device as in claim 1, wherein the condensation fins are provided to protrude from an inner surface of the radiation wall to be tapered, for defining a V-shaped space between adjacent both the condensation fins. 6. The cooling device as in claim 1, wherein the condensation fins are disposed on an inner surface of the radiation wall except for at least a center area corresponding to a middle part within the attachment area. 7. The cooling device as in claim 6, further comprising a plurality of drains provided in the center area on the inner surface of the radiation wall to be recessed from the inner surface of the radiation wall, wherein the drains are provided to be connected to a space between the condensation fins. 8. The cooling device as in claim 1, wherein each condensation fin has an end surface in a longitudinal direction thereof, the end surface being tilted with respect to at least one of the auxiliary wick and a side inner surface of the tank. 9. The cooling device as in claim 1, wherein the radiation fin is bonded onto the outer surface of the radiation wall after the outer surface of the radiation wall is plated. 10. The cooling device as in claim 1, wherein the inner surface of radiation wall is applied with a hydrophilic coat. 11. The cooling device as in claim 1, wherein: the tank is constructed by a flat plate used as the radiation wall, and a box-shaped case including to the heat-receiving wall; and the flat plate has an outer periphery which is disposed to be cold-bonded to a flange portion of an outer periphery of the box-shaped case by using a substrate of the radiation fin, after the radiation fin is bonded to the flat plate.
이 특허에 인용된 특허 (10)
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Morris, Garron Koch; Mundra, Kamlesh, Adaptive heat sink for electronics applications.
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Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
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Pravda Milton F. (Baltimore MD) Bienert Walter B. (Baltimore MD), Cooling a heat-producing electrical or electronic component.
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Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
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Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.
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DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
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Xie Hong, Heat pipe lid for electronic packages.
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Andresen Rolf (Tucson AZ) Bellar Robert J. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Method and apparatus for immersion cooling or an electronic board.
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Gluck Donald F. ; Gerhart Charlotte, Multifunctional capillary system for loop heat pipe statement of government interest.
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Larson Ralph I. ; Phillips Richard L., Two phase component cooler.
이 특허를 인용한 특허 (3)
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Luo, Chin-Kuang, Heat dissipating device.
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Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
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Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
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