초록 ▼

A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an

A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an edge of the silver-containing buffer layer is exposed. A first plastic layer including at least one second hole is adhered to the transferred layer with a removable glue, wherein the second hole corresponds to the first hole, and part of the first plastic layer is located above the edge of the silver-containing buffer layer. The silver-containing buffer layer is oxidized to expand, thereby separating the silver-containing buffer layer from the transferred layer. A second plastic layer is adhered to the transferred layer. The removable glue is eliminated to remove the first plastic layer.

대표청구항 ▼

A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an

A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an edge of the silver-containing buffer layer is exposed. A first plastic layer including at least one second hole is adhered to the transferred layer with a removable glue, wherein the second hole corresponds to the first hole, and part of the first plastic layer is located above the edge of the silver-containing buffer layer. The silver-containing buffer layer is oxidized to expand, thereby separating the silver-containing buffer layer from the transferred layer. A second plastic layer is adhered to the transferred layer. The removable glue is eliminated to remove the first plastic layer. il, and connecting a second electrode disposed on a second surface of the optical semiconductor element to another of the defined portions of the conductive foil. 8. The manufacturing method of a lighting device of claim 1, further comprising connecting a first electrode and a second electrode each disposed on a surface of the optical semiconductor element to corresponding defined portions of the conductive foil, the corresponding defined portions not being the defined portion of the conductive foil receiving the optical semiconductor element. 9. The manufacturing method of lighting device of claim 1, wherein the conductive foil is made of copper, aluminum, nickel, iron or a composite film thereof. 10. The manufacturing method of lighting device of claim 5, wherein the conductive film comprises a plated film made of nickel, gold, palladium, aluminum or silver. 11. The manufacturing method of lighting device of claim 1, wherein the forming of the separation grooves comprises selectively etching the conductive foil either chemically or physically. 12. The manufacturing method of lighting device of claim 1, wherein the mounting of the light-emitting device on the metal substrate comprising using a robot with an arm movable horizontally and vertically.