초록 ▼

A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner laye

A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock. A method of making the protected electronic assembly is also provided that includes providing an electronic device, disposing a resilient polymeric material as an inner layer around the electronic device to cushion the electronic device, and injection molding a rigid polymeric material as an outer shell around the resilient polymeric material to protect the electronic device.

대표청구항 ▼

1. A protected electronic assembly of a system comprising: an electronic device; an outer shell made from a rigid polymeric material, located over said electronic device, and adapted to protect said electronic device from an environment, wherein said outer shell defines an integral connector tha

1. A protected electronic assembly of a system comprising: an electronic device; an outer shell made from a rigid polymeric material, located over said electronic device, and adapted to protect said electronic device from an environment, wherein said outer shell defines an integral connector that facilitates insertion of a fastener through said outer shell to the system; and an inner layer made from a resilient polymeric material, located between said electronic device and said outer shell, and adapted to cushion said electronic device from mechanical shock. 2. The protected electronic assembly of claim 1 wherein said electronic device is an electronic circuit board. 3. The protected electronic assembly of claim 2 wherein said electronic circuit board has a generally planar shape. 4. The protected electronic assembly of claim 2 further comprising at least one electrical lead connected to said electronic circuit board and extending through said inner layer and said outer shell. 5. The protected electronic assembly of claim 1 wherein said outer shell is made from a rigid polymeric material selected from a group consisting of nylon, acrylonitrile butadiene styrene, polypropylene, and polybutylene terephthalate. 6. The protected electronic assembly of claim 1 wherein said inner layer is made from a resilient polymeric material selected from a group consisting of silicone, thermoplastic polyester, and thermoplastic polyolefin. 7. The protected electronic assembly of claim 6 wherein said inner layer is also adapted to provide protection of said electronic device during expansion and contraction of said outer shell. 8. An protected electronic assembly of a system comprising: an electronic circuit board having a generally planar shape; an outer shell made from a rigid polymeric material, located over said electronic device, and adapted to protect said electronic device from an environment, wherein said outer shell defines an integral connector that facilitates insertion of a fastener through said outer shell to the system; an inner layer made from a resilient polymeric material, located between said electronic device, and said outer shell and adapted to cushion said electronic device from mechanical shock and to provide protection of said electronic device during expansion and contraction of said outer shell; and an electrical lead connected to said electronic circuit board and extending through said inner layer and said outer shell. 9. The protected electronic assembly of claim 8 wherein said outer shell is made from a rigid polymeric material selected from a group consisting of nylon, acrylonitrile butadiene styrene, polypropylene, and polybutylene terephthalate. 10. The protected electronic assembly of claim 9 wherein said inner layer is made from a resilient polymeric material selected from a group consisting of silicone, thermoplastic polyester, and thermoplastic polyolefin.