초록 ▼

Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentrations which satisfy a range of 0.5X to 1.5X w

Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentrations which satisfy a range of 0.5X to 1.5X when the concentrations of the colorants in the pellets are indicated in terms of absorbance and the average concentration is expressed as X is at least 90%. The coloring master pellets of the present invention have extremely small variations in the concentrations of colorants contained in the pellets. These master pellets are suitably used for obtaining an optical molded article such as an optical disk which has extremely few occurrences of color non-uniformity and color streaks and excellent electric properties.

대표청구항 ▼

Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentrations which satisfy a range of 0.5X to 1.5X w

Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentrations which satisfy a range of 0.5X to 1.5X when the concentrations of the colorants in the pellets are indicated in terms of absorbance and the average concentration is expressed as X is at least 90%. The coloring master pellets of the present invention have extremely small variations in the concentrations of colorants contained in the pellets. These master pellets are suitably used for obtaining an optical molded article such as an optical disk which has extremely few occurrences of color non-uniformity and color streaks and excellent electric properties. oard according to claim 1, wherein the reinforcer sheet with density distribution in its in-plane direction is at least one sheet selected from the group consisting of a woven fabric and a non-woven fabric formed of at least one fiber selected from the group consisting of a synthetic fiber and an inorganic fiber. 3. The circuit board according to claim 1, wherein the reinforcer sheet with density distribution in its in-plane direction is a film formed of a synthetic resin. 4. The circuit board according to claim 2, wherein the reinforcer sheet with density distribution in its in-plane direction is the woven fabric formed of a glass fiber. 5. The circuit board according to claim 4, wherein the inner via holes provided in overlapping portions of warps and wefts of the woven fabric formed of the glass fiber have a smaller cross-section than the inner via holes provided in portions other than the over lapping portions. 6. The circuit board according to claim 1, wherein the inner via holes having a larger cross-section have a smaller amount of protruding fibers on a side wall surface thereof than the inner via holes having a smaller cross-section. 7. The circuit board according to claim 1, wherein a plurality of the wiring layers are provided, and at least one of the wiring layers is embedded in the insulator layer. 8. The circuit board according to claim 1, wherein a circuit board formed of a compressible electrical insulating material further is laminated on one surface of the circuit board of claim 1. 9. A circuit board assembly, comprising a circuit board of claim 1 as both sides substrate, and a compressible electrical insulating material further is laminated as a core substrate between the circuit boards. 10. A circuit board assembly, comprising a circuit board of claim 1 as a core substrate, and at least one circuit board formed of an insulator layer thinner than the insulator layer of the core substrate further is laminated on at least one surface of the core substrate.