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Method of manufacturing a composite overmolded heat pipe 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23P-015/00
출원번호 US-0123363 (2002-04-16)
발명자 / 주소
  • Sagal, E. Mikhail
  • McCullough, Kevin A.
  • Miller, James D.
출원인 / 주소
  • Cool Options, Inc.
대리인 / 주소
    Barlow, Josephs & Holmes, Ltd.
인용정보 피인용 횟수 : 10  인용 특허 : 35

초록

The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves

대표청구항

The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves

이 특허에 인용된 특허 (35)

  1. Kagawa Toshiaki,JPX ; Kamimura Taisuke,JPX, Color image forming apparatus spacially separating toner image heat-fusion from toner image transfer to a recording medium.
  2. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
  3. Cardella Mark A., Cooling system and method of cooling electronic devices.
  4. Mergler Thomas G. (Bolivar NY), Heat exchanger and heat pipe therefor.
  5. Lindner Friedrich (Leinfelden-Echterdingen DEX), Heat pipe.
  6. Meijer Roelf J. (Ann Arbor MI) Ziph Benjamin (Ann Arbor MI), Heat pipe.
  7. Sakaya Masuji (Narashino JPX) Okiai Ryuichi (Yotsukaido JPX) Mochizuki Masataka (Nagareyama JPX) Mashiko Kouichi (Tokyo JPX), Heat pipe and method of manufacturing the same.
  8. Wahle Harold W. ; Giammaruti Robert J., Heat pipe heat exchanger for cooling or heating high temperature/high-pressure sub-sea well streams.
  9. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  10. Itoh Satomi (Hyogo JPX), Heat radiating device.
  11. McCullough Kevin A., Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment.
  12. McCullough Kevin A. ; Rife William B., Heat sink assembly with multiple pressure capability.
  13. Karabatsos Chris (42 Jumping Brook La. Kingston NY 12401) Smith Gary W. (12376 Darkwood Rd. San Diego CA 92129), Heat sink header assembly.
  14. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  15. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
  16. Nakai Mikio (Shizuoka JPX) Ishikawa Takayuki (Shizuoka JPX), Liquid-crystal polyester resin composition which exhibits excellent high temperature stability.
  17. Pleuse Harald (Langenfeld DEX) Muller Peter E. (Reinach CHX), Method and apparatus for producing a foam from a molten thermoplastic material.
  18. Camarda Charles J. (Virginia Beach VA) Peterson George P. (College Station TX) Rummler Donald R. (Hampton VA), Method for producing micro heat panels.
  19. McCullough Kevin A., Method of molding a thermally conductive article.
  20. Murao Toshiro (Fuji JPX) Suzuki Yoshiharu (Shizuoka JPX) Wada Mitsuo (Fuji JPX) Konuma Hiroaki (Shimizu JPX), Method of treating the surface of a molded article comprising liquid crystal polyester resin.
  21. McCullough Kevin Albert (Warwick RI), Mold apparatus for manufacturing a plastic article with interrupted interior threads for securing a heat sink to a heat.
  22. Gibson Mark W.,CAX, On-site pipe coating process.
  23. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
  24. McCullough Kevin Albert (Warwick RI), Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member.
  25. Minamisawa Tsuyoshi (Mishima JPX) Endo Katsunori (Fuji JPX) Ikegami Eitaro (Fuji JPX) Nezu Shigeru (Fuji JPX), Polyester resin composition.
  26. Progl Curtis L. ; Zhang Allen P., Portable computer with flexible heat spreader plate structure therein.
  27. Suzuki Yoshiharu (Ihara JPX) Murao Toshiro (Fuji JPX) Ogura Michiaki (Shimizu JPX), Process for surface treatment of moldings of liquid-crystalline polyester resin.
  28. Lee Richard,TWX, Quick defrosting pad.
  29. Glass David E. ; Camarda Charles J. ; Merrigan Michael A., Refractory-composite/heat-pipe-cooled leading edge and method for fabrication.
  30. Ferrera David A., Shape memory polymer intravascular delivery system with heat transfer medium.
  31. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  32. McCullough Kevin A., Thermally conductive composite material.
  33. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.
  34. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.
  35. Roberts ; Jr. ; Charles C., Variable thermal conductance reflux heat pipe.

이 특허를 인용한 특허 (10)

  1. Yu, Zhihai Zack, Flat vapor chamber apparatus and method for transferring heat between integrated circuits.
  2. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  3. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  4. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  5. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  6. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  7. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  8. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  9. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  10. Chang,Je Young; DiStefano,Eric, Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers.
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