초록 ▼

An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection

An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip.

대표청구항 ▼

An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection

An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complementary channel communicating with the injection circuit. The injection circuit includes at least one injection cavity for housing the chip, at least one transfer chamber from which the encapsulation material is injected, and at least one injection channel connecting the transfer chamber to the injection cavity. The blind complementary channel is formed between the two parts of the mold and forms at least one appendage of encapsulation material that is connected to the encapsulation material that fills the injection circuit. Also provided is a method for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. atmosphere or combinations thereof for 1-6h. 2. The process as claimed in claim 1, wherein in steps e) and g) the quantitative flow rate is 50-500 ml/min and the gas atmosphere comprises H2S or CS2and Ar or N2as carrier gas, with 10-50% of H2S or CS2or mixtures thereof. 3. The process as claimed in claim 1, wherein in steps e) and g) the heating up to the reaction temperature takes place at 0.5-20 K/min. 4. The process as claimed in claim 1, wherein in steps e) and g) the cooling takes place at 0.5-20 K/min. 9. The luminescent material according to claim 8, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver and chlorine. 10. The luminescent material according to claim 8, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver and aluminium. 11. The luminescent material according to claim 8, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver, aluminium, and copper. 12. The luminescent material according to claim 8, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are copper and aluminium. 13. The luminescent material according to claim 8, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are copper, gold, and aluminium. 14. The luminescent material according to claim 8, wherein said oxysulfide is yttrium oxysulfide, and said luminescent center substance is europium. 15. A display substrate comprising a luminescent material manufactured by a manufacturing method comprising the steps of: adding a phosphor in the form of a solid solution comprising a sulfide or an oxysulfide, and a luminescent center substance incorporated in said sulfide or said oxysulfide, to an aqueous solution containing sodium silicate with stirring; adding the resulting aqueous solution to an aqueous solution of a barium slat with stirring, the barium salt reacting with the sodium silicate to form a glass gel that coats the phosphor; forcedly extracting particles of said phosphor from the resulting aqueous solution; and drying said particles of said phosphor extracted. 16. The display substrate according to claim 15, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver and chlorine. 17. The display substrate according to claim 15, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver and aluminium. 18. The display substrate according to claim 15, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are silver, aluminium, and copper. 19. The display substrate according to claim 15, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are copper and aluminium. 20. The display substrate according to claim 15, said phosphor comprising a plurality of said luminescent center substances, wherein said sulfide is zinc sulfide, and said luminescent center substances are copper, gold, and aluminium. 21. The display substrate according to claim 15, wherein said oxysulfide is yttrium oxysulfide, and said luminescent center substance is europium. 22. A display apparatus comprising a luminescent material manufactured by a manufacturing method comprising the steps of: adding a phosphor in the form of a solid solution comprising a sulfide or an oxysulfide, and a luminescent center substance incorporated in said sulfide or said oxysulfide, to an aqueous solution containing sodium silicate with stirring; adding the resulting aqueous solution to an aqueous solution of a barium salt with stirring, the barium slat reacting with the sodium silicate to form a glass gel that coats the phosphor; forcedly extracting particles of said phosphor, coated with said glass gel, from the resulting aqueous solution; and drying said particle