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A cooling device having a high cooling efficiency in a miniature size that is neither influenced by gravity nor restricted in its position of installation. The device exchanges, transports and dissipates heat generated by a heat source. The device includes a coolant storing part for storing liquid c

A cooling device having a high cooling efficiency in a miniature size that is neither influenced by gravity nor restricted in its position of installation. The device exchanges, transports and dissipates heat generated by a heat source. The device includes a coolant storing part for storing liquid coolant, a heat absorbing part including at least one micro channel, the heat absorbing part is closely positioned to the heat generating source and connected to the coolant storing part. The liquid coolant is partly filled in the micro channel by surface tension and vaporized to become a gaseous coolant in the micro channel when heat is absorbed from the heat generating source. The device includes a heat insulating part positioned adjacent to the heat absorbing part to prevent the heat absorbed by the heat absorbing part from transferring to other zones. The device includes a condensing part for condensing the gaseous coolant. The condensing part is positioned apart from the heat absorbing part. The device includes a gas moving part positioned near the heat absorbing part and the condensing part, and the gas moving part includes a passage through which the gaseous coolant moves from the heat absorbing part to the condensing part. The device further includes a housing in which at least the heat absorbing part is housed.

대표청구항 ▼

A cooling device having a high cooling efficiency in a miniature size that is neither influenced by gravity nor restricted in its position of installation. The device exchanges, transports and dissipates heat generated by a heat source. The device includes a coolant storing part for storing liquid c

A cooling device having a high cooling efficiency in a miniature size that is neither influenced by gravity nor restricted in its position of installation. The device exchanges, transports and dissipates heat generated by a heat source. The device includes a coolant storing part for storing liquid coolant, a heat absorbing part including at least one micro channel, the heat absorbing part is closely positioned to the heat generating source and connected to the coolant storing part. The liquid coolant is partly filled in the micro channel by surface tension and vaporized to become a gaseous coolant in the micro channel when heat is absorbed from the heat generating source. The device includes a heat insulating part positioned adjacent to the heat absorbing part to prevent the heat absorbed by the heat absorbing part from transferring to other zones. The device includes a condensing part for condensing the gaseous coolant. The condensing part is positioned apart from the heat absorbing part. The device includes a gas moving part positioned near the heat absorbing part and the condensing part, and the gas moving part includes a passage through which the gaseous coolant moves from the heat absorbing part to the condensing part. The device further includes a housing in which at least the heat absorbing part is housed. of said at least two groups of heat dissipating fins are arranged so as to be at outer sides of said groups of heat dissipating fins. 6. The heat sink with fins as claimed in claim 5, wherein said integrally formed part of said at least two groups of heat dissipating fins and said metal base plate comprises an aluminum extrusion molding product. 7. The heat sink with fins as claimed in any one of claims 4 to 6, wherein each piece of said heat dissipating fins forming said groups of heat dissipating fins is arranged to locate so as to reduce difference of temperature both in said metal base plate and in said groups of heat dissipating fins. 8. The heat sink with fins as claimed in any one of claims 4 to 6, wherein a group of said groups of heat dissipating fins locating close to a portion of the metal plate on which a heat generating element is attached are made of copper. 9. The heat sink with fins as claimed in any one of claims 4 to 6, wherein said metal base plate is made of aluminum. 10. The heat sink with fins as claimed in any one of claims 4 to 6, wherein number of said heat dissipating fins made of copper is within a range from 25% to 75% in total number of said heat dissipating fins.