초록 ▼

The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between t

The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

대표청구항 ▼

1. A process for forming an electrical connector comprising the steps of: a. entraining a plurality of electrically conductive particles having a nominal average particle size of greater than 50 microns into a gas stream having a temperature of from 100° Celsius to 550° Celsius, thereby imparting

1. A process for forming an electrical connector comprising the steps of: a. entraining a plurality of electrically conductive particles having a nominal average particle size of greater than 50 microns into a gas stream having a temperature of from 100° Celsius to 550° Celsius, thereby imparting kinetic and thermal energy to said particles; and b. directing said gas stream and said particles through a nozzle toward an electrically conductive surface while moving said surface in relation to said nozzle at a selected speed thereby embedding said particles onto said surface and forming a discontinuous layer of spaced particles on said surface. 2. The process of claim 1 wherein step a) comprises entraining a plurality of electrically conductive particles having a particle size of equal to or greater than 75 microns into said gas stream. 3. The process of claim 1 wherein step b) comprises directing said gas stream and said particles through a nozzle and accelerating said particles to a velocity between 300 to 1000 meters per second. 4. The process of claim 1 wherein step b) further comprises moving said surface in relation to said nozzle at a speed of from 1 meter per second to 10 meters per second. 5. The process of claim 1 wherein step a) comprises selecting as the electrically conductive surface at least one of copper, aluminum, brass, stainless steel and tungsten. 6. The process of claim 1 wherein step a) comprises entraining a plurality of electrically conductive particles into a gas stream having a temperature of from 100° Celsius to 300° Celsius. 7. The process of claim 1 wherein step a) comprises entraining a plurality of electrically conductive particles into a gas stream having a temperature of 200° Celsius. 8. The process of claim 1 wherein step a) comprises selecting as the electrically conductive particles at least one of tin, silver, gold, platinum, or a metal alloy. 9. The process of claim 8 comprising selecting as the electrically conductive particles tin or a tin alloy. 10. The process of claim 9 comprising selecting as the electrically conductive particles at least one of a tin-copper, a tin-silver, or a tin-lead alloy.