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A modular emergency stop device including a switch unit and a control unit. The switch unit includes a switch which converts from a normal state to an emergency state when an emergency stop is necessary and a housing for the switch. The control unit includes a controller which controls a power sourc

A modular emergency stop device including a switch unit and a control unit. The switch unit includes a switch which converts from a normal state to an emergency state when an emergency stop is necessary and a housing for the switch. The control unit includes a controller which controls a power source for a machine and a housing for the controller. The switch unit's housing and the control unit's housing are adapted to be selectively coupled together and uncoupled from each other. The switch is operably coupled to the controller when the housings are coupled together whereby the controller may appropriately control the machine's power source when the switch is converted to the emergency state. To replace the switch, the switch's housing is uncoupled from the controller's housing to remove the switch unit and a new switch unit is coupled to the controller's housing.

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A modular emergency stop device including a switch unit and a control unit. The switch unit includes a switch which converts from a normal state to an emergency state when an emergency stop is necessary and a housing for the switch. The control unit includes a controller which controls a power sourc

A modular emergency stop device including a switch unit and a control unit. The switch unit includes a switch which converts from a normal state to an emergency state when an emergency stop is necessary and a housing for the switch. The control unit includes a controller which controls a power source for a machine and a housing for the controller. The switch unit's housing and the control unit's housing are adapted to be selectively coupled together and uncoupled from each other. The switch is operably coupled to the controller when the housings are coupled together whereby the controller may appropriately control the machine's power source when the switch is converted to the emergency state. To replace the switch, the switch's housing is uncoupled from the controller's housing to remove the switch unit and a new switch unit is coupled to the controller's housing. proximate to a separate one of the leads of the second subset. 11. The leadframe of claim 10, wherein the plurality of the electrically conductive layers are electrically coupled to leads of the second subset. 12. A leadframe comprising: a plurality of metal leads, each lead including an inner end segment beginning at an inner end of the lead; a nonconductive layer on the inner end segment of at least one of the leads; and an electrically conductive layer on a surface of the nonconductive layer and generally parallel to a longitudinal direction of the inner end segment, wherein the nonconductive layer electrically isolates the electrically conductive layer from the respective lead upon which the nonconductive layer is positioned; wherein the inner end segment of each of a first subset of the leads extends further toward a center of the lead frame than the inner end segment of each of a second subset of the leads; and wherein leads of the first subset are each adjacent to at least one lead of the second subset, thereby forming plural sets of leads, each including one lead of the first subset and at least one lead of the second subset, wherein each lead of the first subset includes the nonconductive layer and the electrically conductive layer. 13. The leadframe of claim 12, wherein the electrically conductive layer is positioned entirely between opposing edges of the at least one of the leads. 14. A semiconductor package comprising: a plurality of metal leads, each lead including an inner end segment beginning at an inner end of the lead; a nonconductive layer on the inner end segment of at least a first one of the leads and set back from its inner end; an electrically conductive layer on a surface of the nonconductive layer positioned entirely between opposite edges of the first lead, wherein the nonconductive layer electrically isolates the electrically conductive layer from the first lead upon which the electrically conductive layer is positioned; and a semiconductor chip separately electrically coupled to the inner end segment and the electrically conductive layer of the first lead, wherein a second one of the leads also is electrically coupled to the electrically conductive layer. 15. The semiconductor package of claim 14, wherein the inner end segment of the first lead extends further toward a center of the package than the inner end segment of the second lead. 16. The semiconductor package of claim 14, wherein the second lead is electrically coupled to the electrically conductive layer via a bond wire. 17. The semiconductor package of claim 14, further comprising a plurality of the first leads and a plurality of the second leads, wherein the nonconductive layer spans the inner end segment of a plurality of the first leads, a plurality of isolated ones of the electrically conductive layers are on the nonconductive layer, and each of the electrically conductive layers is electrically coupled to a separate one of the second leads. 18. The semiconductor package of claim 14, further comprising a plurality of the second leads, and a plurality of the nonconductive layers and a plurality of the conductive layers, wherein the plural nonconductive and conductive layers are interleaved on the inner end segment of the first lead, and each of the plural electrically conductive layers is electrically coupled to a separate one of the second leads. 19. The semiconductor package of claim 14, further comprising a plurality of the first leads and a plurality of the second leads, with each first lead including at least one said nonconductive layer and at least one said electrically conductive layer, the electrically conductive layer being electrically coupled to both the semiconductor chip and the respective second lead. 20. The semiconductor package of claim 14, wherein the semiconductor chip is coupled to the inner end segment of the first lead via a bond wire. 21. The semiconductor package of claim 20, wherein the semicon