$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F28D-015/00   
미국특허분류(USC) 165/104.26; 165/104.33; 361/700; 174/015.2
출원번호 US-0294318 (2002-11-14)
발명자 / 주소
인용정보 피인용 횟수 : 16  인용 특허 : 5
초록

A very thin flat plate shaped sintered copper powder wick with a waffle pattern on one surface is sealed between two sheets of thin copper foil. The interior space within the sealed foil is evacuated and charged with sufficient water to saturate the wick through a copper tube which is then hermetically sealed, producing the working core of a flat plate heat pipe. Heat treated aluminum plates are bonded with thin, thermally conductive adhesive layers to both the evaporator and condenser surfaces of the copper foil heat pipe container. The resulting flat h...

대표
청구항

A very thin flat plate shaped sintered copper powder wick with a waffle pattern on one surface is sealed between two sheets of thin copper foil. The interior space within the sealed foil is evacuated and charged with sufficient water to saturate the wick through a copper tube which is then hermetically sealed, producing the working core of a flat plate heat pipe. Heat treated aluminum plates are bonded with thin, thermally conductive adhesive layers to both the evaporator and condenser surfaces of the copper foil heat pipe container. The resulting flat h...

이 특허를 인용한 특허 피인용횟수: 16

  1. Mhadeshwar, Ashish B.; Norton, Daniel; Perry, Robert James; Glaser, Paul; Pastecki, Patrick Edward. Catalytic alcohol dehydrogenation heat sink for mobile application. USP2015028961891.
  2. Ranish, Joseph M.; Hunter, Aaron Muir. Chambers with improved cooling devices. USP2014128901518.
  3. Chauhan, Shakti Singh; Connolly, Stuart; Shah, Binoy Milan; Hoden, Brian; Kim, Joo Han. Circuit card assembly and method of manufacturing thereof. USP2016069370090.
  4. Osawa, Satoshi. Electronic device cooling apparatus. USP2012078230901.
  5. Wong,Shwin Chung. Flat-plate heat pipe containing channels. USP2008077392836.
  6. Connors, Matt; Toth, Jerome E.. Heat exchanger backing plate and method of assembling same. USP2016089417015.
  7. Wu, Chun-Ming. Heat pipe structure. USP2016119506699.
  8. Hsieh, Yi-Shih. Heat pipe with sealed vesicle. USP2015069062920.
  9. Meng, Jin Gong; Hwang, Ching Bai. Heat spreader with vapor chamber and method of manufacturing the same. USP2009107603775.
  10. Hwang, Ching-Bai; Meng, Jin-Gong. Heat spreader with vapor chamber defined therein and method of manufacturing the same. USP2010017651601.
  11. Norton, Daniel G.; Perry, Robert J.. High capacity heat sink. USP2013078496201.
  12. Lin,Kuo Len; Tsui,Hui Min; Hsu,Ken. Isothermal plate assembly with predetermined shape and method for manufacturing the same. USP2008017322102.
  13. Moon, Seok Hwan; Hwang, Gunn; Kang, Sung Weon; Choi, Chang Auck. Loop type micro heat transport device. USP2011077971633.
  14. Schuette, Franz Michael. Sealed self-contained fluidic cooling device. USP2013108561673.
  15. Wang,Chin Wen; Wang,Pei Choa; Wang,Ching Chung. Structure of heat conductive plate. USP2006047032652.
  16. Lai,Cheng Tien; Zhou,Zhi Yong; Ding,Qiao Li. Vapor chamber for dissipation heat generated by electronic component. USP2008117447029.