초록 ▼

An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includ

An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

대표청구항 ▼

An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includ

An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member. pressor refrigeration heat sink module can be utilized in existing electronic systems without the need for significant system housing modification or the "plumbing" associated with prior art liquid-based cooling systems. The multiple compressor refrigeration heat sink module is also well suited for applications that require a highly reliable, energy and space efficient, cooling systems for electronic components such as multi-chip modules and mainframe computer applications.