초록 ▼

Method of forming a magnetic memory device are disclosed. In one embodiment, a first plurality of conductive lines are formed over a semiconductor workpiece. A plurality of magnetic material lines are formed over corresponding ones of the first plurality of conductive lines and a second plurality of

Method of forming a magnetic memory device are disclosed. In one embodiment, a first plurality of conductive lines are formed over a semiconductor workpiece. A plurality of magnetic material lines are formed over corresponding ones of the first plurality of conductive lines and a second plurality of conductive lines are formed over the semiconductor workpiece. The second plurality of conductive lines cross over the first conductive lines and the magnetic material lines. These second lines can be used as a mask to while the magnetic material lines are patterned.

대표청구항 ▼

1. A method of forming a magnetic memory device, the method comprising: forming a first plurality of conductive lines over a semiconductor workpiece; forming a plurality of magnetic material lines over corresponding ones of the first plurality of conductive lines; forming an insulating layer ov

1. A method of forming a magnetic memory device, the method comprising: forming a first plurality of conductive lines over a semiconductor workpiece; forming a plurality of magnetic material lines over corresponding ones of the first plurality of conductive lines; forming an insulating layer over the plurality of magnetic material lines; forming a plurality of trenches within the insulating layer, each trench exposing portions of the each of the plurality of magnetic material lines; forming a second plurality of conductive lines within the trenches, the second plurality of conductive lines crossing over the first plurality of conductive lines and the plurality of magnetic material lines; removing remaining portions of the insulating layer to expose portions of the plurality of magnetic material lines that are not underlying the second plurality of conductive lines; removing portions of the plurality of magnetic material lines using the second plurality of conductive lines as a mask; and forming a second insulating material within trenches between the second plurality of conductive lines. 2. The method of claim 1 wherein the first plurality of conductive lines comprises a plurality of copper lines. 3. The method of claim 1 wherein the plurality of magnetic material lines are formed from a material selected from the group consisting of PtMn, CoFe, Ru, Al2O3,NiFe, Ni, Co, and combinations thereof. 4. The method of claim 1 wherein forming a plurality of magnetic material lines comprises forming a layer of magnetic material and patterning and etching the layer of magnetic material, the method further comprising forming a hard mask layer over the layer of magnetic material and using the hard mask layer as a mask when patterning and etching the layer of magnetic material. 5. The method of claim 4 wherein the hard mask layer comprises a metallic layer. 6. The method of claim 5 wherein the hard mask layer is formed from a material that includes a metal selected from the group consisting of Ta, W, and Ti. 7. The method of claim 1 and further comprising forming a dielectric layer over the workpiece and between ones of the plurality of magnetic material lines prior to forming the second plurality of conductive lines. 8. The method of claim 1 and further comprising depositing a liner over the second plurality of conductive lines prior to forming the second insulating material. 9. The method of claim 1 wherein forming a second plurality of conductive lines comprises forming a second plurality of conductive lines that are orthogonal to the first plurality of conductive lines. 10. The method of claim 1 wherein forming a plurality of magnetic materials lines comprises: forming a magnetic material layer over the workpiece; forming a metallic hard mask over the magnetic material layer; patterning the metallic hard mask; etching portions of the magnetic material layer using the metallic hard mask as a mask; forming a dielectric layer over the workpiece; and performing a chemical-mechanical polish to planarize the dielectric layer, wherein the metallic hard mask serves as an etch stop for the chemical-mechanical polish. 11. The method of claim 10 wherein the metallic bard mask is patterned to expose portions of the magnetic material layer overlying the first plurality of conductive lines. 12. The method of claim 10 wherein the insulating layer is formed over the planarized dielectric layer. 13. The method of claim 10 wherein the magnetic material comprises a material selected from the group consisting of PtMn, CoFe, Ru, Al2O3,NiFe, Ni, Co, and combinations thereof. 14. The method of claim 10 wherein the metallic hard mask comprises a material that includes a metal selected from the group consisting of Ta, W, and Ti. 15. The method of claim 1 wherein the second conductive lines comprise copper and wherein forming a second insulating material includes depositing an oxide.