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Electronic system having electronic apparatus with built-in heat generating component and cooling apparatus to cool the electronic apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0020625 (2001-12-07)
우선권정보 JP-0029902 (2001-02-06)
발명자 / 주소
  • Kitahara, Chihei
출원인 / 주소
  • Kabushiki Kaisha Toshiba
대리인 / 주소
    Pillsbury Winthrop LLP
인용정보 피인용 횟수 : 30  인용 특허 : 7

초록

A cooling apparatus includes a cooling module having an electrically-driven cooling device. The cooling module is adapted to couple with a portable electronic apparatus having a heat generating component and a first connector to supply power. A second connector is provided to be electrically connect

대표청구항

1. An expansion apparatus detachably capable of being connected to a portable electronic apparatus having a built-in heat generating component and a first expansion connector for function expansion, said expansion apparatus comprising: a base having an exhaust port and a rest section on which the

이 특허에 인용된 특허 (7)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  2. Hironori Tanaka JP, Apparatus and system for cooling a portable device.
  3. Tsuji Hiroyuki,JPX ; Kato Keiichi,JPX, Apparatus for radiating heat for use in computer system.
  4. Moore David A. ; Progl Curtis L. ; Tracy Mark S., Docking station with auxiliary heat dissipation system for a docked portable computer.
  5. Kitahara Chihei,JPX ; Shibasaki Kazuya,JPX ; Nakamura Hiroshi,JPX ; Ubukata Hiroshi,JPX, Electronic apparatus with a flat cooling unit for cooling heat-generating components.
  6. Hiroshi Nakamura JP; Kazuya Shibasaki JP, Electronic equipment system and extension device for expanding the functions of electronic equipment.
  7. Maruno Yasuo,JPX, Heat-transfer connector.

이 특허를 인용한 특허 (30)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Gong, Guangzhao, Connecting/disconnecting mechanism and composite apparatus.
  3. Chen,Robert, Contractible and extentable laptop computer external cooler pad.
  4. Cheng,Henry, Cooling pad for notebook computer.
  5. Kang, Joon; Cho, Jin-hyun, Cooling unit and display apparatus having the same.
  6. Shibayama, Yoshiyuki; Tsuganezawa, Yuta; Shinohara, Eiji, Docking station and electronic device system.
  7. Hiratomo, Shinji, Electronic device.
  8. Takenoshita,Hiroyuki; Sasaki,Hideki; Nakamura,Tomohisa; Koyama,Seiji, Electronic device for cooling interior of housing.
  9. Takenoshita,Hiroyuki; Sasaki,Hideki; Nakamura,Tomohisa; Koyama,Seiji, Electronic equipment including an apparatus for cooling interior of housing.
  10. Chun, Dexter T.; Chiriac, Victor A.; Thompson, James H.; Molloy, Stephen A., Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features.
  11. Fleck, Rod G.; Chebeleu, Livius D., Heat dissipation from a hand-held portable computer.
  12. Lin, Kuo-Len; Hung, Mong-Hua; Tseng, Tien-Chih; Lin, Chen-Hsiang; Cheng, Chih-Hung, Heat sink having auto switching function, heat sink system and heat sinking method for the same.
  13. Huang, Cheng Yu, Heat-dissipating seat for notebook computers.
  14. Pokharna,Himanshu; Distefano,Eric, Increased thermal capability of portable electronic device in stationary or docked mode.
  15. Hara,Yasushi; Motoyama,Hideyuki; Yamada,Hiroshi, Information processor.
  16. Chen, Qiang, Laptop computer cooling stand.
  17. Sween, Barry P.; Elgie, Richard James, Laptop computer support.
  18. Sween, Barry P.; Elgie, Richard James, Laptop computer support.
  19. Sween, Barry P.; Elgie, Richard James, Laptop computer support.
  20. Sween, Barry; Elgie, Richard J., Laptop computer support.
  21. DeLuga,Ronald E.; Moore,Earl; Doczy,Paul, Portable computer power system.
  22. Park,Jea woo, Portable computer with docking station.
  23. Lin, Jen-Cheng, Portable heat-dissipating device for a notebook computer.
  24. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Redundant assembly for a liquid and air cooled module.
  25. Siba, Erick Arsene; Damani, Anil, System and method for managing portable information handling system cooling.
  26. Rehmann, Mark L.; McKinney, David; Damani, Anil, System and method for portable information handling system parallel-wall thermal shield.
  27. Rehmann, Mark; McKinney, David Lawrence; Damani, Anil, System and method for portable information handling system thermal shield.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  29. Grunow,David W.; Illingworth,Patrick V.; Jeffries,John A., Vertical docking method and system.
  30. Schlesener,Maria; Godsted,Jeffrey; Gold,Philip, Vertically docking an information handling system to a media slice.
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