초록 ▼

A network of microcontrollers for monitoring and diagnosing the environmental conditions of a computer is disclosed. The network of microcontrollers provides a management system by which computer users can accurately gauge the health of their computer. The network of microcontrollers provides users

A network of microcontrollers for monitoring and diagnosing the environmental conditions of a computer is disclosed. The network of microcontrollers provides a management system by which computer users can accurately gauge the health of their computer. The network of microcontrollers provides users the ability to detect system fan speeds, internal temperatures and voltage levels. The invention is designed to not only be resilient to faults, but also allows for the system maintenance, modification, and growth--without downtime. Additionally, the present invention allows users to replace failed components, and add new functionality, such as new network interfaces, disk interface cards and storage, without impacting existing users. One of the primary roles of the present invention is to manage the environment without outside involvement. This self-management allows the system to continue to operate even though components have failed.

대표청구항 ▼

A network of microcontrollers for monitoring and diagnosing the environmental conditions of a computer is disclosed. The network of microcontrollers provides a management system by which computer users can accurately gauge the health of their computer. The network of microcontrollers provides users

A network of microcontrollers for monitoring and diagnosing the environmental conditions of a computer is disclosed. The network of microcontrollers provides a management system by which computer users can accurately gauge the health of their computer. The network of microcontrollers provides users the ability to detect system fan speeds, internal temperatures and voltage levels. The invention is designed to not only be resilient to faults, but also allows for the system maintenance, modification, and growth--without downtime. Additionally, the present invention allows users to replace failed components, and add new functionality, such as new network interfaces, disk interface cards and storage, without impacting existing users. One of the primary roles of the present invention is to manage the environment without outside involvement. This self-management allows the system to continue to operate even though components have failed. e of skew-reducing locations is disposed proximate an end of the module. 13. The memory module of claim 10, wherein; one line of skew-reducing locations is disposed proximate the middle of the module; and one line of skew-reducing locations is disposed proximate an end of the module. 14. The memory module of claim 10, wherein the module comprises a loaded portion within which the DRAM devices are supported, and an unloaded portion which is outside of the loaded portion, and wherein said at least one line of skew-reducing locations is disposed within the loaded portion. 15. The memory module of claim 10, wherein the module comprises a loaded portion within which the DRAM devices are supported, and an unloaded portion which is outside of the loaded portion, and wherein said at least one line of skew-reducing locations is disposed within the unloaded portion. 16. The memory module of claim 10, wherein the module comprises a loaded portion within which the DRAM devices are supported, and an unloaded portion which is outside of the loaded portion, and wherein: at least one line of skew-reducing locations is disposed within the loaded portion; and said at least one line of skew-reducing locations is disposed within the unloaded portion. 17. The memory module of claim 10, wherein multiple lines of skew-reducing locations are disposed between individual devices supported by the module. 18. The memory module of claim 10, wherein the module substrate comprises a printed circuit board. 19. A memory module comprising: an elongate module board having a long axis; a pair of signal routing layers supported by the module board; multiple memory devices supported by the module board and operably connected with the signal routing layers, the memory devices being disposed on the module board along a direction; and multiple skew-reducing locations in which signals routed in at least one of said signal routing layers can be switched to a different signal routing layer, the skew-reducing locations being arranged in at least one line that is generally transverse the direction along which the memory devices are disposed. 20. The memory module of claim 19, wherein the direction along which the memory devices are disposed is in the same direction as the long axis of the module board. 21. The memory module of claim 19, wherein the memory devices comprise DRAM devices. 22. A high frequency system comprising: a motherboard; a master controller mounted on the motherboard; one or more modules mounted on the motherboard and operably connected to the master controller and configured to receive high speed signals from the master controller, each module comprising: an elongate module board; multiple signal routing layers supported by the module board; multiple devices supported by the module board and operably connected with the signal routing layers; and multiple skew-reducing locations in which signals routed in two or more of the multiple signal routing layers can be switched to a different signal routing layer, the skew-reducing locations being arranged in at least one line that is generally transverse the module board. 23. The high frequency system of claim 22, wherein, for at least one module, said at least one line of skew-reducing locations is disposed proximate the middle of the module. 24. The high frequency system of claim 22, wherein, for at least one module, said at least one line of skew-reducing locations is disposed proximate an end of the module. 25. The high frequency system of claim 22, wherein, for at least one module: one line of skew-reducing locations is disposed proximate the middle of the module; and one line of skew-reducing locations is disposed proximate an end of the module. 26. The high frequency system of claim 22, wherein, for at least one module, the module comprises a loaded portion within which the devices are supported, and an unloaded portion which is outside of the loaded portion, and w