초록 ▼

A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling s

A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system. As a result, the multiple compressor refrigeration heat sink module can be utilized in existing electronic systems without the need for significant system housing modification or the "plumbing" associated with prior art liquid-based cooling systems. The multiple compressor refrigeration heat sink module is also well suited for applications that require a highly reliable, energy and space efficient, cooling systems for electronic components such as multi-chip modules and mainframe computer applications.

대표청구항 ▼

A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling s

A multiple compressor refrigeration heat sink module is suitable for use in standard electronic component environments. The multiple compressor refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system. As a result, the multiple compressor refrigeration heat sink module can be utilized in existing electronic systems without the need for significant system housing modification or the "plumbing" associated with prior art liquid-based cooling systems. The multiple compressor refrigeration heat sink module is also well suited for applications that require a highly reliable, energy and space efficient, cooling systems for electronic components such as multi-chip modules and mainframe computer applications. 00, O'Phelan et al., 607/005; US-6297943, 20011000, Carson, 361/500; US-6299752, 20011000, Strange et al., 205/152; US-6321114, 20011100, Nutzman et al., 607/005; US-6326587, 20011200, Cardineau et al., 219/121.68; US-6388866, 20020500, Rorvick et al., 361/503; US-6402793, 20020600, Miltich et al., 029/025.03; US-6442015, 20020800, Niiori et al., 361/502; US-6477037, 20021100, Nielsen et al., 361/520; US-6493212, 20021200, Clarke et al., 361/521